CH384081A - Halbleiteranordnung, bei der die im Betrieb an einer Elektrode erzeugte Wärme über einen mit dieser Elektrode verbundenen Metallkörper abgeleitet wird, und Verfahren zu deren Herstellung - Google Patents

Halbleiteranordnung, bei der die im Betrieb an einer Elektrode erzeugte Wärme über einen mit dieser Elektrode verbundenen Metallkörper abgeleitet wird, und Verfahren zu deren Herstellung

Info

Publication number
CH384081A
CH384081A CH7644959A CH7644959A CH384081A CH 384081 A CH384081 A CH 384081A CH 7644959 A CH7644959 A CH 7644959A CH 7644959 A CH7644959 A CH 7644959A CH 384081 A CH384081 A CH 384081A
Authority
CH
Switzerland
Prior art keywords
electrode
production
during operation
heat generated
metal body
Prior art date
Application number
CH7644959A
Other languages
German (de)
English (en)
Inventor
Walter Dipl Phys Schroen
Eberhard Dipl Phys Thuermel
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of CH384081A publication Critical patent/CH384081A/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/4823—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a pin of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12036—PN diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16151—Cap comprising an aperture, e.g. for pressure control, encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
CH7644959A 1958-08-05 1959-07-31 Halbleiteranordnung, bei der die im Betrieb an einer Elektrode erzeugte Wärme über einen mit dieser Elektrode verbundenen Metallkörper abgeleitet wird, und Verfahren zu deren Herstellung CH384081A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES59287A DE1146204B (de) 1958-08-05 1958-08-05 Verfahren zum Herstellen einer Halbleiteranordnung mit wenigstens einem pn-UEbergang

Publications (1)

Publication Number Publication Date
CH384081A true CH384081A (de) 1964-11-15

Family

ID=7493176

Family Applications (1)

Application Number Title Priority Date Filing Date
CH7644959A CH384081A (de) 1958-08-05 1959-07-31 Halbleiteranordnung, bei der die im Betrieb an einer Elektrode erzeugte Wärme über einen mit dieser Elektrode verbundenen Metallkörper abgeleitet wird, und Verfahren zu deren Herstellung

Country Status (5)

Country Link
CH (1) CH384081A (xx)
DE (1) DE1146204B (xx)
FR (1) FR1230967A (xx)
GB (1) GB886561A (xx)
NL (2) NL241992A (xx)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1230912B (de) * 1960-06-09 1966-12-22 Siemens Ag Verfahren zum Herstellen einer Halbleiteranordnung

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2725505A (en) * 1953-11-30 1955-11-29 Rca Corp Semiconductor power devices
AT187598B (de) * 1954-04-07 1956-11-10 Int Standard Electric Corp Kristallgleichrichter oder Kristallverstärker
US2779877A (en) * 1955-06-17 1957-01-29 Sprague Electric Co Multiple junction transistor unit

Also Published As

Publication number Publication date
FR1230967A (fr) 1960-09-21
DE1146204B (de) 1963-03-28
NL113491C (xx) 1900-01-01
NL241992A (xx) 1900-01-01
GB886561A (en) 1962-01-10

Similar Documents

Publication Publication Date Title
CH367859A (de) Verfahren zum Erzeugen einer Spannung, die vom Unterschied zwischen zwei Frequenzen abhängt
CH457677A (de) Verfahren zum Verkleben von Elastomeren mit festen Stoffen, insbesondere Metallen
CH384081A (de) Halbleiteranordnung, bei der die im Betrieb an einer Elektrode erzeugte Wärme über einen mit dieser Elektrode verbundenen Metallkörper abgeleitet wird, und Verfahren zu deren Herstellung
CH423397A (de) Transportvorrichtung an einer Arbeitsmaschine, zum schrittweisen Vorschieben von Werkstückmaterial an die Bearbeitungsstelle
CH407334A (de) Verfahren für die Herstellung von pin-Übergangs-Festkörpervorrichtungen, eine nach diesem Verfahren hergestellte pin-Übergangs-Festkörpervorrichtung und eine Verwendung derselben
CH400583A (de) Verfahren zum Herstellen von Verschleissflächen an Werkzeugen
CH369718A (de) Sicherheitsvorrichtung an einem einen Bolzen vortreibenden Werkzeug
CH380047A (de) Vorrichtung zum Transportieren von Fäden, sowie Anwendung dieser Vorrichtung an einem Webstuhl
CH446538A (de) Verfahren zum Herstellen einer Halbleiteranordnung und zum Stabilisieren der pn-Übergänge an ihrem Halbleiterkörper
CH431776A (de) Verfahren zum Verkleben von Elastomeren mit festen Stoffen, insbesondere Metallen
CH350735A (de) Vorrichtung zur Halterung und zum Antrieb der Elektrode an elektroerosiv arbeitenden Werkzeugmaschinen
CH381474A (de) Vorrichtung zum lösbaren Verbinden von zwei Teilen
CH409585A (de) Nachformmaschine mit Vorbearbeitungswerkzeug
CH399187A (de) Einrichtung zur Überwachung des Auswurfes der bearbeiteten Werkstücke an Maschine mit Arbeitsstëssel
CH412141A (de) Einrichtung zum elektrolytischen Herstellen von Löchern in metallischen Werkstücken
CH408432A (de) Elektrische Einrichtung zum Verhindern des Einfallens des Messtasters beim Messen genuteter Werkstücke während der Bearbeitung
CH394448A (de) Verfahren zum Verkleben von Metallen
CH397486A (de) Vorrichtung zum selbsttätigen Vergleichsmässigen von Faserbändern beim Verstrecken
AT242475B (de) Schmiedemaschine mit mehr als zwei quer zur Werkstück-Längsachse schlagenden Werkzeugen
CH400070A (de) Kopfanstauchmaschine
CH396217A (de) Verfahren zum Herstellen von Legierungskontakten auf Halbleiterkörpern
CH403109A (de) Anordnung für die unmittelbare Stromerwärmung metallischer Werkstücke durch Gleichstrom
CH248570A (de) Vorrichtung zum Festhalten des Werkstückes an Kopiermaschinen für die Herstellung von Holzstielen von verschiedenem Querschnitt.
CH367697A (de) Vorrichtung zum Warmfertigen von Stauchteilen im fortlaufenden Arbeitsgang auf Revolverpressen
CH386807A (de) Vorrichtung an Arbeitsmaschine, zum Einstellen eines nockengesteuerten Körpers, und Verwendung der Vorrichtung an einer Werkzeugmaschine