CA923024A - Selectively stripping tin and/or lead from copper substrates - Google Patents

Selectively stripping tin and/or lead from copper substrates

Info

Publication number
CA923024A
CA923024A CA120282A CA120282A CA923024A CA 923024 A CA923024 A CA 923024A CA 120282 A CA120282 A CA 120282A CA 120282 A CA120282 A CA 120282A CA 923024 A CA923024 A CA 923024A
Authority
CA
Canada
Prior art keywords
lead
copper substrates
stripping tin
selectively stripping
selectively
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA120282A
Other languages
English (en)
Other versions
CA120282S (en
Inventor
Frank A. Brindisi, Jr.
S. Nagy Joseph
F. Yarkosky Eugene
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Enthone Inc
Original Assignee
Enthone Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Enthone Inc filed Critical Enthone Inc
Application granted granted Critical
Publication of CA923024A publication Critical patent/CA923024A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Chemically Coating (AREA)
CA120282A 1970-09-04 1971-08-11 Selectively stripping tin and/or lead from copper substrates Expired CA923024A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US6976970A 1970-09-04 1970-09-04

Publications (1)

Publication Number Publication Date
CA923024A true CA923024A (en) 1973-03-20

Family

ID=22091105

Family Applications (1)

Application Number Title Priority Date Filing Date
CA120282A Expired CA923024A (en) 1970-09-04 1971-08-11 Selectively stripping tin and/or lead from copper substrates

Country Status (7)

Country Link
US (1) US3677949A (de)
JP (1) JPS5017336B1 (de)
CA (1) CA923024A (de)
DE (1) DE2143785A1 (de)
ES (1) ES394816A1 (de)
FR (1) FR2102030A5 (de)
GB (1) GB1361445A (de)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3841905A (en) * 1970-11-19 1974-10-15 Rbp Chem Corp Method of preparing printed circuit boards with terminal tabs
US3888778A (en) * 1973-03-13 1975-06-10 Merton Beckwith Bright dip composition for tin/lead
GB1446816A (en) * 1973-05-02 1976-08-18 Furukawa Electric Co Ltd Chemical dissolution treatment of tin or alloys thereof
US3926699A (en) * 1974-06-17 1975-12-16 Rbp Chemical Corp Method of preparing printed circuit boards with terminal tabs
US4004956A (en) * 1974-08-14 1977-01-25 Enthone, Incorporated Selectively stripping tin or tin-lead alloys from copper substrates
USRE29181E (en) * 1974-12-18 1977-04-12 Rbp Chemical Corporation Method of preparing printed circuit boards with terminal tabs
US3990982A (en) * 1974-12-18 1976-11-09 Rbp Chemical Corporation Composition for stripping lead-tin solder
US4175011A (en) * 1978-07-17 1979-11-20 Allied Chemical Corporation Sulfate-free method of etching copper pattern on printed circuit boards
US4306933A (en) * 1980-02-11 1981-12-22 Chemline Industries Tin/tin-lead stripping solutions
IT1144797B (it) * 1981-10-14 1986-10-29 Alfachimici Spa Soluzione per l asportazione di stagno o lega stagno piombo da un substrato mediante operazione a spruzzo
USRE32555E (en) * 1982-09-20 1987-12-08 Circuit Chemistry Corporation Solder stripping solution
US4397753A (en) * 1982-09-20 1983-08-09 Circuit Chemistry Corporation Solder stripping solution
EP0157382B1 (de) * 1984-04-02 1988-08-10 PARKER CHEMICAL COMPANY (a Delaware company) Verfahren und wässrige, saure Reinigungslösung zur Reinigung von Aluminiumoberflächen
US4732649A (en) * 1986-06-18 1988-03-22 Macdermid, Incorporated Method for manufacture of printed circuit boards
US4806200A (en) * 1986-06-18 1989-02-21 Macdermid, Incorporated Method for manufacture of printed circuit boards
ZA873845B (en) * 1986-06-18 1987-11-24 Macdermid, Incorporated Method for manufacture of printed circuit boards
DE3738307A1 (de) * 1987-11-11 1989-05-24 Ruwel Werke Gmbh Badloesungen und verfahren zum entfernen von blei/zinn-, blei- bzw. zinnschichten auf kupfer- oder nickeloberflaechen
US4957653A (en) * 1989-04-07 1990-09-18 Macdermid, Incorporated Composition containing alkane sulfonic acid and ferric nitrate for stripping tin or tin-lead alloy from copper surfaces, and method for stripping tin or tin-lead alloy
US4944851A (en) * 1989-06-05 1990-07-31 Macdermid, Incorporated Electrolytic method for regenerating tin or tin-lead alloy stripping compositions
US4921571A (en) * 1989-07-28 1990-05-01 Macdermid, Incorporated Inhibited composition and method for stripping tin, lead or tin-lead alloy from copper surfaces
US4956035A (en) * 1989-08-01 1990-09-11 Rd Chemical Company Composition and process for promoting adhesion on metal surfaces
JPH0375386A (ja) * 1989-08-18 1991-03-29 Metsuku Kk 錫又は錫‐鉛合金の剥離方法
US5017267A (en) * 1990-07-17 1991-05-21 Macdermid, Incorporated Composition and method for stripping tin or tin-lead alloy from copper surfaces
DE4113283C2 (de) * 1991-04-24 1994-05-05 Kernforschungsz Karlsruhe Verwendung einer Ätzlösung zum selektiven Abätzen einer metallischen Opferschicht bei der Herstellung von Mikrostrukturen
DE4219667C2 (de) * 1992-06-16 1994-12-01 Kernforschungsz Karlsruhe Werkzeug und Verfahren zur Herstellung einer mikrostrukturierten Kunststoffschicht
TWI231831B (en) * 2001-10-11 2005-05-01 Shipley Co Llc Stripping solution
CN100339014C (zh) * 2003-03-27 2007-09-26 中国人民解放军第三军医大学 N－乙酰氨基葡萄糖在乳制品中的应用及包含n－乙酰氨基葡萄糖的乳制品
DE102004014680B3 (de) * 2004-03-25 2005-07-28 Dr.-Ing. Max Schlötter GmbH & Co KG Entmetallisierungslösung und deren Verwendung
EP2503029B1 (de) * 2011-03-22 2013-03-20 Atotech Deutschland GmbH Verfahren zum Ätzen einer mit Zinn oder einer Zinnlegierung gefüllten vertieften Struktur
CN111705216B (zh) * 2020-06-16 2021-12-03 云南锡业股份有限公司锡业分公司 一种焊锡电解阳极泥的处理工艺

Also Published As

Publication number Publication date
GB1361445A (en) 1974-07-24
US3677949A (en) 1972-07-18
FR2102030A5 (de) 1972-03-31
ES394816A1 (es) 1974-11-16
JPS5017336B1 (de) 1975-06-20
DE2143785A1 (de) 1972-03-16

Similar Documents

Publication Publication Date Title
CA923024A (en) Selectively stripping tin and/or lead from copper substrates
CA925199A (en) Electronic grounding system
AU2517171A (en) Enclosures for electronic equipment
CA926514A (en) Electronic computer
CA925793A (en) Electronic keyboard
CA924933A (en) Alloyed copper
CA925173A (en) Electronic processing apparatus
AU425662B2 (en) Tin smelting
AU456229B2 (en) Electronic multiselector
CA842473A (en) Electronic component assembly apparatus
CA824321A (en) Electronic delay line
CA808327A (en) Electronic keyboard terminal
CA816673A (en) Copper pickling
CA852848A (en) Electrical metal processing apparatus
AU463970B2 (en) Insulating substrates
CA858652A (en) Equalization circuit
AU2286170A (en) Electronic multiselector
CA821145A (en) Electronic integration apparatus
CA809755A (en) Electronic circuit assembly
CA807804A (en) Electronic device
CA810328A (en) Electrical component
CA850731A (en) Poly-1-olefin composition for coating copper wire and the like
CA838826A (en) Electronic switching devices
CA832619A (en) Electronic relay circuit
CA837263A (en) Electronic computer circuit