CH381771A - Halbleiterbauelement mit einer gasdichten Kammer sowie Verfahren zur Herstellung eines solchen Halbleiterelementes und Vorrichtung zur Durchführung des Verfahrens - Google Patents

Halbleiterbauelement mit einer gasdichten Kammer sowie Verfahren zur Herstellung eines solchen Halbleiterelementes und Vorrichtung zur Durchführung des Verfahrens

Info

Publication number
CH381771A
CH381771A CH7858759A CH7858759A CH381771A CH 381771 A CH381771 A CH 381771A CH 7858759 A CH7858759 A CH 7858759A CH 7858759 A CH7858759 A CH 7858759A CH 381771 A CH381771 A CH 381771A
Authority
CH
Switzerland
Prior art keywords
producing
carrying
gas
tight chamber
semiconductor element
Prior art date
Application number
CH7858759A
Other languages
English (en)
Inventor
A Wagner Howard
Original Assignee
Westinghouse Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Electric Corp filed Critical Westinghouse Electric Corp
Publication of CH381771A publication Critical patent/CH381771A/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/049—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01067—Holmium [Ho]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
CH7858759A 1958-09-25 1959-09-22 Halbleiterbauelement mit einer gasdichten Kammer sowie Verfahren zur Herstellung eines solchen Halbleiterelementes und Vorrichtung zur Durchführung des Verfahrens CH381771A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US763245A US2993153A (en) 1958-09-25 1958-09-25 Seal

Publications (1)

Publication Number Publication Date
CH381771A true CH381771A (de) 1964-09-15

Family

ID=25067279

Family Applications (1)

Application Number Title Priority Date Filing Date
CH7858759A CH381771A (de) 1958-09-25 1959-09-22 Halbleiterbauelement mit einer gasdichten Kammer sowie Verfahren zur Herstellung eines solchen Halbleiterelementes und Vorrichtung zur Durchführung des Verfahrens

Country Status (4)

Country Link
US (1) US2993153A (de)
CH (1) CH381771A (de)
DE (1) DE1149827B (de)
GB (1) GB875823A (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3059157A (en) * 1958-11-14 1962-10-16 Texas Instruments Inc Semiconductor rectifier
US3188536A (en) * 1960-11-14 1965-06-08 Gen Motors Corp Silicon rectifier encapsulation
NL274434A (de) * 1961-02-06 1900-01-01
NL289148A (de) * 1961-08-12
US3218524A (en) * 1961-10-12 1965-11-16 Westinghouse Electric Corp Semiconductor devices
US3313987A (en) * 1964-04-22 1967-04-11 Int Rectifier Corp Compression bonded semiconductor device
US4196444A (en) * 1976-12-03 1980-04-01 Texas Instruments Deutschland Gmbh Encapsulated power semiconductor device with single piece heat sink mounting plate
DE3607247A1 (de) * 1985-07-03 1987-01-08 Emhart Ind Kondensator-anschlussverbindungsanordnung
US6695042B1 (en) * 2002-07-31 2004-02-24 Hewlett-Packard Development Company, L.P. Adjustable pedestal thermal interface
US20040263007A1 (en) * 2003-05-19 2004-12-30 Wetherill Associates, Inc. Thermal transfer container for semiconductor component

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2847622A (en) * 1958-08-12 bogel
US2837703A (en) * 1958-06-03 Lidow
US2744217A (en) * 1951-09-29 1956-05-01 Fansteel Metallurgical Corp Electrical apparatus
US2836878A (en) * 1952-04-25 1958-06-03 Int Standard Electric Corp Electric devices employing semiconductors
US2813326A (en) * 1953-08-20 1957-11-19 Liebowitz Benjamin Transistors
US2825014A (en) * 1953-11-30 1958-02-25 Philips Corp Semi-conductor device
NL100914C (de) * 1954-11-04 1900-01-01
NL203528A (de) * 1955-03-24
US2790940A (en) * 1955-04-22 1957-04-30 Bell Telephone Labor Inc Silicon rectifier and method of manufacture
US2806187A (en) * 1955-11-08 1957-09-10 Westinghouse Electric Corp Semiconductor rectifier device
US2863105A (en) * 1955-11-10 1958-12-02 Hoffman Electronics Corp Rectifying device
DE1030462B (de) * 1956-11-10 1958-05-22 Bosch Gmbh Robert Halbleitergleichrichter fuer hohe Stromstaerken

Also Published As

Publication number Publication date
GB875823A (en) 1961-08-23
US2993153A (en) 1961-07-18
DE1149827B (de) 1963-06-06

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