CH401270A - Verfahren zum Kontaktieren von in Halbleiterkörpern einlegierten Elektroden - Google Patents
Verfahren zum Kontaktieren von in Halbleiterkörpern einlegierten ElektrodenInfo
- Publication number
- CH401270A CH401270A CH637860A CH637860A CH401270A CH 401270 A CH401270 A CH 401270A CH 637860 A CH637860 A CH 637860A CH 637860 A CH637860 A CH 637860A CH 401270 A CH401270 A CH 401270A
- Authority
- CH
- Switzerland
- Prior art keywords
- semiconductor bodies
- contacting electrodes
- alloyed
- electrodes alloyed
- contacting
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01023—Vanadium [V]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01032—Germanium [Ge]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01049—Indium [In]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01067—Holmium [Ho]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12036—PN diode
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DES63436A DE1144851B (de) | 1959-06-12 | 1959-06-12 | Verfahren zum Kontaktieren von in Halbleiterkoerpern einlegierten Elektroden |
Publications (1)
Publication Number | Publication Date |
---|---|
CH401270A true CH401270A (de) | 1965-10-31 |
Family
ID=7496385
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH637860A CH401270A (de) | 1959-06-12 | 1960-06-03 | Verfahren zum Kontaktieren von in Halbleiterkörpern einlegierten Elektroden |
Country Status (4)
Country | Link |
---|---|
CH (1) | CH401270A (de) |
DE (1) | DE1144851B (de) |
GB (1) | GB896316A (de) |
NL (1) | NL251274A (de) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2622000A1 (de) * | 1976-05-18 | 1977-12-01 | Bosch Gmbh Robert | Verfahren und vorrichtung zum anloeten eines drahtes |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2725505A (en) * | 1953-11-30 | 1955-11-29 | Rca Corp | Semiconductor power devices |
AT187598B (de) * | 1954-04-07 | 1956-11-10 | Int Standard Electric Corp | Kristallgleichrichter oder Kristallverstärker |
-
0
- NL NL251274D patent/NL251274A/xx unknown
-
1959
- 1959-06-12 DE DES63436A patent/DE1144851B/de active Pending
-
1960
- 1960-06-03 CH CH637860A patent/CH401270A/de unknown
- 1960-06-10 GB GB20462/60A patent/GB896316A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
GB896316A (en) | 1962-05-16 |
DE1144851B (de) | 1963-03-07 |
NL251274A (de) | 1900-01-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CH407338A (de) | Verfahren zum Kontaktieren von Halbleiterbauelementen | |
DE1696312B2 (de) | Bad und verfahren zum stromlosen abscheiden von kupfer ueberzuegen | |
CH385773A (de) | Verfahren und Vorrichtung zum Ziehen von Profilen | |
CH408219A (de) | Verfahren zum Zertrennen von plattenförmigen Halbleiterkörpern in kleinflächigere Körper | |
CH395342A (de) | Verfahren zum Behandeln von Transistoren | |
CH367568A (de) | Verfahren zum Befestigen von Kontaktdrähten an Halbleiterkörpern und Einrichtung zur Ausführung des Verfahrens | |
CH391106A (de) | Verfahren zum Herstellen von Halbleiteranordnungen | |
CH420923A (de) | Verfahren zum Überziehen von Gegenständen | |
CH431817A (de) | Verfahren zum Stabilisieren von Catechinaminen | |
AT211358B (de) | Fahrbare Vorrichtung zum Anheben von Gleisen | |
CH367898A (de) | Verfahren zum Herstellen von Halbleitervorrichtungen | |
CH387176A (de) | Verfahren zum Herstellen von Halbleiterbauelementen | |
AT241818B (de) | Verfahren zum Stabilisieren von Polyurethanen | |
CH416897A (de) | Verfahren zum Verkleben von Metallen | |
CH401270A (de) | Verfahren zum Kontaktieren von in Halbleiterkörpern einlegierten Elektroden | |
CH409576A (de) | Verfahren zum Phosphatieren von Metallen | |
CH371845A (de) | Verfahren zum Kontaktieren von Halbleiteranordnungen | |
CH382857A (de) | Verfahren und Vorrichtung zum Anbringen von Kontaktorganen an Halbleiterkörpern | |
CH420621A (de) | Verfahren zum Polymerisieren von a-Olefinen | |
CH410196A (de) | Verfahren zum Herstellen von Halbleiteranordnungen | |
CH388457A (de) | Legierungsvorrichtung zum Anbringen von Flächenelektroden an Halbleiterkörpern | |
AT209932B (de) | Verfahren und Vorrichtung zum Anheben von Gleisen | |
CH429364A (de) | Verfahren zum Ätzen von Halbleiterkörpern | |
CH394448A (de) | Verfahren zum Verkleben von Metallen | |
CH359008A (de) | Verfahren zum Löten von Metallen |