CH319027A - Halbleitervorrichtung mit Sockel - Google Patents
Halbleitervorrichtung mit SockelInfo
- Publication number
- CH319027A CH319027A CH319027DA CH319027A CH 319027 A CH319027 A CH 319027A CH 319027D A CH319027D A CH 319027DA CH 319027 A CH319027 A CH 319027A
- Authority
- CH
- Switzerland
- Prior art keywords
- socket
- semiconductor device
- semiconductor
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
- H01R33/72—Three-pole devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/055—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads having a passage through the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US319027XA | 1952-11-15 | 1952-11-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
CH319027A true CH319027A (de) | 1957-01-31 |
Family
ID=21862034
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH319027D CH319027A (de) | 1952-11-15 | 1953-10-24 | Halbleitervorrichtung mit Sockel |
Country Status (5)
Country | Link |
---|---|
BE (1) | BE524279A (xx) |
CH (1) | CH319027A (xx) |
DE (1) | DE1009726B (xx) |
FR (1) | FR1092608A (xx) |
NL (1) | NL87450C (xx) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1154874C2 (de) * | 1960-04-26 | 1964-04-09 | Heinrich Menzel | Transistor fuer Hochfrequenzschaltungen |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE426231C (de) * | 1924-01-07 | 1926-03-08 | Philips Nv | Mit Kontaktstiften versehener Sockel fuer Gluehkathodenroehren |
US2595475A (en) * | 1949-12-23 | 1952-05-06 | Rca Corp | Electrode support for semiconductor devices |
-
0
- NL NL87450D patent/NL87450C/xx active
- BE BE524279D patent/BE524279A/xx unknown
-
1953
- 1953-10-24 CH CH319027D patent/CH319027A/de unknown
- 1953-11-09 FR FR1092608D patent/FR1092608A/fr not_active Expired
- 1953-11-14 DE DER12965A patent/DE1009726B/de active Pending
Also Published As
Publication number | Publication date |
---|---|
DE1009726B (de) | 1957-06-06 |
BE524279A (xx) | |
FR1092608A (fr) | 1955-04-25 |
NL87450C (xx) |
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