CA3224468A1 - Sintering press - Google Patents

Sintering press Download PDF

Info

Publication number
CA3224468A1
CA3224468A1 CA3224468A CA3224468A CA3224468A1 CA 3224468 A1 CA3224468 A1 CA 3224468A1 CA 3224468 A CA3224468 A CA 3224468A CA 3224468 A CA3224468 A CA 3224468A CA 3224468 A1 CA3224468 A1 CA 3224468A1
Authority
CA
Canada
Prior art keywords
press
lower plate
silicon wafers
plate
load cell
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CA3224468A
Other languages
English (en)
French (fr)
Inventor
Nicola SCHIVALOCCHI
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AMX Automatrix SRL
Original Assignee
AMX Automatrix SRL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AMX Automatrix SRL filed Critical AMX Automatrix SRL
Publication of CA3224468A1 publication Critical patent/CA3224468A1/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/007—Means for maintaining the press table, the press platen or the press ram against tilting or deflection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/0094—Press load monitoring means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/02—Dies; Inserts therefor; Mounting thereof; Moulds
    • B30B15/026—Mounting of dies, platens or press rams
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0438—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/30—Mounting, exchanging or centering
    • B29C33/308—Adjustable moulds

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Silicon Compounds (AREA)
  • Presses And Accessory Devices Thereof (AREA)
  • Powder Metallurgy (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
CA3224468A 2021-07-13 2021-12-28 Sintering press Pending CA3224468A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
IT102021000018458A IT202100018458A1 (it) 2021-07-13 2021-07-13 Pressa di sinterizzazione
IT102021000018458 2021-07-13
PCT/IB2021/062386 WO2023285876A1 (en) 2021-07-13 2021-12-28 Sintering press

Publications (1)

Publication Number Publication Date
CA3224468A1 true CA3224468A1 (en) 2023-01-19

Family

ID=78086672

Family Applications (1)

Application Number Title Priority Date Filing Date
CA3224468A Pending CA3224468A1 (en) 2021-07-13 2021-12-28 Sintering press

Country Status (9)

Country Link
US (1) US20240339343A1 (OSRAM)
EP (1) EP4370320A1 (OSRAM)
JP (1) JP7849072B2 (OSRAM)
CN (1) CN117715746A (OSRAM)
CA (1) CA3224468A1 (OSRAM)
IT (1) IT202100018458A1 (OSRAM)
MX (1) MX2024000677A (OSRAM)
TW (1) TW202302332A (OSRAM)
WO (1) WO2023285876A1 (OSRAM)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4076780A (en) * 1977-01-27 1978-02-28 General Motors Corporation Programmable velocity and force control method for compression molding
JP3490606B2 (ja) * 1998-03-20 2004-01-26 富士通株式会社 半導体装置製造用金型
JP5977592B2 (ja) 2012-06-20 2016-08-24 東京応化工業株式会社 貼付装置
US9427893B2 (en) * 2014-09-18 2016-08-30 Asm Technology Singapore Pte Ltd Molding press and a platen for a molding press
IT201800020272A1 (it) * 2018-12-20 2020-06-20 Amx Automatrix S R L Pressa di sinterizzazione per sinterizzare componenti elettronici su un substrato

Also Published As

Publication number Publication date
JP2024529344A (ja) 2024-08-06
CN117715746A (zh) 2024-03-15
US20240339343A1 (en) 2024-10-10
JP7849072B2 (ja) 2026-04-21
IT202100018458A1 (it) 2023-01-13
EP4370320A1 (en) 2024-05-22
TW202302332A (zh) 2023-01-16
WO2023285876A1 (en) 2023-01-19
MX2024000677A (es) 2024-07-22

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