CH425826A - Atzlösung und Verwendung derselben zum Ätzen einer Photogravüreplatte aus Kupfer - Google Patents

Atzlösung und Verwendung derselben zum Ätzen einer Photogravüreplatte aus Kupfer

Info

Publication number
CH425826A
CH425826A CH932962A CH932962A CH425826A CH 425826 A CH425826 A CH 425826A CH 932962 A CH932962 A CH 932962A CH 932962 A CH932962 A CH 932962A CH 425826 A CH425826 A CH 425826A
Authority
CH
Switzerland
Prior art keywords
etch
copper
same
etching solution
photogravure plate
Prior art date
Application number
CH932962A
Other languages
English (en)
Inventor
Whiteman Jones Rexford
Original Assignee
Fmc Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fmc Corp filed Critical Fmc Corp
Publication of CH425826A publication Critical patent/CH425826A/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
CH932962A 1961-08-04 1962-08-03 Atzlösung und Verwendung derselben zum Ätzen einer Photogravüreplatte aus Kupfer CH425826A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US129359A US3216873A (en) 1961-08-04 1961-08-04 Method of etching photoengraving plates and etching solution used therefor

Publications (1)

Publication Number Publication Date
CH425826A true CH425826A (de) 1966-12-15

Family

ID=22439586

Family Applications (1)

Application Number Title Priority Date Filing Date
CH932962A CH425826A (de) 1961-08-04 1962-08-03 Atzlösung und Verwendung derselben zum Ätzen einer Photogravüreplatte aus Kupfer

Country Status (4)

Country Link
US (1) US3216873A (de)
CH (1) CH425826A (de)
DE (1) DE1232984B (de)
GB (1) GB943593A (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3399090A (en) * 1965-04-28 1968-08-27 Fmc Corp Process of etching metal with ammonium persulfate with recovery and recycling
FR1543781A (fr) * 1966-12-27 Ibm Dispositif de gravure à effet constant
US3933544A (en) * 1971-03-08 1976-01-20 Firma Hans Hollmuller, Maschinenbau Method of etching copper and copper alloys
JPS5221460B1 (de) * 1971-04-26 1977-06-10
JPS533975B2 (de) * 1973-10-17 1978-02-13 Tokai Electro Chemical Co
US3887405A (en) * 1974-05-10 1975-06-03 Minnesota Mining & Mfg Method and composition for cleaning copper surfaces
US4083758A (en) * 1976-09-27 1978-04-11 Criterion Process for regenerating and for recovering metallic copper from chloride-containing etching solutions
DE3623504A1 (de) * 1986-07-09 1988-01-21 Schering Ag Kupferaetzloesungen
US6117250A (en) * 1999-02-25 2000-09-12 Morton International Inc. Thiazole and thiocarbamide based chemicals for use with oxidative etchant solutions
US6444140B2 (en) 1999-03-17 2002-09-03 Morton International Inc. Micro-etch solution for producing metal surface topography
US20030178391A1 (en) * 2000-06-16 2003-09-25 Shipley Company, L.L.C. Composition for producing metal surface topography
US20040099637A1 (en) * 2000-06-16 2004-05-27 Shipley Company, L.L.C. Composition for producing metal surface topography

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2746848A (en) * 1955-01-19 1956-05-22 Photo Engravers Res Inc Etching
US3074836A (en) * 1956-07-11 1963-01-22 Ball Brothers Co Inc Baths for one-stage quick etches
US2908557A (en) * 1957-01-07 1959-10-13 Rca Corp Method of etching copper
US2978301A (en) * 1957-01-11 1961-04-04 Fmc Corp Process and composition for the dissolution of copper
FR1186757A (fr) * 1957-01-11 1959-09-01 Fmc Corp Procédé et solution pour la dissolution du cuivre
US2982625A (en) * 1957-03-22 1961-05-02 Sylvania Electric Prod Etchant and method
US3033793A (en) * 1958-08-13 1962-05-08 Photo Engravers Res Inc Powderless etching of copper photoengraving plates
US3083129A (en) * 1958-10-01 1963-03-26 Gen Dynamics Corp Method of etching copper with rejuvenation and recycling
US3023138A (en) * 1959-06-12 1962-02-27 Dow Chemical Co Powderless etching bath and method of etching plates therewith
US3061494A (en) * 1959-10-05 1962-10-30 Boeing Co Process of chemical milling and acid aqueous bath used therefor
NL121229C (de) * 1960-09-12

Also Published As

Publication number Publication date
GB943593A (en) 1963-12-04
US3216873A (en) 1965-11-09
DE1232984B (de) 1967-01-26

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