CH530092A - Einrichtung zur Kühlung von Leistungs-Halbleiterbauelementen - Google Patents

Einrichtung zur Kühlung von Leistungs-Halbleiterbauelementen

Info

Publication number
CH530092A
CH530092A CH202072A CH202072A CH530092A CH 530092 A CH530092 A CH 530092A CH 202072 A CH202072 A CH 202072A CH 202072 A CH202072 A CH 202072A CH 530092 A CH530092 A CH 530092A
Authority
CH
Switzerland
Prior art keywords
power semiconductor
semiconductor components
cooling power
cooling
components
Prior art date
Application number
CH202072A
Other languages
German (de)
English (en)
Inventor
Gregor Dipl Phys Gammel
Heidtmann Uwe
Elmar Dipl Ing Mueller
Original Assignee
Bbc Brown Boveri & Cie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bbc Brown Boveri & Cie filed Critical Bbc Brown Boveri & Cie
Publication of CH530092A publication Critical patent/CH530092A/de

Links

Classifications

    • H10W40/73—
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CH202072A 1971-02-13 1972-02-14 Einrichtung zur Kühlung von Leistungs-Halbleiterbauelementen CH530092A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19712107010 DE2107010A1 (de) 1971-02-13 1971-02-13 Einrichtung zur Kühlung von Leistungs-Halbleiterbauelementen

Publications (1)

Publication Number Publication Date
CH530092A true CH530092A (de) 1972-10-31

Family

ID=5798757

Family Applications (1)

Application Number Title Priority Date Filing Date
CH202072A CH530092A (de) 1971-02-13 1972-02-14 Einrichtung zur Kühlung von Leistungs-Halbleiterbauelementen

Country Status (3)

Country Link
CH (1) CH530092A (enExample)
DE (1) DE2107010A1 (enExample)
FR (1) FR2125379B1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5168919A (en) * 1990-06-29 1992-12-08 Digital Equipment Corporation Air cooled heat exchanger for multi-chip assemblies
US5198889A (en) * 1990-06-30 1993-03-30 Kabushiki Kaisha Toshiba Cooling apparatus

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1406481A (fr) * 1964-01-16 1965-07-23 Materiel Electrique S W Le Dispositif de refroidissement d'au moins un boîtier contenant un élément semiconducteur

Also Published As

Publication number Publication date
FR2125379B1 (enExample) 1975-10-24
FR2125379A1 (enExample) 1972-09-29
DE2107010A1 (de) 1972-08-17

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Legal Events

Date Code Title Description
PL Patent ceased