CH396215A - Halbleiterbauelement und dessen Verwendung - Google Patents

Halbleiterbauelement und dessen Verwendung

Info

Publication number
CH396215A
CH396215A CH333661A CH333661A CH396215A CH 396215 A CH396215 A CH 396215A CH 333661 A CH333661 A CH 333661A CH 333661 A CH333661 A CH 333661A CH 396215 A CH396215 A CH 396215A
Authority
CH
Switzerland
Prior art keywords
semiconductor component
semiconductor
component
Prior art date
Application number
CH333661A
Other languages
German (de)
English (en)
Inventor
Geyer Karl-Heinz Dipl-Phys Dr
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of CH396215A publication Critical patent/CH396215A/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B51/00—Devices for, or methods of, sealing or securing package folds or closures; Devices for gathering or twisting wrappers, or necks of bags
    • B65B51/10—Applying or generating heat or pressure or combinations thereof
    • B65B51/14—Applying or generating heat or pressure or combinations thereof by reciprocating or oscillating members
    • B65B51/148—Hand-operated members
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B67/00—Apparatus or devices facilitating manual packaging operations; Sack holders
    • B65B67/08—Wrapping of articles
    • B65B67/10—Wrapping-tables
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/237—Arrangements for cooling characterised by their places of attachment or cooling paths attached to additional arrangements for cooling

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Package Closures (AREA)
  • Die Bonding (AREA)
CH333661A 1960-03-24 1961-03-21 Halbleiterbauelement und dessen Verwendung CH396215A (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DES0067712 1960-03-24
CA859031 1962-09-28

Publications (1)

Publication Number Publication Date
CH396215A true CH396215A (de) 1965-07-31

Family

ID=25673420

Family Applications (1)

Application Number Title Priority Date Filing Date
CH333661A CH396215A (de) 1960-03-24 1961-03-21 Halbleiterbauelement und dessen Verwendung

Country Status (3)

Country Link
CH (1) CH396215A (https=)
DE (1) DE1250562B (https=)
GB (2) GB975827A (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1614640B1 (de) * 1967-10-26 1971-12-02 Siemens Ag Gleichrichteranordnung
US3599057A (en) * 1969-02-03 1971-08-10 Gen Electric Semiconductor device with a resilient lead construction
DE3143335A1 (de) * 1981-10-31 1983-05-11 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleitervorrichtung
GB8801245D0 (en) * 1988-01-20 1988-02-17 Lightfoot G Packaging apparatus & method
US5177931A (en) * 1989-11-20 1993-01-12 Latter Melvin R Modified sealing machine
ITMI20060303A1 (it) 2006-02-20 2007-08-21 Colibri System Spa Macchina per ricoprire articoli di vario tipo
DE102011081687A1 (de) * 2011-08-26 2013-02-28 Robert Bosch Gmbh Halbleiterbauelement mit einem Kühlkörper
EP3382753A1 (de) * 2017-03-30 2018-10-03 Siemens Aktiengesellschaft Isolation für eine mehrlagige elektrische schaltung und verfahren zur herstellung einer isolation

Also Published As

Publication number Publication date
GB975827A (en) 1964-11-18
GB974827A (en) 1964-11-11
DE1250562B (https=)

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