CH402190A - Gerät mit einer in einer Metallumhüllung eingeschlossenen Halbleiteranordnung - Google Patents

Gerät mit einer in einer Metallumhüllung eingeschlossenen Halbleiteranordnung

Info

Publication number
CH402190A
CH402190A CH1234960A CH1234960A CH402190A CH 402190 A CH402190 A CH 402190A CH 1234960 A CH1234960 A CH 1234960A CH 1234960 A CH1234960 A CH 1234960A CH 402190 A CH402190 A CH 402190A
Authority
CH
Switzerland
Prior art keywords
metal shell
enclosed
semiconductor device
semiconductor
device enclosed
Prior art date
Application number
CH1234960A
Other languages
English (en)
Inventor
Comte Corstiaan Le
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Publication of CH402190A publication Critical patent/CH402190A/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/132—Containers comprising a conductive base serving as an interconnection having other interconnections through an insulated passage in the conductive base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/235—Arrangements for cooling characterised by their places of attachment or cooling paths attached to package parts
CH1234960A 1959-11-07 1960-11-04 Gerät mit einer in einer Metallumhüllung eingeschlossenen Halbleiteranordnung CH402190A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL245138 1959-11-07

Publications (1)

Publication Number Publication Date
CH402190A true CH402190A (de) 1965-11-15

Family

ID=19752023

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1234960A CH402190A (de) 1959-11-07 1960-11-04 Gerät mit einer in einer Metallumhüllung eingeschlossenen Halbleiteranordnung

Country Status (3)

Country Link
CH (1) CH402190A (de)
DE (1) DE1898524U (de)
GB (1) GB887039A (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4546409A (en) * 1982-04-02 1985-10-08 Mitsubishi Denki Kabushiki Kaisha Device for cooling semiconductor elements

Also Published As

Publication number Publication date
DE1898524U (de) 1964-08-13
GB887039A (en) 1962-01-10

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