CH471525A - Verfahren zum Anbringen und Zusammenschalten elektrischer Schaltungskomponenten auf einer gedruckten, elektrischen Schaltungsplatte - Google Patents

Verfahren zum Anbringen und Zusammenschalten elektrischer Schaltungskomponenten auf einer gedruckten, elektrischen Schaltungsplatte

Info

Publication number
CH471525A
CH471525A CH716668A CH716668A CH471525A CH 471525 A CH471525 A CH 471525A CH 716668 A CH716668 A CH 716668A CH 716668 A CH716668 A CH 716668A CH 471525 A CH471525 A CH 471525A
Authority
CH
Switzerland
Prior art keywords
electrical circuit
mounting
circuit board
interconnecting
printed
Prior art date
Application number
CH716668A
Other languages
English (en)
Inventor
Archibald Hunt John William
Searle Michael
Original Assignee
Lucas Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lucas Industries Ltd filed Critical Lucas Industries Ltd
Publication of CH471525A publication Critical patent/CH471525A/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
    • H02J7/0042—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries characterised by the mechanical construction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10477—Inverted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0186—Mask formed or laid on PCB, the mask having recesses or openings specially designed for mounting components or body parts thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53004—Means to assemble or disassemble with means to regulate operation by use of templet, tape, card or other replaceable information supply
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CH716668A 1967-05-15 1968-05-15 Verfahren zum Anbringen und Zusammenschalten elektrischer Schaltungskomponenten auf einer gedruckten, elektrischen Schaltungsplatte CH471525A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2240067 1967-05-15

Publications (1)

Publication Number Publication Date
CH471525A true CH471525A (de) 1969-04-15

Family

ID=10178759

Family Applications (1)

Application Number Title Priority Date Filing Date
CH716668A CH471525A (de) 1967-05-15 1968-05-15 Verfahren zum Anbringen und Zusammenschalten elektrischer Schaltungskomponenten auf einer gedruckten, elektrischen Schaltungsplatte

Country Status (6)

Country Link
US (1) US3594899A (de)
CH (1) CH471525A (de)
DE (1) DE1765404B1 (de)
ES (1) ES354170A1 (de)
FR (1) FR1565866A (de)
GB (1) GB1225485A (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3535809A1 (de) * 1985-10-08 1987-04-09 Hauni Werke Koerber & Co Kg Halterungskoerper fuer werkstuecke, insbesondere turbinenschaufeln
JP2006156913A (ja) * 2004-12-01 2006-06-15 Ricoh Co Ltd プリント配線基板
US20100014259A1 (en) * 2008-07-15 2010-01-21 Enermax Technology Corporation Modular circuit board structure for large current area

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1072283B (de) * 1959-12-31
US2981868A (en) * 1957-08-08 1961-04-25 Honeywell Regulator Co Electrical apparatus
US3137534A (en) * 1961-10-12 1964-06-16 William J Schafer Pre-wired criss-cross control panel
US3107319A (en) * 1962-05-28 1963-10-15 Brown Engineering Company Inc Modular component printed circuit connector
US3326726A (en) * 1963-03-22 1967-06-20 Gen Motors Corp Thermoelectric array and method of manufacture
US3295189A (en) * 1963-08-15 1967-01-03 Amp Inc Terminal board wiring
US3192307A (en) * 1964-05-29 1965-06-29 Burndy Corp Connector for component and printed circuit board
US3323023A (en) * 1964-07-22 1967-05-30 Motorola Inc Semiconductor apparatus
US3356786A (en) * 1964-10-07 1967-12-05 Texas Instruments Inc Modular circuit boards
US3355078A (en) * 1964-11-23 1967-11-28 Bunker Ramo Apparatus for assembling electrical components
US3392256A (en) * 1965-06-24 1968-07-09 Texas Instruments Inc Method and apparatus for assembling electronic components to printed circuit boards
US3365536A (en) * 1965-11-10 1968-01-23 Sprague Electric Co Circuit module
US3465435A (en) * 1967-05-08 1969-09-09 Ibm Method of forming an interconnecting multilayer circuitry

Also Published As

Publication number Publication date
DE1765404B1 (de) 1971-08-26
US3594899A (en) 1971-07-27
GB1225485A (de) 1971-03-17
ES354170A1 (es) 1970-02-01
FR1565866A (de) 1969-05-02

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Legal Events

Date Code Title Description
PL Patent ceased