CH527918A - Composition and method for dissolving copper - Google Patents

Composition and method for dissolving copper

Info

Publication number
CH527918A
CH527918A CH1079871A CH1079871A CH527918A CH 527918 A CH527918 A CH 527918A CH 1079871 A CH1079871 A CH 1079871A CH 1079871 A CH1079871 A CH 1079871A CH 527918 A CH527918 A CH 527918A
Authority
CH
Switzerland
Prior art keywords
composition
dissolving copper
dissolving
copper
Prior art date
Application number
CH1079871A
Other languages
French (fr)
Inventor
Jerome Siegmund Arthur
J Slominski Leo
Landau Adela
Original Assignee
Macdermid Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Macdermid Inc filed Critical Macdermid Inc
Publication of CH527918A publication Critical patent/CH527918A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/32—Alkaline compositions
    • C23F1/34—Alkaline compositions for etching copper or alloys thereof

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
CH1079871A 1970-09-24 1971-07-22 Composition and method for dissolving copper CH527918A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US7510670A 1970-09-24 1970-09-24

Publications (1)

Publication Number Publication Date
CH527918A true CH527918A (en) 1972-09-15

Family

ID=22123583

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1079871A CH527918A (en) 1970-09-24 1971-07-22 Composition and method for dissolving copper

Country Status (6)

Country Link
BE (1) BE771033A (en)
CH (1) CH527918A (en)
DE (1) DE2144463A1 (en)
FR (1) FR2107916A1 (en)
IT (1) IT948523B (en)
NL (1) NL7112888A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101188027B1 (en) * 2006-10-16 2012-10-04 다이세이 플라스 가부시끼가이샤 Composite of metal with resin and process for producing the same

Also Published As

Publication number Publication date
FR2107916B1 (en) 1975-02-07
IT948523B (en) 1973-06-11
NL7112888A (en) 1972-03-28
FR2107916A1 (en) 1972-05-12
DE2144463A1 (en) 1972-03-30
BE771033A (en) 1971-12-16

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Legal Events

Date Code Title Description
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