CA966986A - Method of manufacturing lead frames - Google Patents

Method of manufacturing lead frames

Info

Publication number
CA966986A
CA966986A CA120,222A CA120222A CA966986A CA 966986 A CA966986 A CA 966986A CA 120222 A CA120222 A CA 120222A CA 966986 A CA966986 A CA 966986A
Authority
CA
Canada
Prior art keywords
lead frames
manufacturing lead
manufacturing
frames
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA120,222A
Other languages
English (en)
Other versions
CA120222S (en
Inventor
Frederick J. Heinlen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TE Connectivity Corp
Original Assignee
AMP Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AMP Inc filed Critical AMP Inc
Application granted granted Critical
Publication of CA966986A publication Critical patent/CA966986A/en
Expired legal-status Critical Current

Links

Classifications

    • H10P72/0446—
    • H10W70/048—
    • H10W70/481—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
CA120,222A 1970-09-08 1971-08-10 Method of manufacturing lead frames Expired CA966986A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US7003470A 1970-09-08 1970-09-08

Publications (1)

Publication Number Publication Date
CA966986A true CA966986A (en) 1975-05-06

Family

ID=22092718

Family Applications (1)

Application Number Title Priority Date Filing Date
CA120,222A Expired CA966986A (en) 1970-09-08 1971-08-10 Method of manufacturing lead frames

Country Status (11)

Country Link
US (1) US3650232A (OSRAM)
AT (1) AT318042B (OSRAM)
AU (1) AU450494B2 (OSRAM)
BE (1) BE772314A (OSRAM)
CA (1) CA966986A (OSRAM)
DE (1) DE2143809A1 (OSRAM)
ES (1) ES394780A1 (OSRAM)
FR (1) FR2106369B1 (OSRAM)
GB (1) GB1305337A (OSRAM)
NL (1) NL7112352A (OSRAM)
SE (1) SE360216B (OSRAM)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3815205A (en) * 1973-03-02 1974-06-11 Nasa Device for configuring multiple leads
US4158745A (en) * 1977-10-27 1979-06-19 Amp Incorporated Lead frame having integral terminal tabs
US4214120A (en) * 1978-10-27 1980-07-22 Western Electric Company, Inc. Electronic device package having solder leads and methods of assembling the package
US4439918A (en) * 1979-03-12 1984-04-03 Western Electric Co., Inc. Methods of packaging an electronic device
US4252864A (en) * 1979-11-05 1981-02-24 Amp Incorporated Lead frame having integral terminal tabs
FR2538961B1 (fr) * 1982-12-30 1985-07-12 Europ Composants Electron Embase pour circuit integre
KR910001118B1 (ko) * 1985-11-13 1991-02-23 후지쓰 가부시끼가이샤 Ic 시이트 절단 프레스 및 이를 이용한 ic 시이트 가공장치
US4819476A (en) * 1987-07-17 1989-04-11 Amp Incorporated Tooling for forming machines having improved guidance, tool mounting, and pilot pin systems
NL9100470A (nl) * 1991-03-15 1992-10-01 Asm Fico Tooling Werkwijze en inrichting voor het uit op een leadframe opgenomen geintegreerde schakelingen vervaardigen van een enkelvoudig produkt.
US5557504A (en) * 1993-08-31 1996-09-17 Sgs-Thomson Microelectronics, Inc. Surface mountable integrated circuit package with detachable module
US5570273A (en) * 1993-08-31 1996-10-29 Sgs-Thomson Microelectronics, Inc. Surface mountable integrated circuit package with low-profile detachable module
USD358804S (en) 1993-09-02 1995-05-30 Sgs-Thomson Microelectronics, Inc. Detachable integrated circuit module
USD358805S (en) 1993-09-24 1995-05-30 Sgs-Thomson Microelectronics, Inc. Detachable integrated circuit module
DE69712999T2 (de) * 1996-07-26 2003-01-23 Nec Corp., Tokio/Tokyo Festelektrolytkondensator mit vorplattierten Leiteranschlüssen und dessen Herstellungsverfahren
JP2000243889A (ja) * 1999-02-22 2000-09-08 Sony Corp 半導体装置用リードフレームの形状加工装置及び形状加工方法並びに半導体装置用リードフレーム
EP3526821B1 (en) * 2016-11-11 2020-09-30 Lumileds Holding B.V. Method of manufacturing an led lighting device comprising a lead frame
CN117644134B (zh) * 2024-01-23 2024-05-14 佛山市阿玛达机械科技有限公司 一种金属板材加工用冷弯成型装置及其操作方法
CN119747739B (zh) * 2025-03-07 2025-07-18 厦门特克精密工业有限公司 一种引线框架的切断装置及切断工艺

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3571920A (en) * 1965-12-16 1971-03-23 Berg Electronics Inc Method for transistor manufacture
US3440027A (en) * 1966-06-22 1969-04-22 Frances Hugle Automated packaging of semiconductors
US3524249A (en) * 1966-10-08 1970-08-18 Nippon Electric Co Method of manufacturing a semiconductor container
US3559285A (en) * 1968-01-08 1971-02-02 Jade Corp Method of forming leads for attachment to semi-conductor devices

Also Published As

Publication number Publication date
AT318042B (de) 1974-09-25
AU450494B2 (en) 1974-07-11
US3650232A (en) 1972-03-21
BE772314A (fr) 1972-03-07
ES394780A1 (es) 1974-03-01
SE360216B (OSRAM) 1973-09-17
NL7112352A (OSRAM) 1972-03-10
GB1305337A (OSRAM) 1973-01-31
FR2106369A1 (OSRAM) 1972-05-05
AU3235571A (en) 1973-02-15
FR2106369B1 (OSRAM) 1977-04-22
DE2143809A1 (de) 1972-03-09

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