CH319027A - Halbleitervorrichtung mit Sockel - Google Patents

Halbleitervorrichtung mit Sockel

Info

Publication number
CH319027A
CH319027A CH319027DA CH319027A CH 319027 A CH319027 A CH 319027A CH 319027D A CH319027D A CH 319027DA CH 319027 A CH319027 A CH 319027A
Authority
CH
Switzerland
Prior art keywords
socket
semiconductor device
semiconductor
Prior art date
Application number
Other languages
German (de)
English (en)
Inventor
Bernard Herzog Gerald
Clifford Sziklai George
Original Assignee
Rca Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rca Corp filed Critical Rca Corp
Publication of CH319027A publication Critical patent/CH319027A/de

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R33/00Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
    • H01R33/72Three-pole devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/04Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/055Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads having a passage through the base
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/3011Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
CH319027D 1952-11-15 1953-10-24 Halbleitervorrichtung mit Sockel CH319027A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US319027XA 1952-11-15 1952-11-15

Publications (1)

Publication Number Publication Date
CH319027A true CH319027A (de) 1957-01-31

Family

ID=21862034

Family Applications (1)

Application Number Title Priority Date Filing Date
CH319027D CH319027A (de) 1952-11-15 1953-10-24 Halbleitervorrichtung mit Sockel

Country Status (5)

Country Link
BE (1) BE524279A (xx)
CH (1) CH319027A (xx)
DE (1) DE1009726B (xx)
FR (1) FR1092608A (xx)
NL (1) NL87450C (xx)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1154874C2 (de) * 1960-04-26 1964-04-09 Heinrich Menzel Transistor fuer Hochfrequenzschaltungen

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE426231C (de) * 1924-01-07 1926-03-08 Philips Nv Mit Kontaktstiften versehener Sockel fuer Gluehkathodenroehren
US2595475A (en) * 1949-12-23 1952-05-06 Rca Corp Electrode support for semiconductor devices

Also Published As

Publication number Publication date
DE1009726B (de) 1957-06-06
BE524279A (xx)
FR1092608A (fr) 1955-04-25
NL87450C (xx)

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