CH527918A - Composition et procédé pour dissoudre le cuivre - Google Patents

Composition et procédé pour dissoudre le cuivre

Info

Publication number
CH527918A
CH527918A CH1079871A CH1079871A CH527918A CH 527918 A CH527918 A CH 527918A CH 1079871 A CH1079871 A CH 1079871A CH 1079871 A CH1079871 A CH 1079871A CH 527918 A CH527918 A CH 527918A
Authority
CH
Switzerland
Prior art keywords
composition
dissolving copper
dissolving
copper
Prior art date
Application number
CH1079871A
Other languages
English (en)
Inventor
Jerome Siegmund Arthur
J Slominski Leo
Landau Adela
Original Assignee
Macdermid Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Macdermid Inc filed Critical Macdermid Inc
Publication of CH527918A publication Critical patent/CH527918A/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/32—Alkaline compositions
    • C23F1/34—Alkaline compositions for etching copper or alloys thereof
CH1079871A 1970-09-24 1971-07-22 Composition et procédé pour dissoudre le cuivre CH527918A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US7510670A 1970-09-24 1970-09-24

Publications (1)

Publication Number Publication Date
CH527918A true CH527918A (fr) 1972-09-15

Family

ID=22123583

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1079871A CH527918A (fr) 1970-09-24 1971-07-22 Composition et procédé pour dissoudre le cuivre

Country Status (6)

Country Link
BE (1) BE771033A (fr)
CH (1) CH527918A (fr)
DE (1) DE2144463A1 (fr)
FR (1) FR2107916A1 (fr)
IT (1) IT948523B (fr)
NL (1) NL7112888A (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8273464B2 (en) * 2006-10-16 2012-09-25 Taisei Plas Co., Ltd. Metal and resin composite and method for manufacturing same

Also Published As

Publication number Publication date
FR2107916B1 (fr) 1975-02-07
FR2107916A1 (en) 1972-05-12
IT948523B (it) 1973-06-11
NL7112888A (fr) 1972-03-28
BE771033A (fr) 1971-12-16
DE2144463A1 (de) 1972-03-30

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Legal Events

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PL Patent ceased