CH340558A - Halbleitereinrichtung mit mindestens einem flächenhaften p-n-Übergang - Google Patents
Halbleitereinrichtung mit mindestens einem flächenhaften p-n-ÜbergangInfo
- Publication number
- CH340558A CH340558A CH340558DA CH340558A CH 340558 A CH340558 A CH 340558A CH 340558D A CH340558D A CH 340558DA CH 340558 A CH340558 A CH 340558A
- Authority
- CH
- Switzerland
- Prior art keywords
- junction
- planar
- semiconductor device
- semiconductor
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/83801—Soldering or alloying
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H01L2924/01015—Phosphorus [P]
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- H01L2924/01027—Cobalt [Co]
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- H01L2924/01029—Copper [Cu]
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- H01L2924/01032—Germanium [Ge]
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- H01L2924/01049—Indium [In]
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- H01L2924/01057—Lanthanum [La]
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- H01L2924/01067—Holmium [Ho]
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- H01L2924/01074—Tungsten [W]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
- Bipolar Transistors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DES42834A DE1042762B (de) | 1955-02-26 | 1955-02-26 | Flaechengleichrichter bzw. -transistor, welcher mit mindestens einer seiner Elektroden flaechenhaft mit einem die Verlustwaerme abfuehrenden Koerper in Kontakt steht |
Publications (1)
Publication Number | Publication Date |
---|---|
CH340558A true CH340558A (de) | 1959-08-31 |
Family
ID=7484489
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH340558D CH340558A (de) | 1955-02-26 | 1956-02-17 | Halbleitereinrichtung mit mindestens einem flächenhaften p-n-Übergang |
Country Status (4)
Country | Link |
---|---|
US (1) | US2907935A (de) |
CH (1) | CH340558A (de) |
DE (1) | DE1042762B (de) |
GB (1) | GB802987A (de) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3109234A (en) * | 1957-07-22 | 1963-11-05 | Rca Corp | Method of mounting a semiconductor device |
US3109225A (en) * | 1958-08-29 | 1963-11-05 | Rca Corp | Method of mounting a semiconductor device |
US2942166A (en) * | 1959-03-23 | 1960-06-21 | Philco Corp | Semiconductor apparatus |
NL242762A (de) * | 1959-08-27 | |||
NL256369A (de) * | 1959-09-30 | 1900-01-01 | ||
US3131460A (en) * | 1959-11-09 | 1964-05-05 | Corning Glass Works | Method of bonding a crystal to a delay line |
DE1185728B (de) * | 1960-05-18 | 1965-01-21 | Siemens Ag | Halbleiteranordnung, insbesondere Flaechengleichrichter oder -transistor mit einem einkristallinen Halbleiterelement |
NL132800C (de) * | 1960-11-16 | |||
US3333163A (en) * | 1965-02-15 | 1967-07-25 | Int Rectifier Corp | Rectifier assembly with interconnecting bus-bar supports |
CH442502A (de) * | 1965-04-23 | 1967-08-31 | Siemens Ag | Gleichrichteranlage |
GB1147645A (en) * | 1965-07-01 | 1969-04-02 | English Electric Co Ltd | Housings for semi-conductor devices |
FR1531647A (fr) * | 1967-05-24 | 1968-07-05 | Comp Generale Electricite | Composant semiconducteur à isolement amélioré |
DE2638909A1 (de) * | 1976-08-28 | 1978-03-02 | Semikron Gleichrichterbau | Halbleiteranordnung |
DE2729074C2 (de) * | 1976-09-03 | 1982-08-26 | International Business Machines Corp., 10504 Armonk, N.Y. | Anordnung für ein gekapseltes Halbleiterschaltungsplättchen und Verfahren zu deren Herstellung |
US4333101A (en) * | 1979-07-19 | 1982-06-01 | Flight Systems, Inc. | Semiconductor heat sink mounting assembly |
US4404739A (en) * | 1980-04-21 | 1983-09-20 | Thermal Associates, Inc. | Method for mounting, electrically isolating and maintaining constant pressure on a semiconductor element |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1894821A (en) * | 1933-01-17 | Edgar a | ||
US1751360A (en) * | 1924-09-22 | 1930-03-18 | Ruben Rectifier Corp | Electric-current rectifier |
US1640335A (en) * | 1925-01-07 | 1927-08-23 | Union Switch & Signal Co | Unidirectional current-carrying device |
US1809925A (en) * | 1929-05-14 | 1931-06-16 | American Telephone & Telegraph | Variable resistance device |
US2406405A (en) * | 1941-05-19 | 1946-08-27 | Sperry Gyroscope Co Inc | Coaxial condenser crystal and method of making same |
GB560869A (en) * | 1942-10-19 | 1944-04-25 | Westinghouse Brake & Signal | Improvements relating to alternating electric current rectifiers of the selenium type |
US2776920A (en) * | 1952-11-05 | 1957-01-08 | Gen Electric | Germanium-zinc alloy semi-conductors |
-
1955
- 1955-02-26 DE DES42834A patent/DE1042762B/de active Pending
-
1956
- 1956-02-16 US US566032A patent/US2907935A/en not_active Expired - Lifetime
- 1956-02-17 CH CH340558D patent/CH340558A/de unknown
- 1956-02-24 GB GB5846/56A patent/GB802987A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
US2907935A (en) | 1959-10-06 |
GB802987A (en) | 1958-10-15 |
DE1042762B (de) | 1958-11-06 |
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