CH464639A - Process for the production of metallic tantalum or niobium coatings by electrolysis from aqueous solution - Google Patents

Process for the production of metallic tantalum or niobium coatings by electrolysis from aqueous solution

Info

Publication number
CH464639A
CH464639A CH1511564A CH1511564A CH464639A CH 464639 A CH464639 A CH 464639A CH 1511564 A CH1511564 A CH 1511564A CH 1511564 A CH1511564 A CH 1511564A CH 464639 A CH464639 A CH 464639A
Authority
CH
Switzerland
Prior art keywords
electrolysis
production
aqueous solution
niobium
tantalum
Prior art date
Application number
CH1511564A
Other languages
German (de)
Inventor
Bobst Joseph
Original Assignee
Bobst Joseph
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bobst Joseph filed Critical Bobst Joseph
Priority to CH1511564A priority Critical patent/CH464639A/en
Publication of CH464639A publication Critical patent/CH464639A/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/54Electroplating: Baths therefor from solutions of metals not provided for in groups C25D3/04 - C25D3/50

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Description

  

  Verfahren zur Herstellung     metallischer        Tantal-          oder        Niobüberzüge    durch     Elektrolyse    aus wässriger Lösung    Die     Erfindung    betrifft ein Verfahren zur Herstellung  von metallischen     Tantal-    oder     Niobüberzügen,    insbeson  dere auf Kupfer und dessen Legierungen oder Eisen,       durc    Elektrolyse aus einer wässrigen     Tantal-    oder     Niob-          lösung.     



  Es gibt bisher kein bekanntes Verfahren, um aus     wäss-          rigen    Lösungen das eine oder andere Metall elektrolytisch  niederzuschlagen. Es ist der Zweck dieser Erfindung ein  solches Verfahren zu schaffen.  



  Das Verfahren ist in der vorliegenden Erfindung nun  dadurch gekennzeichnet, dass die zu     elektrolysierende,     wässrige Lösung     Alkalihydroxyd,    ein Salz einer     Poly-          carbonsäure    und ein organisches Reduktionsmittel ent  hält. Die Lösung kann hergestellt werden, indem man ein  Oxyd des     Tantals    oder Mobs in einem Überschuss von  Alkali schmilzt, dann die so erhaltene Schmelze in Was  ser giesst, eine Säure hinzufügt und aufkocht, wobei sich       Tantal-    oder     Niobsäure    niederschlägt.

   Der Niederschlag  wird gewaschen, in     eine    stark     alkalische    Lösung gebracht  und aufgekocht, wobei sich der Niederschlag wieder löst.  Dann wird     Seignettesalz,    eine organische Säure, sowie  ein organisches Reduktionsmittel hinzugefügt um anfäng  lich einen     pH    von 6-7 zu erhalten, dann wird     elektroly-          siert.     



       Mie    diesem Elektrolyt wurden Versuche auf Kupfer  und Stahlplatten gemacht und als Anoden wurden Gra  phit oder     Platineelektroden    benutzt. Das Bad wurde her-    gestellt durch Einbringen folgender Komponenten in  Wasser:    3     gr/1        Tantal-    oder     Niobsäure     50     gr/1        Alkalihydroxyd     50     gr/1        Seignettesalz     40     gr/1    Zitronensäure  3     gr/1    Formaldehyd



  Process for the production of metallic tantalum or niobium coatings by electrolysis from aqueous solution The invention relates to a process for the production of metallic tantalum or niobium coatings, in particular on copper and its alloys or iron, by electrolysis from an aqueous tantalum or niobium solution.



  Up to now there is no known method for electrolytically depositing one or the other metal from aqueous solutions. It is the purpose of this invention to provide such a method.



  In the present invention, the method is characterized in that the aqueous solution to be electrolyzed contains alkali metal hydroxide, a salt of a polycarboxylic acid and an organic reducing agent. The solution can be prepared by melting an oxide of the tantalum or mob in an excess of alkali, then pouring the melt obtained in this way into water, adding an acid and boiling it, whereby tantalic or niobic acid is precipitated.

   The precipitate is washed, placed in a strongly alkaline solution and boiled, the precipitate dissolving again. Then seignette salt, an organic acid and an organic reducing agent are added to initially achieve a pH of 6-7, then electrolysis takes place.



       With this electrolyte, experiments were made on copper and steel plates, and graphite or plate electrodes were used as anodes. The bath was produced by adding the following components to water: 3 g / 1 tantalum or niobic acid 50 g / 1 alkali hydroxide 50 g / 1 seignette salt 40 g / 1 citric acid 3 g / 1 formaldehyde

 

Claims (1)

PATENTANSPRUCH Verfahren zur Herstellung metallischer Tantal- oder Niobüberzuge durch Elektrolyse einer wässrigen Tantal- oder Nioblösung, dadurch gekennzeichnet, dass die zu elektrolysierende, wässrige Lösung Alkalihydroxyd, ein Salz einer Polycarbonsäure sowie ein organisches Re duktionsmittel enthält. PATENT CLAIM Process for the production of metallic tantalum or niobium coatings by electrolysis of an aqueous tantalum or niobium solution, characterized in that the aqueous solution to be electrolyzed contains alkali metal hydroxide, a salt of a polycarboxylic acid and an organic reducing agent. UNTERANSPRÜCHE 1. Verfahren nach Patentanspruch, dadurch gekenn zeichnet, dass die Lösung als Salz einer Polycarbonsäure Seignettesalz enthält. 2. Verfahren nach Patentanspruch, dadurch gekenn zeichnet, dass die Lösung als Reduktionsmittel Formal dehyd, Pyrogallol, Hydrochinon oder Resorzin enthält. SUBClaims 1. The method according to claim, characterized in that the solution contains Seignette salt as a salt of a polycarboxylic acid. 2. The method according to claim, characterized in that the solution contains formaldehyde, pyrogallol, hydroquinone or resorcinol as the reducing agent.
CH1511564A 1964-11-21 1964-11-21 Process for the production of metallic tantalum or niobium coatings by electrolysis from aqueous solution CH464639A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CH1511564A CH464639A (en) 1964-11-21 1964-11-21 Process for the production of metallic tantalum or niobium coatings by electrolysis from aqueous solution

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH1511564A CH464639A (en) 1964-11-21 1964-11-21 Process for the production of metallic tantalum or niobium coatings by electrolysis from aqueous solution

Publications (1)

Publication Number Publication Date
CH464639A true CH464639A (en) 1968-10-31

Family

ID=4406462

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1511564A CH464639A (en) 1964-11-21 1964-11-21 Process for the production of metallic tantalum or niobium coatings by electrolysis from aqueous solution

Country Status (1)

Country Link
CH (1) CH464639A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0066347A1 (en) * 1981-01-13 1982-12-08 Metafuse Limited Electrolytic bath for the deposition and penetration of metallic coatings on metallic substrates

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0066347A1 (en) * 1981-01-13 1982-12-08 Metafuse Limited Electrolytic bath for the deposition and penetration of metallic coatings on metallic substrates

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