CA969436A - Method for improving adhesion between conductive layers and dielectrics - Google Patents
Method for improving adhesion between conductive layers and dielectricsInfo
- Publication number
- CA969436A CA969436A CA083,262A CA83262A CA969436A CA 969436 A CA969436 A CA 969436A CA 83262 A CA83262 A CA 83262A CA 969436 A CA969436 A CA 969436A
- Authority
- CA
- Canada
- Prior art keywords
- dielectrics
- conductive layers
- improving adhesion
- adhesion
- improving
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10P95/00—
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/0027—Ion-implantation, ion-irradiation or ion-injection
-
- H10P14/412—
-
- H10W74/43—
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/158—Sputtering
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/169—Vacuum deposition, e.g. including molecular beam epitaxy
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Electrodes Of Semiconductors (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US83777969A | 1969-06-30 | 1969-06-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA969436A true CA969436A (en) | 1975-06-17 |
Family
ID=25275398
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA083,262A Expired CA969436A (en) | 1969-06-30 | 1970-05-21 | Method for improving adhesion between conductive layers and dielectrics |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US3704166A (enExample) |
| JP (1) | JPS4842389B1 (enExample) |
| CA (1) | CA969436A (enExample) |
| DE (1) | DE2032320C3 (enExample) |
| FR (1) | FR2048035B1 (enExample) |
| GB (1) | GB1301529A (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4022931A (en) * | 1974-07-01 | 1977-05-10 | Motorola, Inc. | Process for making semiconductor device |
| US4433004A (en) * | 1979-07-11 | 1984-02-21 | Tokyo Shibaura Denki Kabushiki Kaisha | Semiconductor device and a method for manufacturing the same |
| US4532149A (en) * | 1981-10-21 | 1985-07-30 | The United States Of America As Represented By The United States Department Of Energy | Method for producing hard-surfaced tools and machine components |
| JPS60138918A (ja) * | 1983-12-27 | 1985-07-23 | Toshiba Corp | 半導体装置の製造方法 |
| US5084414A (en) * | 1985-03-15 | 1992-01-28 | Hewlett-Packard Company | Metal interconnection system with a planar surface |
| EP0195977B1 (en) * | 1985-03-15 | 1994-09-28 | Hewlett-Packard Company | Metal interconnection system with a planar surface |
| US4681818A (en) * | 1986-03-18 | 1987-07-21 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Oxygen diffusion barrier coating |
| US4732801A (en) * | 1986-04-30 | 1988-03-22 | International Business Machines Corporation | Graded oxide/nitride via structure and method of fabrication therefor |
| US5437729A (en) * | 1993-04-08 | 1995-08-01 | Martin Marietta Energy Systems, Inc. | Controlled removal of ceramic surfaces with combination of ions implantation and ultrasonic energy |
| US6111314A (en) * | 1998-08-26 | 2000-08-29 | International Business Machines Corporation | Thermal cap with embedded particles |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE639640A (enExample) * | 1962-05-25 | 1900-01-01 | ||
| US3290127A (en) * | 1964-03-30 | 1966-12-06 | Bell Telephone Labor Inc | Barrier diode with metal contact and method of making |
-
1969
- 1969-06-30 US US837779A patent/US3704166A/en not_active Expired - Lifetime
-
1970
- 1970-05-15 FR FR7017726A patent/FR2048035B1/fr not_active Expired
- 1970-05-21 CA CA083,262A patent/CA969436A/en not_active Expired
- 1970-06-03 GB GB1301529D patent/GB1301529A/en not_active Expired
- 1970-06-05 JP JP45048138A patent/JPS4842389B1/ja active Pending
- 1970-06-30 DE DE2032320A patent/DE2032320C3/de not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| FR2048035B1 (enExample) | 1974-03-15 |
| DE2032320A1 (de) | 1971-01-07 |
| GB1301529A (enExample) | 1972-12-29 |
| DE2032320B2 (de) | 1981-02-05 |
| FR2048035A1 (enExample) | 1971-03-19 |
| US3704166A (en) | 1972-11-28 |
| JPS4842389B1 (enExample) | 1973-12-12 |
| DE2032320C3 (de) | 1981-12-17 |
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