CH556080A - Verfahren zur herstellung einer platte fuer eine gasentladungs-anzeigevorrichtung. - Google Patents

Verfahren zur herstellung einer platte fuer eine gasentladungs-anzeigevorrichtung.

Info

Publication number
CH556080A
CH556080A CH1610073A CH1610073A CH556080A CH 556080 A CH556080 A CH 556080A CH 1610073 A CH1610073 A CH 1610073A CH 1610073 A CH1610073 A CH 1610073A CH 556080 A CH556080 A CH 556080A
Authority
CH
Switzerland
Prior art keywords
manufacturing
plate
display device
gas discharge
discharge display
Prior art date
Application number
CH1610073A
Other languages
German (de)
English (en)
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of CH556080A publication Critical patent/CH556080A/xx

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0286Programmable, customizable or modifiable circuits
    • H05K1/0287Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • H05K1/0289Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0306Inorganic insulating substrates, e.g. ceramic, glass
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0364Conductor shape
    • H05K2201/0376Flush conductors, i.e. flush with the surface of the printed circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09036Recesses or grooves in insulating substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0017Etching of the substrate by chemical or physical means
    • H05K3/002Etching of the substrate by chemical or physical means by liquid chemical etching
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H05K3/048Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H05K3/143Masks therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Gas-Filled Discharge Tubes (AREA)
  • Surface Treatment Of Glass (AREA)
CH1610073A 1972-11-30 1973-11-15 Verfahren zur herstellung einer platte fuer eine gasentladungs-anzeigevorrichtung. CH556080A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US311022A US3926763A (en) 1972-11-30 1972-11-30 Method for fabricating a gas discharge panel structure

Publications (1)

Publication Number Publication Date
CH556080A true CH556080A (de) 1974-11-15

Family

ID=23205046

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1610073A CH556080A (de) 1972-11-30 1973-11-15 Verfahren zur herstellung einer platte fuer eine gasentladungs-anzeigevorrichtung.

Country Status (12)

Country Link
US (1) US3926763A (xx)
JP (1) JPS4988473A (xx)
AR (1) AR198440A1 (xx)
BR (1) BR7309375D0 (xx)
CA (1) CA992131A (xx)
CH (1) CH556080A (xx)
DE (1) DE2358816A1 (xx)
ES (1) ES420963A1 (xx)
FR (1) FR2209208B1 (xx)
GB (1) GB1439080A (xx)
IT (1) IT1006105B (xx)
NL (1) NL7314652A (xx)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4392362A (en) * 1979-03-23 1983-07-12 The Board Of Trustees Of The Leland Stanford Junior University Micro miniature refrigerators
JPS57118348A (en) * 1981-01-13 1982-07-23 Sony Corp Electric-discharge displayer
US4386505A (en) * 1981-05-01 1983-06-07 The Board Of Trustees Of The Leland Stanford Junior University Refrigerators
DE3215396A1 (de) * 1981-05-01 1983-01-27 William A. Palo Alto Calif. Little Nikro-miniatur-kuehlvorrichtung und verfahren zu ihrer herstellung
EP0128196A4 (en) * 1982-12-01 1985-06-26 William A Little MINIATURE FAST COOLING MACHINES.
US4489570A (en) * 1982-12-01 1984-12-25 The Board Of Trustees Of The Leland Stanford Junior University Fast cooldown miniature refrigerators
US4740266A (en) * 1985-07-01 1988-04-26 Wu Jiun Tsong Method of making memory devices
US4781789A (en) * 1985-07-01 1988-11-01 Wu Jiun Tsong Method of making memory devices
US4781790A (en) * 1985-07-01 1988-11-01 Wu Jiun Tsong Method of making memory devices
US4783236A (en) * 1985-07-01 1988-11-08 Wu Jiun Tsong Method of making memory devices
US4795528A (en) * 1985-07-01 1989-01-03 Wu Jiun Tsong Method of making memory devices
US5853446A (en) * 1996-04-16 1998-12-29 Corning Incorporated Method for forming glass rib structures
US5792509A (en) * 1997-02-07 1998-08-11 Industrial Technology Research Institute Phosphor particle with antireflection coating
US6540576B1 (en) * 1997-10-16 2003-04-01 Matsushita Electric Industrial Co., Ltd. Plasma display panel and method of manufacturing the same
JP2001015038A (ja) * 1999-06-30 2001-01-19 Fujitsu Ltd プラズマディスプレィパネル
KR100696635B1 (ko) 2005-10-13 2007-03-19 삼성에스디아이 주식회사 플라즈마 디스플레이 패널 및 이의 제조방법
US8278679B2 (en) * 2008-04-29 2012-10-02 Tsmc Solid State Lighting Ltd. LED device with embedded top electrode
US8896521B2 (en) 2012-04-24 2014-11-25 Qualcomm Mems Technologies, Inc. Metal-insulator-metal capacitors on glass substrates
DE102019126908A1 (de) * 2019-10-08 2021-04-08 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Herstellung von funktionellen Gegenständen, funktioneller Gegenstand
CN112533395B (zh) * 2020-12-21 2021-12-24 北京同方信息安全技术股份有限公司 印制电路板中埋入电阻的方法及其印制电路板

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2217334A (en) * 1937-12-30 1940-10-08 Bell Telephone Labor Inc Screen for electro-optical device and method of preparing it
US3042591A (en) * 1957-05-20 1962-07-03 Motorola Inc Process for forming electrical conductors on insulating bases
US3432417A (en) * 1966-05-31 1969-03-11 Ibm Low power density sputtering on semiconductors
GB1247372A (en) * 1967-10-18 1971-09-22 Burroughs Corp Display panel
US3746420A (en) * 1967-11-24 1973-07-17 Owens Illinois Inc Manufacture and operation of gas discharge panel
CA930845A (en) * 1970-02-05 1973-07-24 F. Schaufele Robert Visual data conversion and storage systems
US3716742A (en) * 1970-03-03 1973-02-13 Fujitsu Ltd Display device utilization gas discharge
NL7003971A (xx) * 1970-03-20 1971-09-22

Also Published As

Publication number Publication date
CA992131A (en) 1976-06-29
IT1006105B (it) 1976-09-30
FR2209208A1 (xx) 1974-06-28
ES420963A1 (es) 1976-05-16
US3926763A (en) 1975-12-16
AR198440A1 (es) 1974-06-21
GB1439080A (en) 1976-06-09
DE2358816A1 (de) 1974-06-12
JPS4988473A (xx) 1974-08-23
NL7314652A (xx) 1974-06-04
FR2209208B1 (xx) 1978-02-24
BR7309375D0 (pt) 1974-09-05

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Legal Events

Date Code Title Description
PL Patent ceased