BE743089A - - Google Patents
Info
- Publication number
- BE743089A BE743089A BE743089DA BE743089A BE 743089 A BE743089 A BE 743089A BE 743089D A BE743089D A BE 743089DA BE 743089 A BE743089 A BE 743089A
- Authority
- BE
- Belgium
Links
Classifications
-
- H10W72/701—
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
- H05K3/242—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated
-
- H10W70/688—
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Wire Bonding (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL6818017A NL6818017A (cg-RX-API-DMAC10.html) | 1968-12-14 | 1968-12-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BE743089A true BE743089A (cg-RX-API-DMAC10.html) | 1970-06-12 |
Family
ID=19805406
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BE743089D BE743089A (cg-RX-API-DMAC10.html) | 1968-12-14 | 1969-12-12 |
Country Status (10)
| Country | Link |
|---|---|
| AT (1) | AT301666B (cg-RX-API-DMAC10.html) |
| BE (1) | BE743089A (cg-RX-API-DMAC10.html) |
| BR (1) | BR6915013D0 (cg-RX-API-DMAC10.html) |
| CH (1) | CH506230A (cg-RX-API-DMAC10.html) |
| DE (1) | DE1958811A1 (cg-RX-API-DMAC10.html) |
| DK (1) | DK121806B (cg-RX-API-DMAC10.html) |
| ES (1) | ES374491A1 (cg-RX-API-DMAC10.html) |
| FR (1) | FR2026186A1 (cg-RX-API-DMAC10.html) |
| GB (1) | GB1303650A (cg-RX-API-DMAC10.html) |
| NL (1) | NL6818017A (cg-RX-API-DMAC10.html) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2633434C2 (de) * | 1976-07-24 | 1981-04-30 | Diehl GmbH & Co, 8500 Nürnberg | Verlorener Verschlußstopfen |
| JPS566498A (en) * | 1979-06-26 | 1981-01-23 | Hitachi Chemical Co Ltd | Method of manufacturing flexible printed circuit board |
| JPS60206639A (ja) * | 1984-03-31 | 1985-10-18 | 日東電工株式会社 | ポリイミド−金属箔複合フイルムの製造方法 |
-
1968
- 1968-12-14 NL NL6818017A patent/NL6818017A/xx unknown
-
1969
- 1969-11-22 DE DE19691958811 patent/DE1958811A1/de active Pending
- 1969-12-11 CH CH1844369A patent/CH506230A/de not_active IP Right Cessation
- 1969-12-11 AT AT1153769A patent/AT301666B/de not_active IP Right Cessation
- 1969-12-11 GB GB6055569A patent/GB1303650A/en not_active Expired
- 1969-12-11 BR BR215013/69A patent/BR6915013D0/pt unknown
- 1969-12-11 DK DK656869AA patent/DK121806B/da unknown
- 1969-12-12 BE BE743089D patent/BE743089A/xx unknown
- 1969-12-12 ES ES374491A patent/ES374491A1/es not_active Expired
- 1969-12-15 FR FR6943359A patent/FR2026186A1/fr not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| FR2026186A1 (cg-RX-API-DMAC10.html) | 1970-09-11 |
| ES374491A1 (es) | 1972-01-01 |
| GB1303650A (cg-RX-API-DMAC10.html) | 1973-01-17 |
| BR6915013D0 (pt) | 1973-01-02 |
| NL6818017A (cg-RX-API-DMAC10.html) | 1970-06-16 |
| CH506230A (de) | 1971-04-15 |
| DE1958811A1 (de) | 1970-07-02 |
| AT301666B (de) | 1972-09-11 |
| DK121806B (da) | 1971-12-06 |