CH367896A - Method of manufacturing a semiconductor device - Google Patents

Method of manufacturing a semiconductor device

Info

Publication number
CH367896A
CH367896A CH3604156A CH3604156A CH367896A CH 367896 A CH367896 A CH 367896A CH 3604156 A CH3604156 A CH 3604156A CH 3604156 A CH3604156 A CH 3604156A CH 367896 A CH367896 A CH 367896A
Authority
CH
Switzerland
Prior art keywords
manufacturing
semiconductor device
semiconductor
Prior art date
Application number
CH3604156A
Other languages
German (de)
Inventor
L Losco Ezekiel
Original Assignee
Westinghouse Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US507312A external-priority patent/US2763822A/en
Priority claimed from US525595A external-priority patent/US2801375A/en
Application filed by Westinghouse Electric Corp filed Critical Westinghouse Electric Corp
Publication of CH367896A publication Critical patent/CH367896A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3006—Ag as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/492—Bases or plates or solder therefor
    • H01L23/4924—Bases or plates or solder therefor characterised by the materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H—ELECTRICITY
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/01082—Lead [Pb]
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    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12036—PN diode
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    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Ceramic Products (AREA)
  • Die Bonding (AREA)
  • Contacts (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
CH3604156A 1955-05-10 1956-07-31 Method of manufacturing a semiconductor device CH367896A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US507312A US2763822A (en) 1955-05-10 1955-05-10 Silicon semiconductor devices
US525595A US2801375A (en) 1955-08-01 1955-08-01 Silicon semiconductor devices and processes for making them

Publications (1)

Publication Number Publication Date
CH367896A true CH367896A (en) 1963-03-15

Family

ID=27055794

Family Applications (2)

Application Number Title Priority Date Filing Date
CH350720D CH350720A (en) 1955-05-10 1956-05-09 Method for producing a semiconductor device with a silicon semiconductor body
CH3604156A CH367896A (en) 1955-05-10 1956-07-31 Method of manufacturing a semiconductor device

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CH350720D CH350720A (en) 1955-05-10 1956-05-09 Method for producing a semiconductor device with a silicon semiconductor body

Country Status (6)

Country Link
BE (2) BE550001A (en)
CH (2) CH350720A (en)
DE (2) DE1050450B (en)
FR (2) FR1153475A (en)
GB (2) GB832067A (en)
NL (2) NL109558C (en)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1285068B (en) * 1957-01-11 1968-12-12 Siemens Ag Alloy contact on semiconductor crystals provided with a gold layer
NL243222A (en) * 1958-09-10 1900-01-01
NL242265A (en) * 1958-09-30 1900-01-01
NL102017C (en) * 1959-05-12
DE1233949B (en) * 1959-07-13 1967-02-09 Siemens Ag Method for producing a semiconductor rectifier arrangement with a single-crystal semiconductor body
NL249694A (en) * 1959-12-30
DE1113519B (en) * 1960-02-25 1961-09-07 Bosch Gmbh Robert Silicon rectifier for high currents
NL260951A (en) * 1960-03-07
DE1153461B (en) * 1960-06-23 1963-08-29 Siemens Ag Semiconductor device
DE1141029B (en) * 1960-06-23 1962-12-13 Siemens Ag Semiconductor device and method for its manufacture
NL269346A (en) * 1960-09-20
DE1133834B (en) * 1960-09-21 1962-07-26 Siemens Ag Silicon rectifier and process for its manufacture
NL270339A (en) * 1960-10-20
DE1229649B (en) * 1961-08-10 1966-12-01 Siemens Ag Method for producing a semiconductor element and semiconductor arrangement with a semiconductor element produced by this method
DE1240187B (en) * 1961-08-10 1967-05-11 Siemens Ag Process for creating a lock-free contact by alloying aluminum
DE1246129B (en) * 1961-12-28 1967-08-03 Westinghouse Electric Corp Method for manufacturing a semiconductor component
DE1185731B (en) * 1962-03-28 1965-01-21 Siemens Ag Semiconductor element with pn transition
DE1295697B (en) * 1962-05-23 1969-05-22 Walter Brandt Gmbh Semiconductor component and method for its manufacture
US3368120A (en) * 1965-03-22 1968-02-06 Gen Electric Multilayer contact system for semiconductor devices
DE1483298B1 (en) * 1965-06-11 1971-01-28 Siemens Ag Electrical contact arrangement between a germanium-silicon semiconductor body and a contact piece and method for producing the same
FR2046593A5 (en) * 1970-04-30 1971-03-05 Silec Semi Conducteurs
GB2031223A (en) * 1978-09-22 1980-04-16 Gen Instrument Corp Method for bonding a refractory metal contact member to a semiconductor body
SE9203533L (en) * 1992-11-24 1994-05-24 Asea Brown Boveri Apparatus for cooling disc-shaped power electronics elements as well as disc-shaped power electronics elements intended to be mounted in such a cooling device
JP6079375B2 (en) * 2013-03-29 2017-02-15 三菱マテリアル株式会社 Solder powder, method for producing the same, and solder paste using the powder
DE102015108056A1 (en) * 2015-05-21 2016-11-24 Osram Opto Semiconductors Gmbh Optoelectronic semiconductor component, optoelectronic assembly and method for producing an optoelectronic semiconductor component

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2220961A (en) * 1937-11-06 1940-11-12 Bell Telephone Labor Inc Soldering alloy
US2555001A (en) * 1947-02-04 1951-05-29 Bell Telephone Labor Inc Bonded article and method of bonding
US2567970A (en) * 1947-12-24 1951-09-18 Bell Telephone Labor Inc Semiconductor comprising silicon and method of making it
DE872602C (en) * 1951-03-20 1953-04-02 Siemens Ag Method of fastening semiconductors
NL91163C (en) * 1952-09-16
NL104654C (en) * 1952-12-31 1900-01-01
GB8817261D0 (en) * 1988-07-20 1988-08-24 Sperry Sun Inc Down-hole bearing assemblies for maintaining survey instrument assembly & core barrel orientation

Also Published As

Publication number Publication date
FR1153475A (en) 1958-03-11
DE1292260B (en) 1969-04-10
GB832067A (en) 1960-04-06
DE1050450B (en) 1959-02-12
BE547698A (en) 1900-01-01
FR1157057A (en) 1958-05-27
CH350720A (en) 1960-12-15
NL208617A (en) 1900-01-01
BE550001A (en) 1956-08-31
NL109558C (en) 1900-01-01
GB823559A (en) 1959-11-11

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