CA974153A - High integrity electrical insulating layer - Google Patents

High integrity electrical insulating layer

Info

Publication number
CA974153A
CA974153A CA151,676A CA151676A CA974153A CA 974153 A CA974153 A CA 974153A CA 151676 A CA151676 A CA 151676A CA 974153 A CA974153 A CA 974153A
Authority
CA
Canada
Prior art keywords
insulating layer
electrical insulating
high integrity
integrity electrical
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA151,676A
Other languages
English (en)
Other versions
CA151676S (en
Inventor
Leon H. Kaplan
Francis J. Montillo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of CA974153A publication Critical patent/CA974153A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/02227—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
    • H01L21/0223—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate
    • H01L21/02233—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer
    • H01L21/02236—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer group IV semiconductor
    • H01L21/02238—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer group IV semiconductor silicon in uncombined form, i.e. pure silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/02227—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
    • H01L21/02255—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Formation Of Insulating Films (AREA)
  • Electrodes Of Semiconductors (AREA)
CA151,676A 1971-09-27 1972-09-14 High integrity electrical insulating layer Expired CA974153A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US18383371A 1971-09-27 1971-09-27

Publications (1)

Publication Number Publication Date
CA974153A true CA974153A (en) 1975-09-09

Family

ID=22674479

Family Applications (1)

Application Number Title Priority Date Filing Date
CA151,676A Expired CA974153A (en) 1971-09-27 1972-09-14 High integrity electrical insulating layer

Country Status (6)

Country Link
JP (1) JPS5338916B2 (cs)
CA (1) CA974153A (cs)
DE (1) DE2243285A1 (cs)
FR (1) FR2154664B1 (cs)
GB (1) GB1407222A (cs)
IT (1) IT964137B (cs)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8507601D0 (en) * 1985-03-23 1985-05-01 Standard Telephones Cables Ltd Integrated circuits
US5262336A (en) * 1986-03-21 1993-11-16 Advanced Power Technology, Inc. IGBT process to produce platinum lifetime control
EP0283311B1 (en) * 1987-03-18 2001-08-01 Kabushiki Kaisha Toshiba Thin film forming method
US6838741B2 (en) * 2002-12-10 2005-01-04 General Electtric Company Avalanche photodiode for use in harsh environments

Also Published As

Publication number Publication date
FR2154664B1 (cs) 1976-05-21
GB1407222A (en) 1975-09-24
JPS4842678A (cs) 1973-06-21
DE2243285A1 (de) 1973-04-05
JPS5338916B2 (cs) 1978-10-18
FR2154664A1 (cs) 1973-05-11
IT964137B (it) 1974-01-21

Similar Documents

Publication Publication Date Title
AU442667B2 (en) Electrical conductive film
CA958466A (en) High density electrical connector
CA940212A (en) Electrical contact
CA963546A (en) Insulation structure for electrical apparatus
CA935893A (en) Electrical connectors
CA970940A (en) Terminating of electrical conductors
CA991350A (en) Insulating materials
CA977430A (en) Snow-resistant conductor
CA934618A (en) Insulating composition
CA977429A (en) Electrical insulation
CA974153A (en) High integrity electrical insulating layer
CA951864A (en) Insulated conductor joints
CA961923A (en) Series-parallel electrical circuit
CA877376A (en) Composition for electrical insulation
CA861977A (en) Electrical insulating means and method for making the same
CA865680A (en) Electrical insulation
CA926960A (en) Electrical connectors
CA975853A (en) Electrical connectors
AU472007B2 (en) Dielectric layer composition
CA888989A (en) Electrical conductors
CA888990A (en) Electrical conductors
CA873046A (en) Electrical conductors
CA869709A (en) Insulated conductor
CA985386A (en) Shedded electrical insulators
CA970517A (en) Electrical conductive film