CH487700A - Verfahren und Anlage zur Herstellung von verkupferten, insbesondere für die CO2-Schutzgasschweissung dienenden Stahldrähten - Google Patents

Verfahren und Anlage zur Herstellung von verkupferten, insbesondere für die CO2-Schutzgasschweissung dienenden Stahldrähten

Info

Publication number
CH487700A
CH487700A CH579469A CH579469A CH487700A CH 487700 A CH487700 A CH 487700A CH 579469 A CH579469 A CH 579469A CH 579469 A CH579469 A CH 579469A CH 487700 A CH487700 A CH 487700A
Authority
CH
Switzerland
Prior art keywords
copper
production
those used
plated steel
protective gas
Prior art date
Application number
CH579469A
Other languages
English (en)
Inventor
Harald Dipl Ing Strohmeier
Original Assignee
Boehler & Co Ag Geb
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Boehler & Co Ag Geb filed Critical Boehler & Co Ag Geb
Publication of CH487700A publication Critical patent/CH487700A/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1689—After-treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/40—Making wire or rods for soldering or welding
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C23C18/1632—Features specific for the apparatus, e.g. layout of cells and of its equipment, multiple cells
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
    • C23C18/1813—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by radiant energy
    • C23C18/1817—Heat
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
    • C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
    • C23C18/1837—Multistep pretreatment
    • C23C18/1844—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
    • C23C18/1848—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by electrochemical pretreatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Metal Extraction Processes (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Heat Treatment Of Strip Materials And Filament Materials (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
CH579469A 1968-04-19 1969-04-15 Verfahren und Anlage zur Herstellung von verkupferten, insbesondere für die CO2-Schutzgasschweissung dienenden Stahldrähten CH487700A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
AT380868A AT285278B (de) 1968-04-19 1968-04-19 Verfahren und Anlage zur Herstellung von verkupferten, insbesondere für die CO2-Schutzgasschweißung dienenden Stahldrähten

Publications (1)

Publication Number Publication Date
CH487700A true CH487700A (de) 1970-03-31

Family

ID=3555716

Family Applications (1)

Application Number Title Priority Date Filing Date
CH579469A CH487700A (de) 1968-04-19 1969-04-15 Verfahren und Anlage zur Herstellung von verkupferten, insbesondere für die CO2-Schutzgasschweissung dienenden Stahldrähten

Country Status (8)

Country Link
US (1) US3630057A (de)
AT (1) AT285278B (de)
CH (1) CH487700A (de)
DE (1) DE1919296C3 (de)
ES (2) ES366199A1 (de)
FR (1) FR2006534A1 (de)
GB (1) GB1240758A (de)
NL (1) NL6906011A (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2320395A1 (de) * 1973-04-21 1974-10-31 Berkenhoff & Drebes Gmbh Verfahren und vorrichtung zur herstellung von draht
JPS52147784A (en) * 1976-06-02 1977-12-08 Sumitomo Electric Ind Ltd Method of manufacturing composite wires
US4280857A (en) * 1979-11-05 1981-07-28 Aluminum Company Of America Continuous draw anneal system
AT388123B (de) * 1986-05-23 1989-05-10 Evg Entwicklung Verwert Ges Anlage zum ziehen, gluehen und verzinken von eisen- oder stahldraht mit hoher arbeitsgeschwindigkeit
US4818311A (en) * 1987-01-21 1989-04-04 American Telephone And Telegraph Company, At&T Technologies Inc. Methods of and apparatus for heating a moving metallic strand material
GB0031806D0 (en) * 2000-12-29 2001-02-07 Chemetall Plc Electroless copper plating of ferrous metal substrates
JP5491682B2 (ja) 2004-08-13 2014-05-14 日立金属株式会社 太陽電池用平角導体及びその製造方法並びに太陽電池用リード線
US20090007997A1 (en) * 2007-07-05 2009-01-08 Thomas Wilson Tyl Methods and Systems for Preventing Iron Oxide Formulation and Decarburization During Steel Tempering
IN2012DN01206A (de) * 2009-07-27 2015-04-10 Fuji Shoji Co Ltd
CN102417960A (zh) * 2011-12-07 2012-04-18 南通弘扬金属制品有限公司 一种铜包钢线及其生产方法
CN106191822A (zh) * 2016-07-03 2016-12-07 昆山中冶宝钢焊接材料有限公司 一种用于焊丝生产工艺的在线监测与实时反馈及自动补偿系统

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US436968A (en) * 1890-09-23 Method of and apparatus for drawing wire
US2268617A (en) * 1938-11-01 1942-01-06 Nat Standard Co Method of making copper clad wire
US2359095A (en) * 1939-10-17 1944-09-26 American Steel & Wire Co Continuous production of elongated metal stock
US2370973A (en) * 1941-11-22 1945-03-06 William C Lang Method and apparatus for producing coated wire
US3349597A (en) * 1961-08-23 1967-10-31 Brush Beryllium Co Method of producing beryllium wire

Also Published As

Publication number Publication date
ES366199A1 (es) 1971-03-16
US3630057A (en) 1971-12-28
DE1919296C3 (de) 1978-07-20
AT285278B (de) 1970-10-27
DE1919296B2 (de) 1977-12-22
GB1240758A (en) 1971-07-28
DE1919296A1 (de) 1969-11-13
NL6906011A (de) 1969-10-21
FR2006534A1 (de) 1969-12-26
ES386191A1 (es) 1973-03-16

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Legal Events

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PL Patent ceased