CH505466A - Process for polishing semiconductor surfaces - Google Patents

Process for polishing semiconductor surfaces

Info

Publication number
CH505466A
CH505466A CH556969A CH556969A CH505466A CH 505466 A CH505466 A CH 505466A CH 556969 A CH556969 A CH 556969A CH 556969 A CH556969 A CH 556969A CH 505466 A CH505466 A CH 505466A
Authority
CH
Switzerland
Prior art keywords
semiconductor surfaces
polishing semiconductor
polishing
semiconductor
Prior art date
Application number
CH556969A
Other languages
German (de)
Inventor
Helmut Dr Deckert
Herbert Dr Jacob
Original Assignee
Wacker Chemie Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wacker Chemie Gmbh filed Critical Wacker Chemie Gmbh
Publication of CH505466A publication Critical patent/CH505466A/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002Preparing wafers
    • H01L21/02005Preparing bulk and homogeneous wafers
    • H01L21/02008Multistep processes
    • H01L21/0201Specific process step
    • H01L21/02024Mirror polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
CH556969A 1968-04-11 1969-04-11 Process for polishing semiconductor surfaces CH505466A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19681752163 DE1752163A1 (en) 1968-04-11 1968-04-11 Process for polishing semiconductor surfaces

Publications (1)

Publication Number Publication Date
CH505466A true CH505466A (en) 1971-03-31

Family

ID=5692658

Family Applications (1)

Application Number Title Priority Date Filing Date
CH556969A CH505466A (en) 1968-04-11 1969-04-11 Process for polishing semiconductor surfaces

Country Status (6)

Country Link
US (1) US3877183A (en)
BE (1) BE731353A (en)
CH (1) CH505466A (en)
DE (1) DE1752163A1 (en)
FR (1) FR2006054A1 (en)
GB (1) GB1234894A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0103085A1 (en) * 1982-08-12 1984-03-21 International Business Machines Corporation A method for polishing semiconductor wafers with montmorillonite slurry

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2531431C3 (en) * 1975-07-14 1979-03-01 Wacker-Chemitronic Gesellschaft Fuer Elektronik-Grundstoffe Mbh, 8263 Burghausen Polishing agents for producing haze-free semiconductor surfaces
DE2538855A1 (en) * 1975-09-01 1977-03-10 Wacker Chemitronic PROCESS FOR THE PRODUCTION OF VEIL-FREE SEMICONDUCTOR SURFACES, IN PARTICULAR VEIL-FREE SURFACES OF (111) -ORIENTED GALLIUM ARSENIDE
FR2327036A1 (en) * 1975-10-08 1977-05-06 Du Pont Modified silica sol for polishing silicon and germanium - remaining stable without depolymerisation at high pH for rapid polishing
JPS55113700A (en) * 1979-02-19 1980-09-02 Fujimi Kenmazai Kogyo Kk Polishing method for gadolinium gallium garnet single crystal
DE3237235C2 (en) * 1982-10-07 1986-07-10 Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH, 8263 Burghausen Process for polishing III-V semiconductor surfaces
US4588421A (en) * 1984-10-15 1986-05-13 Nalco Chemical Company Aqueous silica compositions for polishing silicon wafers
US5993685A (en) * 1997-04-02 1999-11-30 Advanced Technology Materials Planarization composition for removing metal films
US6319095B1 (en) * 2000-03-09 2001-11-20 Agere Systems Guardian Corp. Colloidal suspension of abrasive particles containing magnesium as CMP slurry
CN101605869B (en) * 2006-12-21 2014-03-05 高级技术材料公司 Compositions and methods for selective removal of silicon nitride
EP2799185B1 (en) * 2011-12-27 2017-02-01 Konica Minolta, Inc. Method for separating polishing material and regenerated polishing material
CN111253910B (en) * 2020-03-18 2021-07-16 昆山捷纳电子材料有限公司 Preparation method of inorganic polyelectrolyte-silicon oxide composite polishing abrasive particles

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2275049A (en) * 1942-03-03 Polish
US2375823A (en) * 1941-10-16 1945-05-15 Interchem Corp Polishing composition
US2375825A (en) * 1941-10-16 1945-05-15 Interchem Corp Polishing compositions
US2399237A (en) * 1942-12-15 1946-04-30 William T Maloney Polishing material and process of preparing same
US2955030A (en) * 1959-02-25 1960-10-04 Nat Lead Co Polishing compositions
US3170273A (en) * 1963-01-10 1965-02-23 Monsanto Co Process for polishing semiconductor materials
US3527028A (en) * 1967-09-26 1970-09-08 Bell Telephone Labor Inc Preparation of semiconductor surfaces
US3647381A (en) * 1968-04-08 1972-03-07 Gabriel Reiter Dental-prophylaxis composition
US3541017A (en) * 1969-02-04 1970-11-17 Indiana University Foundation Denture cleanser preparations comprising zirconium silicate and zirconium dioxide
US3754941A (en) * 1971-01-04 1973-08-28 Colgate Palmolive Co Removal of metallic stains from porcelain surfaces

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0103085A1 (en) * 1982-08-12 1984-03-21 International Business Machines Corporation A method for polishing semiconductor wafers with montmorillonite slurry

Also Published As

Publication number Publication date
FR2006054A1 (en) 1969-12-19
DE1752163B2 (en) 1974-07-25
DE1752163C3 (en) 1975-03-20
GB1234894A (en) 1971-06-09
DE1752163A1 (en) 1971-05-13
BE731353A (en) 1969-10-10
US3877183A (en) 1975-04-15

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Legal Events

Date Code Title Description
PL Patent ceased