FR2327036A1 - Modified silica sol for polishing silicon and germanium - remaining stable without depolymerisation at high pH for rapid polishing - Google Patents
Modified silica sol for polishing silicon and germanium - remaining stable without depolymerisation at high pH for rapid polishingInfo
- Publication number
- FR2327036A1 FR2327036A1 FR7530771A FR7530771A FR2327036A1 FR 2327036 A1 FR2327036 A1 FR 2327036A1 FR 7530771 A FR7530771 A FR 7530771A FR 7530771 A FR7530771 A FR 7530771A FR 2327036 A1 FR2327036 A1 FR 2327036A1
- Authority
- FR
- France
- Prior art keywords
- polishing
- depolymerisation
- germanium
- silica sol
- sio2
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 title abstract 3
- 229910052732 germanium Inorganic materials 0.000 title abstract 2
- 229910052710 silicon Inorganic materials 0.000 title abstract 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 title 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical class O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 title 1
- 239000010703 silicon Substances 0.000 title 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 5
- 239000002245 particle Substances 0.000 abstract 3
- 229910052681 coesite Inorganic materials 0.000 abstract 2
- 229910052906 cristobalite Inorganic materials 0.000 abstract 2
- 239000000377 silicon dioxide Substances 0.000 abstract 2
- 235000012239 silicon dioxide Nutrition 0.000 abstract 2
- 229910052682 stishovite Inorganic materials 0.000 abstract 2
- 229910052905 tridymite Inorganic materials 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 1
- 230000002000 scavenging effect Effects 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Silicon Compounds (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Si and Ge semiconductor materials are polished to a high degree of surface perfection using a modified colloidal SiO2-sol (a) having a pH 11-12.5, (11.8-12.3) (b) having an SiO2 concn. of 2-50 (5-30) wt.%, (c) in which the colloidal SiO2 particles are coated with chemically combined Al atoms to give a surface coverage of 1-50 (5-40) esp. 15-25 Al atoms on the surface/100 Si atoms on the surface of uncoated particles and (d) the particles having a specific surface area of 25-600 (59-300) esp. 75-200 m2/g. Polishing rates of about 150 mu/hr have been achieved, ef. 50 mu/hr for an unmodified SiO2. The high pH and stability also provide a high degree of scavenging and low haze.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7530771A FR2327036A1 (en) | 1975-10-08 | 1975-10-08 | Modified silica sol for polishing silicon and germanium - remaining stable without depolymerisation at high pH for rapid polishing |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7530771A FR2327036A1 (en) | 1975-10-08 | 1975-10-08 | Modified silica sol for polishing silicon and germanium - remaining stable without depolymerisation at high pH for rapid polishing |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2327036A1 true FR2327036A1 (en) | 1977-05-06 |
FR2327036B1 FR2327036B1 (en) | 1983-04-01 |
Family
ID=9160940
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7530771A Granted FR2327036A1 (en) | 1975-10-08 | 1975-10-08 | Modified silica sol for polishing silicon and germanium - remaining stable without depolymerisation at high pH for rapid polishing |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2327036A1 (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2892797A (en) * | 1956-02-17 | 1959-06-30 | Du Pont | Process for modifying the properties of a silica sol and product thereof |
US3170273A (en) * | 1963-01-10 | 1965-02-23 | Monsanto Co | Process for polishing semiconductor materials |
FR2006054A1 (en) * | 1968-04-11 | 1969-12-19 | Wacker Chemie Gmbh | |
US3807979A (en) * | 1972-05-08 | 1974-04-30 | Philadelphia Quartz Co | Quaternary ammonium silicate for polishing silicon metal |
-
1975
- 1975-10-08 FR FR7530771A patent/FR2327036A1/en active Granted
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2892797A (en) * | 1956-02-17 | 1959-06-30 | Du Pont | Process for modifying the properties of a silica sol and product thereof |
US3170273A (en) * | 1963-01-10 | 1965-02-23 | Monsanto Co | Process for polishing semiconductor materials |
FR2006054A1 (en) * | 1968-04-11 | 1969-12-19 | Wacker Chemie Gmbh | |
US3807979A (en) * | 1972-05-08 | 1974-04-30 | Philadelphia Quartz Co | Quaternary ammonium silicate for polishing silicon metal |
Also Published As
Publication number | Publication date |
---|---|
FR2327036B1 (en) | 1983-04-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |