CH546480A - DEVICE FOR THE ABSORPTION OF THERMAL IMPULSES. - Google Patents
DEVICE FOR THE ABSORPTION OF THERMAL IMPULSES.Info
- Publication number
- CH546480A CH546480A CH546480DA CH546480A CH 546480 A CH546480 A CH 546480A CH 546480D A CH546480D A CH 546480DA CH 546480 A CH546480 A CH 546480A
- Authority
- CH
- Switzerland
- Prior art keywords
- absorption
- thermal impulses
- impulses
- thermal
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
- H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH843772 | 1972-06-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
CH546480A true CH546480A (en) | 1974-02-28 |
Family
ID=4340332
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH546480D CH546480A (en) | 1972-06-08 | 1972-06-08 | DEVICE FOR THE ABSORPTION OF THERMAL IMPULSES. |
Country Status (2)
Country | Link |
---|---|
CH (1) | CH546480A (en) |
DE (1) | DE2231282A1 (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2540278A1 (en) * | 1983-02-02 | 1984-08-03 | Thomson Csf | THERMAL ENERGY STORAGE DEVICE |
EP0461544A1 (en) * | 1990-06-15 | 1991-12-18 | Battelle-Institut e.V. | Heat dissipation device and method of fabricating same |
DE19932441A1 (en) * | 1999-07-12 | 2001-01-25 | Siemens Ag | Device for cooling semiconductor components when load peaks occur |
DE10347518A1 (en) * | 2003-10-13 | 2005-05-25 | Siemens Ag | Electronic component, circuit carrier assembly and electronic unit with heat accumulator |
WO2018133942A1 (en) * | 2017-01-20 | 2018-07-26 | Siemens Aktiengesellschaft | Cooling plate |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4233645A (en) * | 1978-10-02 | 1980-11-11 | International Business Machines Corporation | Semiconductor package with improved conduction cooling structure |
US4396936A (en) * | 1980-12-29 | 1983-08-02 | Honeywell Information Systems, Inc. | Integrated circuit chip package with improved cooling means |
JPH03257871A (en) * | 1990-03-07 | 1991-11-18 | Mitsubishi Electric Corp | Method of pattern formation and manufacture of semiconductor device |
-
1972
- 1972-06-08 CH CH546480D patent/CH546480A/en not_active IP Right Cessation
- 1972-06-26 DE DE19722231282 patent/DE2231282A1/en active Pending
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2540278A1 (en) * | 1983-02-02 | 1984-08-03 | Thomson Csf | THERMAL ENERGY STORAGE DEVICE |
EP0116503A1 (en) * | 1983-02-02 | 1984-08-22 | Thomson-Csf | Procedure for constructing a thermal-energy storage device and device so constructed |
EP0461544A1 (en) * | 1990-06-15 | 1991-12-18 | Battelle-Institut e.V. | Heat dissipation device and method of fabricating same |
DE4019091A1 (en) * | 1990-06-15 | 1991-12-19 | Battelle Institut E V | HEAT DISCHARGE DEVICE FOR SEMICONDUCTOR COMPONENTS AND METHOD FOR THE PRODUCTION THEREOF |
US5223747A (en) * | 1990-06-15 | 1993-06-29 | Battelle-Institut E.V. | Heat dissipating device |
DE19932441A1 (en) * | 1999-07-12 | 2001-01-25 | Siemens Ag | Device for cooling semiconductor components when load peaks occur |
DE10347518A1 (en) * | 2003-10-13 | 2005-05-25 | Siemens Ag | Electronic component, circuit carrier assembly and electronic unit with heat accumulator |
WO2018133942A1 (en) * | 2017-01-20 | 2018-07-26 | Siemens Aktiengesellschaft | Cooling plate |
Also Published As
Publication number | Publication date |
---|---|
DE2231282A1 (en) | 1973-12-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PL | Patent ceased |