CH506230A - Biegsame Isolierfolie mit einem Muster von Leiterbahnen - Google Patents

Biegsame Isolierfolie mit einem Muster von Leiterbahnen

Info

Publication number
CH506230A
CH506230A CH1844369A CH1844369A CH506230A CH 506230 A CH506230 A CH 506230A CH 1844369 A CH1844369 A CH 1844369A CH 1844369 A CH1844369 A CH 1844369A CH 506230 A CH506230 A CH 506230A
Authority
CH
Switzerland
Prior art keywords
pattern
insulating film
conductor tracks
flexible insulating
flexible
Prior art date
Application number
CH1844369A
Other languages
German (de)
English (en)
Inventor
Hendrik Schermer Gijs Johannes
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Publication of CH506230A publication Critical patent/CH506230A/de

Links

Classifications

    • H10W72/701—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H05K3/242—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated
    • H10W70/688—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
CH1844369A 1968-12-14 1969-12-11 Biegsame Isolierfolie mit einem Muster von Leiterbahnen CH506230A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6818017A NL6818017A (cg-RX-API-DMAC10.html) 1968-12-14 1968-12-14

Publications (1)

Publication Number Publication Date
CH506230A true CH506230A (de) 1971-04-15

Family

ID=19805406

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1844369A CH506230A (de) 1968-12-14 1969-12-11 Biegsame Isolierfolie mit einem Muster von Leiterbahnen

Country Status (10)

Country Link
AT (1) AT301666B (cg-RX-API-DMAC10.html)
BE (1) BE743089A (cg-RX-API-DMAC10.html)
BR (1) BR6915013D0 (cg-RX-API-DMAC10.html)
CH (1) CH506230A (cg-RX-API-DMAC10.html)
DE (1) DE1958811A1 (cg-RX-API-DMAC10.html)
DK (1) DK121806B (cg-RX-API-DMAC10.html)
ES (1) ES374491A1 (cg-RX-API-DMAC10.html)
FR (1) FR2026186A1 (cg-RX-API-DMAC10.html)
GB (1) GB1303650A (cg-RX-API-DMAC10.html)
NL (1) NL6818017A (cg-RX-API-DMAC10.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2633434C2 (de) * 1976-07-24 1981-04-30 Diehl GmbH & Co, 8500 Nürnberg Verlorener Verschlußstopfen
JPS566498A (en) * 1979-06-26 1981-01-23 Hitachi Chemical Co Ltd Method of manufacturing flexible printed circuit board
JPS60206639A (ja) * 1984-03-31 1985-10-18 日東電工株式会社 ポリイミド−金属箔複合フイルムの製造方法

Also Published As

Publication number Publication date
FR2026186A1 (cg-RX-API-DMAC10.html) 1970-09-11
ES374491A1 (es) 1972-01-01
GB1303650A (cg-RX-API-DMAC10.html) 1973-01-17
BR6915013D0 (pt) 1973-01-02
NL6818017A (cg-RX-API-DMAC10.html) 1970-06-16
DE1958811A1 (de) 1970-07-02
AT301666B (de) 1972-09-11
DK121806B (da) 1971-12-06
BE743089A (cg-RX-API-DMAC10.html) 1970-06-12

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Legal Events

Date Code Title Description
PL Patent ceased