CH511262A - Verfahren zum Härten von Polyepoxiden - Google Patents

Verfahren zum Härten von Polyepoxiden

Info

Publication number
CH511262A
CH511262A CH315569A CH315569A CH511262A CH 511262 A CH511262 A CH 511262A CH 315569 A CH315569 A CH 315569A CH 315569 A CH315569 A CH 315569A CH 511262 A CH511262 A CH 511262A
Authority
CH
Switzerland
Prior art keywords
curing polyepoxides
polyepoxides
curing
Prior art date
Application number
CH315569A
Other languages
English (en)
Inventor
Joseph Klaren Corneli Hubertus
Krak Hans
Jeanno Francis
Original Assignee
Shell Int Research
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shell Int Research filed Critical Shell Int Research
Publication of CH511262A publication Critical patent/CH511262A/de

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D235/00Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, condensed with other rings
    • C07D235/02Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, condensed with other rings condensed with carbocyclic rings or ring systems
    • C07D235/04Benzimidazoles; Hydrogenated benzimidazoles
    • C07D235/06Benzimidazoles; Hydrogenated benzimidazoles with only hydrogen atoms, hydrocarbon or substituted hydrocarbon radicals, directly attached in position 2
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D231/00Heterocyclic compounds containing 1,2-diazole or hydrogenated 1,2-diazole rings
    • C07D231/02Heterocyclic compounds containing 1,2-diazole or hydrogenated 1,2-diazole rings not condensed with other rings
    • C07D231/10Heterocyclic compounds containing 1,2-diazole or hydrogenated 1,2-diazole rings not condensed with other rings having two or three double bonds between ring members or between ring members and non-ring members
    • C07D231/12Heterocyclic compounds containing 1,2-diazole or hydrogenated 1,2-diazole rings not condensed with other rings having two or three double bonds between ring members or between ring members and non-ring members with only hydrogen atoms, hydrocarbon or substituted hydrocarbon radicals, directly attached to ring carbon atoms
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D233/00Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings
    • C07D233/54Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members
    • C07D233/56Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members with only hydrogen atoms or radicals containing only hydrogen and carbon atoms, attached to ring carbon atoms
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D235/00Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, condensed with other rings
    • C07D235/02Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, condensed with other rings condensed with carbocyclic rings or ring systems
    • C07D235/04Benzimidazoles; Hydrogenated benzimidazoles
    • C07D235/06Benzimidazoles; Hydrogenated benzimidazoles with only hydrogen atoms, hydrocarbon or substituted hydrocarbon radicals, directly attached in position 2
    • C07D235/08Radicals containing only hydrogen and carbon atoms
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D235/00Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, condensed with other rings
    • C07D235/02Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, condensed with other rings condensed with carbocyclic rings or ring systems
    • C07D235/04Benzimidazoles; Hydrogenated benzimidazoles
    • C07D235/24Benzimidazoles; Hydrogenated benzimidazoles with hetero atoms or with carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals, directly attached in position 2
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D249/00Heterocyclic compounds containing five-membered rings having three nitrogen atoms as the only ring hetero atoms
    • C07D249/02Heterocyclic compounds containing five-membered rings having three nitrogen atoms as the only ring hetero atoms not condensed with other rings
    • C07D249/081,2,4-Triazoles; Hydrogenated 1,2,4-triazoles
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • C08G59/184Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with amines
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50Amines
    • C08G59/5093Complexes of amines
CH315569A 1968-03-04 1969-03-03 Verfahren zum Härten von Polyepoxiden CH511262A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR142222 1968-03-04

Publications (1)

Publication Number Publication Date
CH511262A true CH511262A (de) 1971-08-15

Family

ID=8646919

Family Applications (1)

Application Number Title Priority Date Filing Date
CH315569A CH511262A (de) 1968-03-04 1969-03-03 Verfahren zum Härten von Polyepoxiden

Country Status (11)

Country Link
US (1) US3756984A (de)
JP (1) JPS515040B1 (de)
BE (1) BE729277A (de)
CH (1) CH511262A (de)
DE (1) DE1910758C3 (de)
DK (1) DK121066B (de)
FR (1) FR1566468A (de)
GB (1) GB1215683A (de)
NL (1) NL140884B (de)
NO (1) NO131510C (de)
SE (1) SE376621B (de)

Families Citing this family (68)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4066625A (en) * 1967-05-02 1978-01-03 Amicon Corporation Unitary curable resin compositions
US3923571A (en) * 1970-12-27 1975-12-02 Nissan Motor Method of using an epoxy-resin-imidazole solder mixture
US3914165A (en) * 1972-09-18 1975-10-21 Desoto Inc Radiation curable non-gelled michael addition reaction products
JPS5058501A (de) * 1973-09-19 1975-05-21
US4073776A (en) * 1975-01-28 1978-02-14 Schenectady Chemicals, Inc. Tackifiers for elastomers
US4101515A (en) * 1975-03-20 1978-07-18 Texaco Development Corp. 2,2-Dialkylepoxides
JPS52139430U (de) * 1976-04-16 1977-10-22
JPS607652B2 (ja) * 1976-06-12 1985-02-26 三菱油化株式会社 陰イオン交換体の製造法
US4191677A (en) * 1977-10-21 1980-03-04 Federal Screw Works Self-locking threaded fastener product
US4176142A (en) * 1978-05-22 1979-11-27 Western Electric Company, Inc. Powder coating composition
CA1151182A (en) * 1979-08-10 1983-08-02 Marvin L. Kaufman Chemically modified imidazole curing catalysts for epoxy resins and powder coatings containing them
US4268656A (en) * 1980-01-16 1981-05-19 National Starch And Chemical Corporation Co-curing agents for epoxy resins
US4359370A (en) * 1980-11-24 1982-11-16 Shell Oil Company Curable epoxy-vinyl ester compositions
CA1183643A (en) * 1980-12-31 1985-03-05 Marvin L. Kaufman Coating compositions having dual curing mechanisms
US4420605A (en) 1980-12-31 1983-12-13 Mobil Oil Corporation Coating compositions having dual curing mechanisms
US4358571A (en) 1981-03-10 1982-11-09 Mobil Oil Corporation Chemically modified imidazole curing catalysts for epoxy resin and powder coatings containing them
US4330644A (en) * 1981-04-03 1982-05-18 Shell Oil Company Curable tris(hydroxyalkyl) aminomethane-modified epoxy resin composition
US4428987A (en) 1982-04-28 1984-01-31 Shell Oil Company Process for improving copper-epoxy adhesion
US4448847A (en) * 1982-05-28 1984-05-15 Shell Oil Company Process for improving steel-epoxy adhesion
US4393181A (en) * 1982-06-30 1983-07-12 Shell Oil Company Polyfunctional phenolic-melamine epoxy resin curing agents
CA1227900A (en) * 1982-08-16 1987-10-06 Grace (W.R.) & Co. Phosphine compounds as curing accelerators for amides in epoxy resin systems
GB8304581D0 (en) * 1983-02-18 1983-03-23 Secr Defence Curing agents for epoxy resins
JPS59190972A (ja) * 1983-04-14 1984-10-29 Shikoku Chem Corp 4,4′−メチレン−ビス−(2−エチル−5−メチルイミダゾ−ル)、該化合物の製造方法及び該化合物を用いてポリエポキシ化合物を硬化ないし硬化促進させる方法
GB8403823D0 (en) * 1984-02-14 1984-03-21 Raychem Ltd Adhesive composition
DE3700287A1 (de) * 1986-01-10 1987-07-16 Hitachi Chemical Co Ltd Epoxyharz-zusammensetzung fuer kupfer-plattierte laminate
US5001212A (en) * 1988-06-28 1991-03-19 Skw Trostberg Aktiengesellschaft Additive for heat-hardenable epoxide resin masses
US4925886A (en) * 1989-01-23 1990-05-15 General Motors Corporation High temperature epoxy tooling composition of bifunctional epoxy, trifunctional epoxy, anhydride, imidazole and interstitially matched filler
IE891601L (en) * 1989-05-18 1990-11-18 Loctite Ireland Ltd Latent hardeners for epoxy resin compositions
US5155182A (en) * 1989-09-14 1992-10-13 Schering Ag Imidazolyl derivatives, their use as curing agents in epoxy-resin compositions, and curable epoxy-resin compositions and molded epoxy-resin articles incorporating said imidazolyl derivatives
US5175220A (en) * 1990-04-02 1992-12-29 Schering Ag Imidazolyl derivatives, their use as curing agents in epoxy-resin compositions, and curable epoxy-resin compositions and molded epoxy-resin articles incorporating said imidazolyl derivatives
DE4010548A1 (de) * 1990-04-02 1991-10-10 Schering Ag Imidazolylderivate, ihre verwendung als haertungsmittel in epoxidharzzusammensetzungen, sie enthaltende haertbare epoxidharzzusammensetzungen und epoxidharzformkoerper
US5548058A (en) * 1990-05-28 1996-08-20 W. R. Grace & Co.-Conn. Spherical curing agent for epoxy resin, curing agent masterbatch for epoxy resin and their preparation
JP3092249B2 (ja) * 1991-10-11 2000-09-25 味の素株式会社 酸無水物系一液性エポキシ樹脂組成物
KR930010077A (ko) * 1991-11-22 1993-06-22 알베르투스 빌헬무스 요 아네스 째스트 라텐 에폭시 이미다졸 첨가물 및 에폭시 수지 조성물
US5554714A (en) * 1993-02-18 1996-09-10 W. R. Grace & Co.-Conn. Spherical curing agent for epoxy resin, curing agent masterbatch for epoxy resin and their preparation.
US5733954A (en) * 1995-12-14 1998-03-31 Minnesota Mining And Manufacturing Company Epoxy resin curing agent made via aqueous dispersion of an epoxide and an imidazole
US5717011A (en) * 1995-12-14 1998-02-10 Minnesota Mining And Manufacturing Company Curing agent compositions and a method of making
US6218483B1 (en) * 1996-05-06 2001-04-17 Rohm And Haas Company Powder coating of epoxy resin, imidazole-epoxy resin catalyst or polyamine, polyamine powder and amine scavenger
JPH1030015A (ja) * 1996-07-15 1998-02-03 Kansai Paint Co Ltd エポキシ樹脂用硬化触媒及びそれを用いてなる熱硬化性塗料組成物
ATE198212T1 (de) * 1997-10-02 2001-01-15 Hexcel Corp Epoxidharzhärter
US6890999B2 (en) * 1997-11-04 2005-05-10 Rohm And Haas Company Coating powder of epoxy resin and low temperature curing agent
US6703070B1 (en) * 1997-11-04 2004-03-09 Morton International, Inc. One-component, low temperature curable coating powder
ZA991856B (en) 1998-08-27 1999-09-22 Henkel Corp Storage-stable compositions useful for the production of structural foams.
US6376564B1 (en) 1998-08-27 2002-04-23 Henkel Corporation Storage-stable compositions useful for the production of structural foams
US6103784A (en) 1998-08-27 2000-08-15 Henkel Corporation Corrosion resistant structural foam
USH2047H1 (en) 1999-11-10 2002-09-03 Henkel Corporation Reinforcement laminate
US20030018095A1 (en) * 2001-04-27 2003-01-23 Agarwal Rajat K. Thermosettable compositions useful for producing structural adhesive foams
US6492437B1 (en) 2001-06-21 2002-12-10 National Starch And Chemical Investment Holding Corporation Solvent-based process for manufacturing latent curing catalysts
WO2003054069A1 (en) 2001-12-21 2003-07-03 Henkel Teroson Gmbh Expandable epoxy resin-based systems modified with thermoplastic polymers
US20040258922A1 (en) * 2003-06-20 2004-12-23 Willett Peggy S. Water-based adhesive compositions with polyamine curative and binder
EP1506975A1 (de) 2003-08-13 2005-02-16 Vantico GmbH Nanoverbundwerkstoffe enthaltend polyurethan oder polyurethan-epoxy Hybridharze hergestellt ohne Verwendung von Isocyanaten
DE102005024255A1 (de) * 2005-05-27 2006-11-30 Henkel Kgaa Imidazol-Salze, Verfahren zu ihrer Herstellung, ihre Verwendung und diese Salze enthaltende Epoxidharze
DK200500840A (da) * 2005-06-09 2006-12-10 Banke Stefan Ovesen Raman minispektrometer tilpasset SSRS metode
US8288447B2 (en) * 2006-06-07 2012-10-16 Henkel Ag & Co. Kgaa Foamable compositions based on epoxy resins and polyesters
WO2008034755A1 (de) * 2006-09-20 2008-03-27 Henkel Ag & Co. Kgaa Solid expandable compositions
DE102006050697A1 (de) * 2006-10-24 2008-04-30 Henkel Kgaa Duktile Strukturschäume
JP5420212B2 (ja) * 2007-10-31 2014-02-19 アクゾ ノーベル コーティングス インターナショナル ビー ヴィ スチール用耐薄チップパウダートップコート
PL2240544T3 (pl) * 2008-01-25 2017-06-30 Akzo Nobel Coatings International B.V. Proszkowe kompozycje powłokowe posiadające podkład zasadniczo nie zawierający cynku
BRPI0907275A2 (pt) * 2008-04-14 2015-07-21 Dow Global Technologies Inc Processo para formar um catalisador de epóxi-imidazol sólido, catalisador de epóxi-imidazol sólido, composição curável, processo para formar uma composição curável e processo para formar uma composição termofixa
PT2565240E (pt) * 2009-04-03 2014-12-22 Akzo Nobel Coatings Int Bv Revestimento em pó resistente à corrosão e lascagem
JP5757944B2 (ja) 2009-07-29 2015-08-05 アクゾ ノーベル コーティングス インターナショナル ビー ヴィ 実質的に亜鉛非含有のプライマーを有することが可能な粉末コーティング組成物
US20110220512A1 (en) * 2010-03-15 2011-09-15 Rohm And Haas Electronic Materials Llc Plating bath and method
US8262895B2 (en) * 2010-03-15 2012-09-11 Rohm And Haas Electronic Materials Llc Plating bath and method
US8268157B2 (en) * 2010-03-15 2012-09-18 Rohm And Haas Electronic Materials Llc Plating bath and method
US20140150970A1 (en) 2010-11-19 2014-06-05 Ppg Industries Ohio, Inc. Structural adhesive compositions
DE102016203867A1 (de) * 2016-03-09 2017-09-14 Siemens Aktiengesellschaft Fester Isolationswerkstoff, Verwendung dazu und damit hergestelltes Isolationssystem
CN113121794B (zh) * 2019-12-31 2022-05-20 惠州盛世达科技有限公司 一种二甲基咪唑的液化方法
CN115160229A (zh) * 2022-05-31 2022-10-11 上海大学 一种改性咪唑潜伏性环氧树脂固化剂及其制备方法

Also Published As

Publication number Publication date
BE729277A (de) 1969-09-03
DK121066B (da) 1971-08-30
NO131510B (de) 1975-03-03
GB1215683A (en) 1970-12-16
SE376621B (de) 1975-06-02
JPS515040B1 (de) 1976-02-17
NO131510C (de) 1975-06-11
DE1910758A1 (de) 1969-10-09
US3756984A (en) 1973-09-04
NL140884B (nl) 1974-01-15
FR1566468A (de) 1969-05-09
DE1910758C3 (de) 1975-04-03
DE1910758B2 (de) 1974-07-25
NL6903243A (de) 1969-09-08

Similar Documents

Publication Publication Date Title
CH511262A (de) Verfahren zum Härten von Polyepoxiden
CH468886A (de) Verfahren zum Beschichten von Holzwerkstoffen
CH432855A (de) Verfahren zum Härten von Polyepoxyden
CH432854A (de) Verfahren zum Härten von Polyepoxyden
CH556882A (de) Verfahren zum haerten von epoxiden.
DE1963578B2 (de) Verfahren zum kontaktlosen belichten
AT316956B (de) Verfahren zum Metallisieren von Kunststoffoberflächen
AT314701B (de) Verfahren zum Härten von Polyacrylaten mit ionisierenden Strahlen
CH445121A (de) Verfahren zum Herstellen von Polylaurinlactam
CH453687A (de) Verfahren zum Härten von Polyepoxyden
CH515292A (de) Verfahren zum Polymerisieren von Oxazolinen
CH515952A (de) Verfahren zum Härten von Expoxydharzen
AT255136B (de) Verfahren zum Härten von Epoxydverbindungen mit tertiären Aminen
CH508682A (de) Verfahren zum Härten von Epoxyverbindungen
CH476053A (de) Verfahren zum Härten von Epoxydverbindungen
AT255770B (de) Verfahren zum Härten von Epoxydverbindungen mit tertiären Aminen
CH476782A (de) Verfahren zum Polymerisieren von B-Lactonen
CH514643A (de) Verfahren zum Herstellen von modifizierten Polyamiden
CH470201A (de) Verfahren zum Herstellen von Kristallen
AT252859B (de) Verfahren zum Signieren von Fasermaterial
CH527239A (de) Verfahren zum Härten von Epoxidharzen
CH517861A (de) Verfahren zum Anfärben von Polyamid-Formkörpern
CH480390A (de) Verfahren zum Härten von Epoxydverbindungen
AT271021B (de) Verfahren zum Aushärten von Polyepoxyden mit aromatischen Polyaminen
CH512543A (de) Verfahren zum Härten von Epoxydverbindungen

Legal Events

Date Code Title Description
PL Patent ceased