CH435391A - Thermoelektrische Vorrichtung - Google Patents

Thermoelektrische Vorrichtung

Info

Publication number
CH435391A
CH435391A CH600665A CH600665A CH435391A CH 435391 A CH435391 A CH 435391A CH 600665 A CH600665 A CH 600665A CH 600665 A CH600665 A CH 600665A CH 435391 A CH435391 A CH 435391A
Authority
CH
Switzerland
Prior art keywords
thermoelectric device
thermoelectric
Prior art date
Application number
CH600665A
Other languages
English (en)
Inventor
Harold Herman Phillip
Mark Ware Rowland
Original Assignee
Plessey Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Plessey Co Ltd filed Critical Plessey Co Ltd
Publication of CH435391A publication Critical patent/CH435391A/de

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/185Joining of semiconductor bodies for junction formation
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01Manufacture or treatment
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80Constructional details
    • H10N10/85Thermoelectric active materials
    • H10N10/851Thermoelectric active materials comprising inorganic compositions
    • H10N10/855Thermoelectric active materials comprising inorganic compositions comprising compounds containing boron, carbon, oxygen or nitrogen
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80Constructional details
    • H10N10/85Thermoelectric active materials
    • H10N10/851Thermoelectric active materials comprising inorganic compositions
    • H10N10/8556Thermoelectric active materials comprising inorganic compositions comprising compounds containing germanium or silicon

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Powder Metallurgy (AREA)
  • Silicon Compounds (AREA)
CH600665A 1964-05-01 1965-04-30 Thermoelektrische Vorrichtung CH435391A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB18161/64A GB1118183A (en) 1964-05-01 1964-05-01 Improvements in or relating to thermoelectric devices

Publications (1)

Publication Number Publication Date
CH435391A true CH435391A (de) 1967-05-15

Family

ID=10107694

Family Applications (1)

Application Number Title Priority Date Filing Date
CH600665A CH435391A (de) 1964-05-01 1965-04-30 Thermoelektrische Vorrichtung

Country Status (6)

Country Link
AT (1) AT272427B (de)
CH (1) CH435391A (de)
DE (1) DE1489277A1 (de)
FR (1) FR1440199A (de)
GB (1) GB1118183A (de)
NL (1) NL6505569A (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012205098A1 (de) * 2012-03-29 2013-10-02 Evonik Industries Ag Thermoelektrische Bauelemente auf Basis trocken verpresster Pulvervorstufen

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1042975B (it) * 1975-09-30 1980-01-30 Snam Progetti Metodo per la costruzione di un modulo termoelettrico e modulo cosi ottenuto
JPH0628246B2 (ja) * 1988-07-08 1994-04-13 コマツ電子金属株式会社 シリコン−ゲルマニウム合金の製造方法
EP1780807B1 (de) * 2004-07-01 2013-02-27 Universal Entertainment Corporation Thermoelektrisches wandlermodul
PL3196951T3 (pl) 2016-01-21 2019-07-31 Evonik Degussa Gmbh Racjonalny sposób wytwarzania elementów termoelektrycznych za pomocą metalurgii proszkowej

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012205098A1 (de) * 2012-03-29 2013-10-02 Evonik Industries Ag Thermoelektrische Bauelemente auf Basis trocken verpresster Pulvervorstufen
DE102012205098B4 (de) * 2012-03-29 2020-04-02 Evonik Operations Gmbh Thermoelektrische Bauelemente auf Basis trocken verpresster Pulvervorstufen

Also Published As

Publication number Publication date
FR1440199A (fr) 1966-05-27
NL6505569A (de) 1965-11-02
DE1489277A1 (de) 1969-01-02
AT272427B (de) 1969-07-10
GB1118183A (en) 1968-06-26

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