CH546480A - Einrichtung zur absorption thermischer impulse. - Google Patents

Einrichtung zur absorption thermischer impulse.

Info

Publication number
CH546480A
CH546480A CH546480DA CH546480A CH 546480 A CH546480 A CH 546480A CH 546480D A CH546480D A CH 546480DA CH 546480 A CH546480 A CH 546480A
Authority
CH
Switzerland
Prior art keywords
absorption
thermal impulses
impulses
thermal
Prior art date
Application number
Other languages
English (en)
Original Assignee
Bbc Brown Boveri & Cie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bbc Brown Boveri & Cie filed Critical Bbc Brown Boveri & Cie
Publication of CH546480A publication Critical patent/CH546480A/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CH546480D 1972-06-08 1972-06-08 Einrichtung zur absorption thermischer impulse. CH546480A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH843772 1972-06-08

Publications (1)

Publication Number Publication Date
CH546480A true CH546480A (de) 1974-02-28

Family

ID=4340332

Family Applications (1)

Application Number Title Priority Date Filing Date
CH546480D CH546480A (de) 1972-06-08 1972-06-08 Einrichtung zur absorption thermischer impulse.

Country Status (2)

Country Link
CH (1) CH546480A (de)
DE (1) DE2231282A1 (de)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2540278A1 (fr) * 1983-02-02 1984-08-03 Thomson Csf Dispositif de stockage d'energie thermique
EP0461544A1 (de) * 1990-06-15 1991-12-18 Battelle-Institut e.V. Wärmeableitungseinrichtung und Verfahren zu deren Herstellung
DE19932441A1 (de) * 1999-07-12 2001-01-25 Siemens Ag Vorrichtung zur Entwärmung von Halbleiterbauelementen beim Auftreten von Belastungsspitzen
DE10347518A1 (de) * 2003-10-13 2005-05-25 Siemens Ag Elektronisches Bauelement, Schaltungsträgeraufbau und Elektronikeinheit mit Wärmespeicher
WO2018133942A1 (de) * 2017-01-20 2018-07-26 Siemens Aktiengesellschaft Kühlplatte

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4233645A (en) * 1978-10-02 1980-11-11 International Business Machines Corporation Semiconductor package with improved conduction cooling structure
US4396936A (en) * 1980-12-29 1983-08-02 Honeywell Information Systems, Inc. Integrated circuit chip package with improved cooling means
JPH03257871A (ja) * 1990-03-07 1991-11-18 Mitsubishi Electric Corp パターン形成方法および半導体装置の製造方法

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2540278A1 (fr) * 1983-02-02 1984-08-03 Thomson Csf Dispositif de stockage d'energie thermique
EP0116503A1 (de) * 1983-02-02 1984-08-22 Thomson-Csf Wärmeaufnahmevorrichtung und Verfahren zu deren Herstellung
EP0461544A1 (de) * 1990-06-15 1991-12-18 Battelle-Institut e.V. Wärmeableitungseinrichtung und Verfahren zu deren Herstellung
DE4019091A1 (de) * 1990-06-15 1991-12-19 Battelle Institut E V Waermeableitungseinrichtung fuer halbleiterbauelemente und verfahren zu deren herstellung
US5223747A (en) * 1990-06-15 1993-06-29 Battelle-Institut E.V. Heat dissipating device
DE19932441A1 (de) * 1999-07-12 2001-01-25 Siemens Ag Vorrichtung zur Entwärmung von Halbleiterbauelementen beim Auftreten von Belastungsspitzen
DE10347518A1 (de) * 2003-10-13 2005-05-25 Siemens Ag Elektronisches Bauelement, Schaltungsträgeraufbau und Elektronikeinheit mit Wärmespeicher
WO2018133942A1 (de) * 2017-01-20 2018-07-26 Siemens Aktiengesellschaft Kühlplatte

Also Published As

Publication number Publication date
DE2231282A1 (de) 1973-12-20

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Legal Events

Date Code Title Description
PL Patent ceased