CA3212461A1 - Photovoltaic module with transparent perimeter edges - Google Patents
Photovoltaic module with transparent perimeter edges Download PDFInfo
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- CA3212461A1 CA3212461A1 CA3212461A CA3212461A CA3212461A1 CA 3212461 A1 CA3212461 A1 CA 3212461A1 CA 3212461 A CA3212461 A CA 3212461A CA 3212461 A CA3212461 A CA 3212461A CA 3212461 A1 CA3212461 A1 CA 3212461A1
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- 239000008393 encapsulating agent Substances 0.000 claims abstract description 188
- 239000000853 adhesive Substances 0.000 claims description 193
- 230000001070 adhesive effect Effects 0.000 claims description 193
- 239000012790 adhesive layer Substances 0.000 description 211
- 239000010410 layer Substances 0.000 description 121
- 229920000642 polymer Polymers 0.000 description 52
- 239000011521 glass Substances 0.000 description 45
- 230000005540 biological transmission Effects 0.000 description 25
- 229920002397 thermoplastic olefin Polymers 0.000 description 11
- 229920000098 polyolefin Polymers 0.000 description 8
- 229920001187 thermosetting polymer Polymers 0.000 description 8
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 description 6
- 239000005020 polyethylene terephthalate Substances 0.000 description 6
- 229920001296 polysiloxane Polymers 0.000 description 6
- 229910052738 indium Inorganic materials 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- -1 ethyl vinyl acetates Chemical class 0.000 description 4
- 239000005038 ethylene vinyl acetate Substances 0.000 description 4
- 229920002313 fluoropolymer Polymers 0.000 description 4
- 239000004811 fluoropolymer Substances 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- QHSJIZLJUFMIFP-UHFFFAOYSA-N ethene;1,1,2,2-tetrafluoroethene Chemical group C=C.FC(F)=C(F)F QHSJIZLJUFMIFP-UHFFFAOYSA-N 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 229920000515 polycarbonate Polymers 0.000 description 3
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-M Butyrate Chemical compound CCCC([O-])=O FERIUCNNQQJTOY-UHFFFAOYSA-M 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Natural products CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- 229920002943 EPDM rubber Polymers 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- 229920007925 Ethylene chlorotrifluoroethylene (ECTFE) Polymers 0.000 description 2
- 239000002033 PVDF binder Substances 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 239000004697 Polyetherimide Substances 0.000 description 2
- 229920000491 Polyphenylsulfone Polymers 0.000 description 2
- 229920009638 Tetrafluoroethylene-Hexafluoropropylene-Vinylidenefluoride Copolymer Polymers 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 239000003522 acrylic cement Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 229920001230 polyarylate Polymers 0.000 description 2
- 229920006260 polyaryletherketone Polymers 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 229920001601 polyetherimide Polymers 0.000 description 2
- 229920006124 polyolefin elastomer Polymers 0.000 description 2
- 239000011118 polyvinyl acetate Substances 0.000 description 2
- 229920002620 polyvinyl fluoride Polymers 0.000 description 2
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- 239000004713 Cyclic olefin copolymer Substances 0.000 description 1
- 229920012266 Poly(ether sulfone) PES Polymers 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 229920006397 acrylic thermoplastic Polymers 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0488—Double glass encapsulation, e.g. photovoltaic cells arranged between front and rear glass sheets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/049—Protective back sheets
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
- H02S20/00—Supporting structures for PV modules
- H02S20/20—Supporting structures directly fixed to an immovable object
- H02S20/22—Supporting structures directly fixed to an immovable object specially adapted for buildings
- H02S20/23—Supporting structures directly fixed to an immovable object specially adapted for buildings specially adapted for roof structures
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
- H02S20/00—Supporting structures for PV modules
- H02S20/20—Supporting structures directly fixed to an immovable object
- H02S20/22—Supporting structures directly fixed to an immovable object specially adapted for buildings
- H02S20/23—Supporting structures directly fixed to an immovable object specially adapted for buildings specially adapted for roof structures
- H02S20/25—Roof tile elements
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
- H02S40/00—Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
- H02S40/30—Electrical components
- H02S40/34—Electrical components comprising specially adapted electrical connection means to be structurally associated with the PV module, e.g. junction boxes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B10/00—Integration of renewable energy sources in buildings
- Y02B10/10—Photovoltaic [PV]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Abstract
A system includes a plurality of photovoltaic modules, each having at least one solar cell, an encapsulant encapsulating the solar cell, a frontsheet, and a backsheet. The encapsulant and the frontsheet are transparent. The backsheet includes a first section and a second section juxtaposed with the first section. The first section is transparent and the second section is non-transparent. A first end of the frontsheet, a first end of the encapsulant, and the first section of the backsheet form a transparent portion. A first photovoltaic module overlays at least a portion of a second photovoltaic module. The transparent portion of the first photovoltaic module overlays at least a portion of the at least one solar cell of the second photovoltaic module.
Description
PHOTOVOLTAIC MODULE WITH TRANSPARENT PERIMETER EDGES
Cross-Reference to Related Application This application is a Section 111(a) application relating to and claiming the benefit of commonly-owned, co-pending U.S. Provisional Patent Application Serial No.
63/185,091, filed May 6, 2021, entitled "PHOTOVOLTAIC MODULE WITH TRANSPARENT PERIMETER
EDGES," the contents of which are incorporated herein by reference in its entirety.
Field of the Invention The present invention relates to building integrated photovoltaic modules, and, more particularly, building integrated photovoltaic modules having transparent perimeters for improving energy density thereof.
Back2round Photovoltaic systems having solar panels are commonly installed on roofing of structures.
Summary In some embodiments, a system includes a plurality of photovoltaic modules, each of the photovoltaic modules includes at least one solar cell; an encapsulant encapsulating the at least one solar cell, wherein the encapsulant includes a first end, a second end opposite the first end, a first surface extending from the first end to the second end, and a second surface opposite the first surface and extending from the first end to the second end, wherein the encapsulant is transparent;
a frontsheet juxtaposed with the first surface of the encapsulant, wherein the frontsheet includes a first end and a second end opposite the first end of the frontsheet, wherein the frontsheet is transparent; and a backsheet juxtaposed with the second surface of the encapsulant, wherein the backsheet includes a first section, and a second section juxtaposed with the first section, wherein the first section is transparent, wherein the second section is non-transparent, wherein the first end of the frontsheet, the first end of the encapsulant, and the first section of the backsheet form a transparent portion, wherein a first photovoltaic module of the plurality of photovoltaic modules overlays at least a portion of a second photovoltaic module of the plurality of photovoltaic modules, and wherein the transparent portion of the first photovoltaic module overlays at least a portion of the at least one solar cell of the second photovoltaic module.
In some embodiments, each of the photovoltaic modules includes a first edge, and a second edge opposite the first edge, wherein the first section extends from the first edge to a first location intermediate the first edge and the second edge, and wherein the second section extends from the first location to the second edge. In some embodiments, the backsheet includes a first surface, a second surface opposite the first surface of the backsheet, a first side extending from the first edge to the second edge, and a second side opposite the first side and extending from the first edge to the second edge, wherein the first section extends from the first side to the second side and from the first surface to the second surface. In some embodiments, the second section extends from the first side to the second side and from the first surface of the backsheet to the second surface of the backsheet. In some embodiments, the first section includes a width measured from the first edge to the first location. In some embodiments, the width is 5 mm to 30 mm.
In some embodiments, each of the plurality of photovoltaic modules includes an adhesive juxtaposed with the backsheet, and wherein the adhesive is transparent. In some embodiments, the adhesive is juxtaposed with the first section. In some embodiments, the adhesive is
Cross-Reference to Related Application This application is a Section 111(a) application relating to and claiming the benefit of commonly-owned, co-pending U.S. Provisional Patent Application Serial No.
63/185,091, filed May 6, 2021, entitled "PHOTOVOLTAIC MODULE WITH TRANSPARENT PERIMETER
EDGES," the contents of which are incorporated herein by reference in its entirety.
Field of the Invention The present invention relates to building integrated photovoltaic modules, and, more particularly, building integrated photovoltaic modules having transparent perimeters for improving energy density thereof.
Back2round Photovoltaic systems having solar panels are commonly installed on roofing of structures.
Summary In some embodiments, a system includes a plurality of photovoltaic modules, each of the photovoltaic modules includes at least one solar cell; an encapsulant encapsulating the at least one solar cell, wherein the encapsulant includes a first end, a second end opposite the first end, a first surface extending from the first end to the second end, and a second surface opposite the first surface and extending from the first end to the second end, wherein the encapsulant is transparent;
a frontsheet juxtaposed with the first surface of the encapsulant, wherein the frontsheet includes a first end and a second end opposite the first end of the frontsheet, wherein the frontsheet is transparent; and a backsheet juxtaposed with the second surface of the encapsulant, wherein the backsheet includes a first section, and a second section juxtaposed with the first section, wherein the first section is transparent, wherein the second section is non-transparent, wherein the first end of the frontsheet, the first end of the encapsulant, and the first section of the backsheet form a transparent portion, wherein a first photovoltaic module of the plurality of photovoltaic modules overlays at least a portion of a second photovoltaic module of the plurality of photovoltaic modules, and wherein the transparent portion of the first photovoltaic module overlays at least a portion of the at least one solar cell of the second photovoltaic module.
In some embodiments, each of the photovoltaic modules includes a first edge, and a second edge opposite the first edge, wherein the first section extends from the first edge to a first location intermediate the first edge and the second edge, and wherein the second section extends from the first location to the second edge. In some embodiments, the backsheet includes a first surface, a second surface opposite the first surface of the backsheet, a first side extending from the first edge to the second edge, and a second side opposite the first side and extending from the first edge to the second edge, wherein the first section extends from the first side to the second side and from the first surface to the second surface. In some embodiments, the second section extends from the first side to the second side and from the first surface of the backsheet to the second surface of the backsheet. In some embodiments, the first section includes a width measured from the first edge to the first location. In some embodiments, the width is 5 mm to 30 mm.
In some embodiments, each of the plurality of photovoltaic modules includes an adhesive juxtaposed with the backsheet, and wherein the adhesive is transparent. In some embodiments, the adhesive is juxtaposed with the first section. In some embodiments, the adhesive is
2 substantially aligned with the first section. In some embodiments, the adhesive optically couples the first photovoltaic module with the second photovoltaic module In some embodiments, each of the photovoltaic modules includes a creepage distance extending from the first edge to a first end of the at least one solar cell. In some embodiments, the creepage distance is equal to the width of the first section of the backsheet. In some embodiments, the transparent portion of the first photovoltaic module overlays the at least one solar cell at an overlap distance. In some embodiments, the overlap distance is less than or equal to the creepage distance. In some embodiments, the first photovoltaic module overlaps the second photovoltaic module of a distance twice the creepage distance. In some embodiments, the first section includes a first layer and the second section includes a second layer. In some embodiments, each of the photovoltaic modules includes a first edge, and a second edge opposite the first edge, wherein the first layer extends from the first edge to the second edge, and wherein the second layer extends from the second edge to a first location intermediate the first edge and the second edge.
In some embodiments, a photovoltaic module includes at least one solar cell;
an encapsulant encapsulating the at least one solar cell, wherein the encapsulant includes a first end, a second end opposite the first end, a first surface extending from the first end to the second end, and a second surface opposite the first surface and extending from the first end to the second end, wherein the encapsulant is transparent; a frontsheet juxtaposed with the first surface of the encapsulant, wherein the frontsheet includes a first end and a second end opposite the first end of the frontsheet, wherein the frontsheet is transparent; and a backsheet juxtaposed with the second surface of the encapsulant, wherein the backsheet includes a first section, and a second section juxtaposed with the first section, wherein the first section is transparent, wherein the second section is non-transparent, wherein the first end of the frontsheet, the first end of the encapsulant, and the
In some embodiments, a photovoltaic module includes at least one solar cell;
an encapsulant encapsulating the at least one solar cell, wherein the encapsulant includes a first end, a second end opposite the first end, a first surface extending from the first end to the second end, and a second surface opposite the first surface and extending from the first end to the second end, wherein the encapsulant is transparent; a frontsheet juxtaposed with the first surface of the encapsulant, wherein the frontsheet includes a first end and a second end opposite the first end of the frontsheet, wherein the frontsheet is transparent; and a backsheet juxtaposed with the second surface of the encapsulant, wherein the backsheet includes a first section, and a second section juxtaposed with the first section, wherein the first section is transparent, wherein the second section is non-transparent, wherein the first end of the frontsheet, the first end of the encapsulant, and the
3 first section of the backsheet form a transparent portion, wherein the transparent portion of the photovoltaic module is configured to overlay at least a portion of at least one solar cell of another photovoltaic module.
In some embodiments, a system includes a plurality of photovoltaic modules, each of the photovoltaic modules includes at least one solar cell; an encapsulant encapsulating the at least one solar cell, wherein the encapsulant includes a first end, a second end opposite the first end, a first surface extending from the first end to the second end, and a second surface opposite the first surface and extending from the first end to the second end, wherein the encapsulant is transparent, a frontsheet juxtaposed with the first surface of the encapsulant, wherein the frontsheet includes a first end and a second end opposite the first end of the frontsheet, wherein the frontsheet is transparent; and a backsheet juxtaposed with the second surface of the encapsulant, wherein the backsheet includes a first section, wherein the first section includes a beveled portion, and wherein a first photovoltaic module of the plurality of photovoltaic modules overlays at least a portion of a second photovoltaic module of the plurality of photovoltaic modules, and wherein the beveled portion of the first photovoltaic module overlays at least a portion of the at least one solar cell of the second photovoltaic module. In some embodiments, the beveled portion includes a reflective portion.
Brief Description of the Drawings FIG. 1 shows a side schematic view of an embodiment of a photovoltaic module;
FIG. 2 shows a side schematic view of an embodiment of a frontsheet employed by the photovoltaic module of FIG. 1,
In some embodiments, a system includes a plurality of photovoltaic modules, each of the photovoltaic modules includes at least one solar cell; an encapsulant encapsulating the at least one solar cell, wherein the encapsulant includes a first end, a second end opposite the first end, a first surface extending from the first end to the second end, and a second surface opposite the first surface and extending from the first end to the second end, wherein the encapsulant is transparent, a frontsheet juxtaposed with the first surface of the encapsulant, wherein the frontsheet includes a first end and a second end opposite the first end of the frontsheet, wherein the frontsheet is transparent; and a backsheet juxtaposed with the second surface of the encapsulant, wherein the backsheet includes a first section, wherein the first section includes a beveled portion, and wherein a first photovoltaic module of the plurality of photovoltaic modules overlays at least a portion of a second photovoltaic module of the plurality of photovoltaic modules, and wherein the beveled portion of the first photovoltaic module overlays at least a portion of the at least one solar cell of the second photovoltaic module. In some embodiments, the beveled portion includes a reflective portion.
Brief Description of the Drawings FIG. 1 shows a side schematic view of an embodiment of a photovoltaic module;
FIG. 2 shows a side schematic view of an embodiment of a frontsheet employed by the photovoltaic module of FIG. 1,
4 FIG. 3A shows a top plan view of an embodiment of a backsheet employed by the photovoltaic module of FIG. 1, while FIG. 3B shows a top plan view of another embodiment of a backsheet;
FIG. 4 shows a side schematic view of an embodiment of a system of a plurality of the photovoltaic modules shown in FIG. 1;
FIG. 5 illustrates an embodiment of photovoltaic modules;
FIG. 6 shows a side schematic view of an embodiment of a photovoltaic module;
FIG. 7 shows a side schematic view of an embodiment of a photovoltaic module;
FIG. 8 shows a side schematic view of an embodiment of a system of a plurality of photovoltaic modules; and FIG. 9 shows a side schematic view of an embodiment of a system of a plurality of photovoltaic modules.
Detailed Description The present invention will be further explained with reference to the attached drawings, wherein like structures are referred to by like numerals throughout the several views. The drawings shown are not necessarily to scale, with emphasis instead generally being placed upon illustrating the principles of the present invention. Further, some features may be exaggerated to show details of particular components.
The figures constitute a part of this specification and include illustrative embodiments of the present invention and illustrate various objects and features thereof.
Further, the figures are not necessarily to scale, some features may be exaggerated to show details of particular
FIG. 4 shows a side schematic view of an embodiment of a system of a plurality of the photovoltaic modules shown in FIG. 1;
FIG. 5 illustrates an embodiment of photovoltaic modules;
FIG. 6 shows a side schematic view of an embodiment of a photovoltaic module;
FIG. 7 shows a side schematic view of an embodiment of a photovoltaic module;
FIG. 8 shows a side schematic view of an embodiment of a system of a plurality of photovoltaic modules; and FIG. 9 shows a side schematic view of an embodiment of a system of a plurality of photovoltaic modules.
Detailed Description The present invention will be further explained with reference to the attached drawings, wherein like structures are referred to by like numerals throughout the several views. The drawings shown are not necessarily to scale, with emphasis instead generally being placed upon illustrating the principles of the present invention. Further, some features may be exaggerated to show details of particular components.
The figures constitute a part of this specification and include illustrative embodiments of the present invention and illustrate various objects and features thereof.
Further, the figures are not necessarily to scale, some features may be exaggerated to show details of particular
5 components. In addition, any measurements, specifications and the like shown in the figures are intended to be illustrative, and not restrictive Therefore, specific structural and functional details disclosed herein are not to be interpreted as limiting, but merely as a representative basis for teaching one skilled in the art to variously employ the present invention.
Among those benefits and improvements that have been disclosed, other objects and advantages of this invention will become apparent from the following description taken in conjunction with the accompanying figures. Detailed embodiments of the present invention are disclosed herein; however, it is to be understood that the disclosed embodiments are merely illustrative of the invention that may be embodied in various forms. In addition, each of the examples given in connection with the various embodiments of the invention which are intended to be illustrative, and not restrictive.
Throughout the specification and claims, the following terms take the meanings explicitly associated herein, unless the context clearly dictates otherwise. The phrases "in one embodiment"
and "in some embodiments" as used herein do not necessarily refer to the same embodiment(s), though they may. Furthermore, the phrases "in some embodiments" and "in some other embodiments" as used herein do not necessarily refer to a different embodiment, although they may. Thus, as described below, various embodiments of the invention may be readily combined, without departing from the scope or spirit of the invention.
The term "based on" is not exclusive and allows for being based on additional factors not described, unless the context clearly dictates otherwise. In addition, throughout the specification, the meaning of "a," "an," and "the" include plural references. The meaning of "in" includes "in"
and "on."
Among those benefits and improvements that have been disclosed, other objects and advantages of this invention will become apparent from the following description taken in conjunction with the accompanying figures. Detailed embodiments of the present invention are disclosed herein; however, it is to be understood that the disclosed embodiments are merely illustrative of the invention that may be embodied in various forms. In addition, each of the examples given in connection with the various embodiments of the invention which are intended to be illustrative, and not restrictive.
Throughout the specification and claims, the following terms take the meanings explicitly associated herein, unless the context clearly dictates otherwise. The phrases "in one embodiment"
and "in some embodiments" as used herein do not necessarily refer to the same embodiment(s), though they may. Furthermore, the phrases "in some embodiments" and "in some other embodiments" as used herein do not necessarily refer to a different embodiment, although they may. Thus, as described below, various embodiments of the invention may be readily combined, without departing from the scope or spirit of the invention.
The term "based on" is not exclusive and allows for being based on additional factors not described, unless the context clearly dictates otherwise. In addition, throughout the specification, the meaning of "a," "an," and "the" include plural references. The meaning of "in" includes "in"
and "on."
6 Referring to FIGS. 1 through 2, in some embodiments, a photovoltaic module 10 includes at least one solar cell 12, an encapsulant 14 encapsulating the at least one solar cell 12, and a frontsheet 16 juxtaposed with the encapsulant 14. In some embodiments, the frontsheet 16 is juxtaposed with a first surface of the encapsulant 14. As used herein, the terms "encapsulating"
and "encapsulates- mean to partially or fully envelope or enclose, and with respect to certain embodiments of the photovoltaic module 10, the at least one solar cell 12 is fully enveloped by or enclosed within the encapsulant 14, or partially enveloped by or enclosed within the encapsulant 14. In some embodiments, the at least one solar cell 12 includes a plurality of solar cells 12. In some embodiments, the at least one solar cell 12 is electrically active. In some embodiments, the photovoltaic module 10 includes a first end 18, a second end 20 opposite the first end 18, a first surface 19 extending from the first end 18 to the second end 20, and a second surface 21 opposite the first surface 19 and extending from the first end 18 to the second end 20.
In some embodiments, the first surface 19 is an upper, sun facing-side surface of the photovoltaic module 10, and the second surface 21 is a lower surface configured to face a roof deck on which the photovoltaic module 10 is installed.
In some embodiments, the encapsulant 14 may be made from polyolefins, ethyl vinyl acetates, ionomers, silicones, poly vinyl butyral, epoxies, polyurethanes, or combinations/hybrids thereof. In some embodiments, the encapsulant 14 is composed of thermosetting polyolefin. In some embodiments, the encapsulant 14 is composed of thermoplastic polyolefin.
In some embodiments, the encapsulant 14 has a thickness of 0.4 mm to 1.8 mm.
In some embodiments, the encapsulant 14 has a thickness of 0.4 mm to 1.7 mm. In some embodiments, the encapsulant 14 has a thickness of 0.4 mm to 1.6 mm. In some embodiments, the encapsulant 14 has a thickness of 0.4 mm to 1.5 mm. In some embodiments, the encapsulant 14 has a thickness
and "encapsulates- mean to partially or fully envelope or enclose, and with respect to certain embodiments of the photovoltaic module 10, the at least one solar cell 12 is fully enveloped by or enclosed within the encapsulant 14, or partially enveloped by or enclosed within the encapsulant 14. In some embodiments, the at least one solar cell 12 includes a plurality of solar cells 12. In some embodiments, the at least one solar cell 12 is electrically active. In some embodiments, the photovoltaic module 10 includes a first end 18, a second end 20 opposite the first end 18, a first surface 19 extending from the first end 18 to the second end 20, and a second surface 21 opposite the first surface 19 and extending from the first end 18 to the second end 20.
In some embodiments, the first surface 19 is an upper, sun facing-side surface of the photovoltaic module 10, and the second surface 21 is a lower surface configured to face a roof deck on which the photovoltaic module 10 is installed.
In some embodiments, the encapsulant 14 may be made from polyolefins, ethyl vinyl acetates, ionomers, silicones, poly vinyl butyral, epoxies, polyurethanes, or combinations/hybrids thereof. In some embodiments, the encapsulant 14 is composed of thermosetting polyolefin. In some embodiments, the encapsulant 14 is composed of thermoplastic polyolefin.
In some embodiments, the encapsulant 14 has a thickness of 0.4 mm to 1.8 mm.
In some embodiments, the encapsulant 14 has a thickness of 0.4 mm to 1.7 mm. In some embodiments, the encapsulant 14 has a thickness of 0.4 mm to 1.6 mm. In some embodiments, the encapsulant 14 has a thickness of 0.4 mm to 1.5 mm. In some embodiments, the encapsulant 14 has a thickness
7 of 0.4 mm to 1.4 mm. In some embodiments, the encapsulant 14 has a thickness of 0.4 mm to 1.3 mm. In some embodiments, the encapsulant 14 has a thickness of 0.4 mm to 1.2 mm. In some embodiments, the encapsulant 14 has a thickness of 0.4 mm to 1.1 mm. In some embodiments, the encapsulant 14 has a thickness of 0.4 mm to 1.0 mm. In some embodiments, the encapsulant 14 has a thickness of 0.4 mm to 0.9 mm. In some embodiments, the encapsulant 14 has a thickness of 0.4 mm to 0.8 mm. In some embodiments, the encapsulant 14 has a thickness of 0.4 mm to 0.7 mm. In some embodiments, the encapsulant 14 has a thickness of 0.4 mm to 0.6 mm. In some embodiments, the encapsulant 14 has a thickness of 0.4 mm to 0.5 mm.
In some embodiments, the encapsulant 14 has a thickness of 0.5 mm to 1.8 mm.
In some embodiments, the encapsulant 14 has a thickness of 0.5 mm to 1.7 mm. In some embodiments, the encapsulant 14 has a thickness of 0.5 mm to 1.6 mm. In some embodiments, the encapsulant 14 has a thickness of 0.5 mm to 1.5 mm. In some embodiments, the encapsulant 14 has a thickness of 0.5 mm to 1.4 mm. In some embodiments, the encapsulant 14 has a thickness of 0.5 mm to 1.3 mm. In some embodiments, the encapsulant 14 has a thickness of 0.5 mm to 1.2 mm. In some embodiments, the encapsulant 14 has a thickness of 0.5 mm to 1.1 mm. In some embodiments, the encapsulant 14 has a thickness of 0.5 mm to 1.0 mm. In some embodiments, the encapsulant 14 has a thickness of 0.5 mm to 0.9 mm. In some embodiments, the encapsulant 14 has a thickness of 0.5 mm to 0.8 mm. In some embodiments, the encapsulant 14 has a thickness of 0.5 mm to 0.7 mm. In some embodiments, the encapsulant 14 has a thickness of 0.5 mm to 0.6 mm.
In some embodiments, the encapsulant 14 has a thickness of 0.6 mm to 1.8 mm.
In some embodiments, the encapsulant 14 has a thickness of 0.6 mm to 1.7 mm. In some embodiments, the encapsulant 14 has a thickness of 0.6 mm to 1.6 mm. In some embodiments, the encapsulant 14 has a thickness of 0.6 mm to 1.5 mm. In some embodiments, the encapsulant 14 has a thickness
In some embodiments, the encapsulant 14 has a thickness of 0.5 mm to 1.8 mm.
In some embodiments, the encapsulant 14 has a thickness of 0.5 mm to 1.7 mm. In some embodiments, the encapsulant 14 has a thickness of 0.5 mm to 1.6 mm. In some embodiments, the encapsulant 14 has a thickness of 0.5 mm to 1.5 mm. In some embodiments, the encapsulant 14 has a thickness of 0.5 mm to 1.4 mm. In some embodiments, the encapsulant 14 has a thickness of 0.5 mm to 1.3 mm. In some embodiments, the encapsulant 14 has a thickness of 0.5 mm to 1.2 mm. In some embodiments, the encapsulant 14 has a thickness of 0.5 mm to 1.1 mm. In some embodiments, the encapsulant 14 has a thickness of 0.5 mm to 1.0 mm. In some embodiments, the encapsulant 14 has a thickness of 0.5 mm to 0.9 mm. In some embodiments, the encapsulant 14 has a thickness of 0.5 mm to 0.8 mm. In some embodiments, the encapsulant 14 has a thickness of 0.5 mm to 0.7 mm. In some embodiments, the encapsulant 14 has a thickness of 0.5 mm to 0.6 mm.
In some embodiments, the encapsulant 14 has a thickness of 0.6 mm to 1.8 mm.
In some embodiments, the encapsulant 14 has a thickness of 0.6 mm to 1.7 mm. In some embodiments, the encapsulant 14 has a thickness of 0.6 mm to 1.6 mm. In some embodiments, the encapsulant 14 has a thickness of 0.6 mm to 1.5 mm. In some embodiments, the encapsulant 14 has a thickness
8
9 of 0.6 mm to 1.4 mm. In some embodiments, the encapsulant 14 has a thickness of 0.6 mm to 1.3 mm. In some embodiments, the encapsulant 14 has a thickness of 0.6 mm to 1.2 mm. In some embodiments, the encapsulant 14 has a thickness of 0.6 mm to 1.1 mm. In some embodiments, the encapsulant 14 has a thickness of 0.6 mm to 1.0 mm. In some embodiments, the encapsulant 14 has a thickness of 0.6 mm to 0.9 mm. In some embodiments, the encapsulant 14 has a thickness of 0.6 mm to 0.8 mm. In some embodiments, the encapsulant 14 has a thickness of 0.6 mm to 0.7 mm.
In some embodiments, the encapsulant 14 has a thickness of 0.7 mm to 1.8 mm.
In some embodiments, the encapsulant 14 has a thickness of 0.7 mm to 1.7 mm. In some embodiments, the encapsulant 14 has a thickness of 0.7 mm to 1.6 mm. In some embodiments, the encapsulant 14 has a thickness of 0.7 mm to 1.5 mm. In some embodiments, the encapsulant 14 has a thickness of 0.7 mm to 1.4 mm. In some embodiments, the encapsulant 14 has a thickness of 0.7 mm to 1.3 mm. In some embodiments, the encapsulant 14 has a thickness of 0.7 mm to 1.2 mm. In some embodiments, the encapsulant 14 has a thickness of 0.7 mm to 1.1 mm. In some embodiments, the encapsulant 14 has a thickness of 0.7 mm to 1.0 mm. In some embodiments, the encapsulant 14 has a thickness of 0.7 mm to 0.9 mm. In some embodiments, the encapsulant 14 has a thickness of 0.7 mm to 0.8 mm.
In some embodiments, the encapsulant 14 has a thickness of 0.8 mm to 1.8 mm.
In some embodiments, the encapsulant 14 has a thickness of 0.8 mm to 1.7 mm. In some embodiments, the encapsulant 14 has a thickness of 0.8 mm to 1.6 mm. In some embodiments, the encapsulant 14 has a thickness of 0.8 mm to 1.5 mm. In some embodiments, the encapsulant 14 has a thickness of 0.8 mm to 1.4 mm. In some embodiments, the encapsulant 14 has a thickness of 0.8 mm to 1.3 mm. In some embodiments, the encapsulant 14 has a thickness of 0.8 mm to 1.2 mm. In some embodiments, the encapsulant 14 has a thickness of 0.8 mm to 1.1 mm. In some embodiments, the encapsulant 14 has a thickness of 0.8 mm to 1.0 mm. In some embodiments, the encapsulant 14 has a thickness of 0.8 mm to 0.9 mm.
In some embodiments, the encapsulant 14 has a thickness of 0.9 mm to 1.8 mm.
In some embodiments, the encapsulant 14 has a thickness of 0.9 mm to 1.7 mm. In some embodiments, the encapsulant 14 has a thickness of 0.9 mm to 1.6 mm. In some embodiments, the encapsulant 14 has a thickness of 0.9 mm to 1.5 mm. In some embodiments, the encapsulant 14 has a thickness of 0.9 mm to 1.4 mm. In some embodiments, the encapsulant 14 has a thickness of 0.9 mm to 1.3 mm. In some embodiments, the encapsulant 14 has a thickness of 0.9 mm to 1.2 mm. In some embodiments, the encapsulant 14 has a thickness of 0.9 mm to 1.1 mm. In some embodiments, the encapsulant 14 has a thickness of 0.9 mm to 1.0 mm.
In some embodiments, the encapsulant 14 has a thickness of 1.0 mm to 1.8 mm.
In some embodiments, the encapsulant 14 has a thickness of 1.0 mm to 1.7 mm. In some embodiments, the encapsulant 14 has a thickness of 1.0 mm to 1.6 mm. In some embodiments, the encapsulant 14 has a thickness of 1.0 mm to 1.5 mm. In some embodiments, the encapsulant 14 has a thickness of 1.0 mm to 1.4 mm. In some embodiments, the encapsulant 14 has a thickness of 1.0 mm to 1.3 mm. In some embodiments, the encapsulant 14 has a thickness of 1.0 mm to 1.2 mm. In some embodiments, the encapsulant 14 has a thickness of 1.0 mm to 1.1 mm.
In some embodiments, the encapsulant 14 has a thickness of 1.1 mm to 1.8 mm.
In some embodiments, the encapsulant 14 has a thickness of 1.1 mm to 1.7 mm. In some embodiments, the encapsulant 14 has a thickness of 1.1 mm to 1.6 mm. In some embodiments, the encapsulant 14 has a thickness of 1.1 mm to 1.5 mm. In some embodiments, the encapsulant 14 has a thickness of 1.1 mm to 1.4 mm. In some embodiments, the encapsulant 14 has a thickness of 1.1 mm to 1.3 mm. In some embodiments, the encapsulant 14 has a thickness of 1.1 mm to 1.2 mm.
In some embodiments, the encapsulant 14 has a thickness of 1.2 mm to 1.8 mm.
In some embodiments, the encapsulant 14 has a thickness of 1.2 mm to 1.7 mm. In some embodiments, the encapsulant 14 has a thickness of 1.2 mm to 1.6 mm. In some embodiments, the encapsulant 14 has a thickness of 1.2 mm to 1.5 mm. In some embodiments, the encapsulant 14 has a thickness of 1.2 mm to 1.4 mm. In some embodiments, the encapsulant 14 has a thickness of 1.2 mm to 1.3 mm.
In some embodiments, the encapsulant 14 has a thickness of 1.3 mm to 1.8 mm.
In some embodiments, the encapsulant 14 has a thickness of 1.3 mm to 1.7 mm. In some embodiments, the encapsulant 14 has a thickness of 1.3 mm to 1.6 mm. In some embodiments, the encapsulant 14 has a thickness of 1.3 mm to 1.5 mm. In some embodiments, the encapsulant 14 has a thickness of 1.3 mm to 1.4 mm.
In some embodiments, the encapsul ant 14 has a thickness of 1.4 mm to 1.8 mm.
In some embodiments, the encapsulant 14 has a thickness of 1.4 mm to 1.7 mm. In some embodiments, the encapsulant 14 has a thickness of 1.4 mm to 1.6 mm. In some embodiments, the encapsulant 14 has a thickness of 1.4 mm to 1.5 mm.
In some embodiments, the encapsulant 14 has a thickness of 1.5 mm to 1.8 mm.
In some embodiments, the encapsulant 14 has a thickness of 1.5 mm to 1.7 mm. In some embodiments, the encapsulant 14 has a thickness of 1.5 mm to 1.6 mm. In some embodiments, the encapsulant 14 has a thickness of 1.6 mm to 1.8 mm. In some embodiments, the encapsulant 14 has a thickness of 1.6 mm to 1.7 mm. In some embodiments, the encapsulant 14 has a thickness of 1.7 mm to 1.8 mm. In some embodiments, the encapsulant 14 has a thickness of 0.4 mm. In some embodiments, the encapsulant 14 has a thickness of 0.5 mm. In some embodiments, the encapsulant 14 has a thickness of 06 mm In some embodiments, the encapsulant 14 has a thickness of 0 7 mm In some embodiments, the encapsulant 14 has a thickness of 0.8 mm. In some embodiments, the encapsulant 14 has a thickness of 0.9 mm. In some embodiments, the encapsulant 14 has a thickness of 1.0 mm. In some embodiments, the encapsulant 14 has a thickness of 1.1 mm. In some embodiments, the encapsulant 14 has a thickness of 1.2 mm. In some embodiments, the encapsulant 14 has a thickness of 1.3 mm. In some embodiments, the encapsulant 14 has a thickness of 1.4 mm. In some embodiments, the encapsulant 14 has a thickness of 1.5 mm. In some embodiments, the encapsulant 14 has a thickness of 1.6 mm. In some embodiments, the encapsulant 14 has a thickness of 1.7 mm. In some embodiments, the encapsulant 14 has a thickness of 1.8 mm.
In some embodiments, the frontsheet 16 includes a glass layer 22 and a polymer layer 24 attached to a first surface of the glass layer 22. In some embodiments, the frontsheet 16 is juxtaposed with a first surface of the encapsulant 14. In some embodiments, each of the encapsulant 14, the glass layer 22, and the polymer layer 24 is transparent.
In some embodiments, the polymer layer 24 is attached to the glass layer 22 by an adhesive layer 26. In some embodiments, the adhesive layer 26 may include polyolefin elastomers (POE), polyvinyl butyrate, acrylic, silicone, or polycarbonate. In some embodiments, the adhesive layer 26 may include pressure sensitive adhesives. In some embodiments, the polymer layer 24 is attached to the glass layer 22 by thermal bonding. In some embodiments, the frontsheet 16 includes at least one of the glass layer 22 or the polymer layer 24. In some embodiments, the adhesive layer 26 is transparent.
As used herein, the term "transparent" means having a solar weighted transmittance of 80% or greater, and with respect to certain embodiments of the photovoltaic module
In some embodiments, the encapsulant 14 has a thickness of 0.7 mm to 1.8 mm.
In some embodiments, the encapsulant 14 has a thickness of 0.7 mm to 1.7 mm. In some embodiments, the encapsulant 14 has a thickness of 0.7 mm to 1.6 mm. In some embodiments, the encapsulant 14 has a thickness of 0.7 mm to 1.5 mm. In some embodiments, the encapsulant 14 has a thickness of 0.7 mm to 1.4 mm. In some embodiments, the encapsulant 14 has a thickness of 0.7 mm to 1.3 mm. In some embodiments, the encapsulant 14 has a thickness of 0.7 mm to 1.2 mm. In some embodiments, the encapsulant 14 has a thickness of 0.7 mm to 1.1 mm. In some embodiments, the encapsulant 14 has a thickness of 0.7 mm to 1.0 mm. In some embodiments, the encapsulant 14 has a thickness of 0.7 mm to 0.9 mm. In some embodiments, the encapsulant 14 has a thickness of 0.7 mm to 0.8 mm.
In some embodiments, the encapsulant 14 has a thickness of 0.8 mm to 1.8 mm.
In some embodiments, the encapsulant 14 has a thickness of 0.8 mm to 1.7 mm. In some embodiments, the encapsulant 14 has a thickness of 0.8 mm to 1.6 mm. In some embodiments, the encapsulant 14 has a thickness of 0.8 mm to 1.5 mm. In some embodiments, the encapsulant 14 has a thickness of 0.8 mm to 1.4 mm. In some embodiments, the encapsulant 14 has a thickness of 0.8 mm to 1.3 mm. In some embodiments, the encapsulant 14 has a thickness of 0.8 mm to 1.2 mm. In some embodiments, the encapsulant 14 has a thickness of 0.8 mm to 1.1 mm. In some embodiments, the encapsulant 14 has a thickness of 0.8 mm to 1.0 mm. In some embodiments, the encapsulant 14 has a thickness of 0.8 mm to 0.9 mm.
In some embodiments, the encapsulant 14 has a thickness of 0.9 mm to 1.8 mm.
In some embodiments, the encapsulant 14 has a thickness of 0.9 mm to 1.7 mm. In some embodiments, the encapsulant 14 has a thickness of 0.9 mm to 1.6 mm. In some embodiments, the encapsulant 14 has a thickness of 0.9 mm to 1.5 mm. In some embodiments, the encapsulant 14 has a thickness of 0.9 mm to 1.4 mm. In some embodiments, the encapsulant 14 has a thickness of 0.9 mm to 1.3 mm. In some embodiments, the encapsulant 14 has a thickness of 0.9 mm to 1.2 mm. In some embodiments, the encapsulant 14 has a thickness of 0.9 mm to 1.1 mm. In some embodiments, the encapsulant 14 has a thickness of 0.9 mm to 1.0 mm.
In some embodiments, the encapsulant 14 has a thickness of 1.0 mm to 1.8 mm.
In some embodiments, the encapsulant 14 has a thickness of 1.0 mm to 1.7 mm. In some embodiments, the encapsulant 14 has a thickness of 1.0 mm to 1.6 mm. In some embodiments, the encapsulant 14 has a thickness of 1.0 mm to 1.5 mm. In some embodiments, the encapsulant 14 has a thickness of 1.0 mm to 1.4 mm. In some embodiments, the encapsulant 14 has a thickness of 1.0 mm to 1.3 mm. In some embodiments, the encapsulant 14 has a thickness of 1.0 mm to 1.2 mm. In some embodiments, the encapsulant 14 has a thickness of 1.0 mm to 1.1 mm.
In some embodiments, the encapsulant 14 has a thickness of 1.1 mm to 1.8 mm.
In some embodiments, the encapsulant 14 has a thickness of 1.1 mm to 1.7 mm. In some embodiments, the encapsulant 14 has a thickness of 1.1 mm to 1.6 mm. In some embodiments, the encapsulant 14 has a thickness of 1.1 mm to 1.5 mm. In some embodiments, the encapsulant 14 has a thickness of 1.1 mm to 1.4 mm. In some embodiments, the encapsulant 14 has a thickness of 1.1 mm to 1.3 mm. In some embodiments, the encapsulant 14 has a thickness of 1.1 mm to 1.2 mm.
In some embodiments, the encapsulant 14 has a thickness of 1.2 mm to 1.8 mm.
In some embodiments, the encapsulant 14 has a thickness of 1.2 mm to 1.7 mm. In some embodiments, the encapsulant 14 has a thickness of 1.2 mm to 1.6 mm. In some embodiments, the encapsulant 14 has a thickness of 1.2 mm to 1.5 mm. In some embodiments, the encapsulant 14 has a thickness of 1.2 mm to 1.4 mm. In some embodiments, the encapsulant 14 has a thickness of 1.2 mm to 1.3 mm.
In some embodiments, the encapsulant 14 has a thickness of 1.3 mm to 1.8 mm.
In some embodiments, the encapsulant 14 has a thickness of 1.3 mm to 1.7 mm. In some embodiments, the encapsulant 14 has a thickness of 1.3 mm to 1.6 mm. In some embodiments, the encapsulant 14 has a thickness of 1.3 mm to 1.5 mm. In some embodiments, the encapsulant 14 has a thickness of 1.3 mm to 1.4 mm.
In some embodiments, the encapsul ant 14 has a thickness of 1.4 mm to 1.8 mm.
In some embodiments, the encapsulant 14 has a thickness of 1.4 mm to 1.7 mm. In some embodiments, the encapsulant 14 has a thickness of 1.4 mm to 1.6 mm. In some embodiments, the encapsulant 14 has a thickness of 1.4 mm to 1.5 mm.
In some embodiments, the encapsulant 14 has a thickness of 1.5 mm to 1.8 mm.
In some embodiments, the encapsulant 14 has a thickness of 1.5 mm to 1.7 mm. In some embodiments, the encapsulant 14 has a thickness of 1.5 mm to 1.6 mm. In some embodiments, the encapsulant 14 has a thickness of 1.6 mm to 1.8 mm. In some embodiments, the encapsulant 14 has a thickness of 1.6 mm to 1.7 mm. In some embodiments, the encapsulant 14 has a thickness of 1.7 mm to 1.8 mm. In some embodiments, the encapsulant 14 has a thickness of 0.4 mm. In some embodiments, the encapsulant 14 has a thickness of 0.5 mm. In some embodiments, the encapsulant 14 has a thickness of 06 mm In some embodiments, the encapsulant 14 has a thickness of 0 7 mm In some embodiments, the encapsulant 14 has a thickness of 0.8 mm. In some embodiments, the encapsulant 14 has a thickness of 0.9 mm. In some embodiments, the encapsulant 14 has a thickness of 1.0 mm. In some embodiments, the encapsulant 14 has a thickness of 1.1 mm. In some embodiments, the encapsulant 14 has a thickness of 1.2 mm. In some embodiments, the encapsulant 14 has a thickness of 1.3 mm. In some embodiments, the encapsulant 14 has a thickness of 1.4 mm. In some embodiments, the encapsulant 14 has a thickness of 1.5 mm. In some embodiments, the encapsulant 14 has a thickness of 1.6 mm. In some embodiments, the encapsulant 14 has a thickness of 1.7 mm. In some embodiments, the encapsulant 14 has a thickness of 1.8 mm.
In some embodiments, the frontsheet 16 includes a glass layer 22 and a polymer layer 24 attached to a first surface of the glass layer 22. In some embodiments, the frontsheet 16 is juxtaposed with a first surface of the encapsulant 14. In some embodiments, each of the encapsulant 14, the glass layer 22, and the polymer layer 24 is transparent.
In some embodiments, the polymer layer 24 is attached to the glass layer 22 by an adhesive layer 26. In some embodiments, the adhesive layer 26 may include polyolefin elastomers (POE), polyvinyl butyrate, acrylic, silicone, or polycarbonate. In some embodiments, the adhesive layer 26 may include pressure sensitive adhesives. In some embodiments, the polymer layer 24 is attached to the glass layer 22 by thermal bonding. In some embodiments, the frontsheet 16 includes at least one of the glass layer 22 or the polymer layer 24. In some embodiments, the adhesive layer 26 is transparent.
As used herein, the term "transparent" means having a solar weighted transmittance of 80% or greater, and with respect to certain embodiments of the photovoltaic module
10, a transparent layer of the photovoltaic module has a solar weighted transmittance of 80% or greater.
In some embodiments, the glass layer 22 has a thickness of 2.5 mm to 4 mm. In some embodiments, the glass layer 22 has a thickness of 2.5 mm to 3.5 mm. In some embodiments, the glass layer 22 has a thickness of 2.5 mm to 3 mm. In some embodiments, the glass layer 22 has a thickness of 3 mm to 4 mm. In some embodiments, the glass layer 22 has a thickness of 3.5 mm to 4 mm. In some embodiments, the glass layer 22 has a thickness of 2.6 mm to 3.5 mm. In some embodiments, the glass layer 22 has a thickness of 2.7 mm to 3.5 mm. In some embodiments, the glass layer 22 has a thickness of 2.8 mm to 3.5 mm. In some embodiments, the glass layer 22 has a thickness of 2.9 mm to 3.5 mm. In some embodiments, the glass layer 22 has a thickness of 3 mm to 3.5 mm. In some embodiments, the glass layer 22 has a thickness of 3.1 mm to 3.5 mm.
In some embodiments, the glass layer 22 has a thickness of 3.2 mm to 3.5 mm.
In some embodiments, the glass layer 22 has a thickness of 3.3 mm to 3.5 mm. In some embodiments, the glass layer 22 has a thickness of 3.4 mm to 3.5 mm. In some embodiments, the glass layer 22 has a thickness of 2.5 mm to 3.4 mm. In some embodiments, the glass layer 22 has a thickness of 2.5 mm to 3.3 mm. In some embodiments, the glass layer 22 has a thickness of 2.5 mm to 3.2 mm.
In some embodiments, the glass layer 22 has a thickness of 2.5 mm to 3.1 mm.
In some embodiments, the glass layer 22 has a thickness of 2.5 mm to 2.9 mm. In some embodiments, the glass layer 22 has a thickness of 2.5 mm to 2.8 mm. In some embodiments, the glass layer 22 has a thickness of 2.5 mm to 2.7 mm. In some embodiments, the glass layer 22 has a thickness of 2.5 mm to 2.6 mm.
In some embodiments, the glass layer 22 has a thickness of 2.5 mm. In some embodiments, the glass layer 22 has a thickness of 2.6 mm. In some embodiments, the glass layer 22 has a thickness of 2.7 mm. In some embodiments, the glass layer 22 has a thickness of 2.8 mm. In some embodiments, the glass layer 22 has a thickness of 2.9 mm In some embodiments, the glass layer 22 has a thickness of 3 mm. In some embodiments, the glass layer 22 has a thickness of 3.1 mm.
In some embodiments, the glass layer 22 has a thickness of 3.2 mm. In some embodiments, the glass layer 22 has a thickness of 3.3 mm. In some embodiments, the glass layer 22 has a thickness of 3.4 mm. In some embodiments, the glass layer 22 has a thickness of 3.5 mm.
In some embodiments, the glass layer 22 has a thickness of 3.6 mm. In some embodiments, the glass layer 22 has a thickness of 3.7 mm. In some embodiments, the glass layer 22 has a thickness of 3.8 mm.
In some embodiments, the glass layer 22 has a thickness of 3.9 mm. In some embodiments, the glass layer 22 has a thickness of 4 mm.
In some embodiments, the adhesive layer 26 includes thermosetting polyolefin, thermosetting polyolefin encapsulant material, thermosetting ethylene-vinyl acetate (EVA), EVA
encapsulants, thermoplastic olefin, thermoplastic polyolefin (TPO) or hybrids/combinations thereof.
In some embodiments, the adhesive layer 26 has a thickness of 1 gm to 900 gm.
In some embodiments, the adhesive layer 26 has a thickness of 1 gm to 900 gm. In some embodiments, the adhesive layer 26 has a thickness of 1 gm to 850 gm. In some embodiments, the adhesive layer 26 has a thickness of 1 gm to 800 1.1111. In some embodiments, the adhesive layer 26 has a thickness of 1 gm to 750 gm. In some embodiments, the adhesive layer 26 has a thickness of 1 p.m to 700 jam. In some embodiments, the adhesive layer 26 has a thickness of 1 gm to 650 gm.
In some embodiments, the adhesive layer 26 has a thickness of 1 gm to 600 gm.
In some embodiments, the adhesive layer 26 has a thickness of 1 p.m to 550 gm. In some embodiments, the adhesive layer 26 has a thickness of 1 gm to 500 gm. In some embodiments, the adhesive layer 26 has a thickness of 1 hm to 450 hm. In some embodiments, the adhesive layer 26 has a thickness of 1 pm to 400 hm In some embodiments, the adhesive layer 26 has a thickness of 1 p.m to 350 hm. In some embodiments, the adhesive layer 26 has a thickness of 1 hm to 300 hm.
In some embodiments, the adhesive layer 26 has a thickness of 1 ttm to 250 hm.
In some embodiments, the adhesive layer 26 has a thickness of 1 hm to 200 hm. In some embodiments, the adhesive layer 26 has a thickness of 1 hm to 150 hm. In some embodiments, the adhesive layer 26 has a thickness of 1 hm to 100 hm. In some embodiments, the adhesive layer 26 has a thickness of 1 hm to 50 gm.
In some embodiments, the adhesive layer 26 has a thickness of 50 hm to 900 ttm. In some embodiments, the adhesive layer 26 has a thickness of 50 hm to 850 hm. In some embodiments, the adhesive layer 26 has a thickness of 50 p.m to 800 hm. In some embodiments, the adhesive layer 26 has a thickness of 50 hm to 750 hm. In some embodiments, the adhesive layer 26 has a thickness of 50 hm to 700 hm. In some embodiments, the adhesive layer 26 has a thickness of 50 hm to 650 vim. In some embodiments, the adhesive layer 26 has a thickness of 50 vim to 600 vim.
In some embodiments, the adhesive layer 26 has a thickness of 50 hm to 550 hm.
In some embodiments, the adhesive layer 26 has a thickness of 50 hm to 500 hm. In some embodiments, the adhesive layer 26 has a thickness of 50 hm to 450 hm. In some embodiments, the adhesive layer 26 has a thickness of 50 hm to 400 hm. In some embodiments, the adhesive layer 26 has a thickness of 50 hm to 350 hm. In some embodiments, the adhesive layer 26 has a thickness of 50 p.m to 300 hm. In some embodiments, the adhesive layer 26 has a thickness of 50 hm to 250 hm.
In some embodiments, the adhesive layer 26 has a thickness of 50 hm to 200 hm.
In some embodiments, the adhesive layer 26 has a thickness of 50 hm to 150 hm. In some embodiments, the adhesive layer 26 has a thickness of 50 hm to 100 hm.
In some embodiments, the adhesive layer 26 has a thickness of 100 m to 900 p.m. In some embodiments, the adhesive layer 26 has a thickness of 100 pm to 850 pm In some embodiments, the adhesive layer 26 has a thickness of 100 p.m to 800 p.m. In some embodiments, the adhesive layer 26 has a thickness of 100 m to 750 p.m. In some embodiments, the adhesive layer 26 has a thickness of 100 p.m to 700 p.m. In some embodiments, the adhesive layer 26 has a thickness of 100 p.m to 650 p.m. In some embodiments, the adhesive layer 26 has a thickness of 100 p.m to 600 p.m. In some embodiments, the adhesive layer 26 has a thickness of 100 p.m to 550 p.m. In some embodiments, the adhesive layer 26 has a thickness of 100 m to 500 p.m. In some embodiments, the adhesive layer 26 has a thickness of 100 p.m to 450 p.m. In some embodiments, the adhesive layer 26 has a thickness of 100 p.m to 400 p.m. In some embodiments, the adhesive layer 26 has a thickness of 100 p.m to 350 pm. In some embodiments, the adhesive layer 26 has a thickness of 100 p.m to 300 p.m. In some embodiments, the adhesive layer 26 has a thickness of 100 p.m to 250 In some embodiments, the adhesive layer 26 has a thickness of 100 p.m to 200 p.m. In some embodiments, the adhesive layer 26 has a thickness of 100 tint to 150 tint.
In some embodiments, the adhesive layer 26 has a thickness of 150 p.m to 900 p.m. In some embodiments, the adhesive layer 26 has a thickness of 150 m to 850 p.m. In some embodiments, the adhesive layer 26 has a thickness of 150 p.m to 800 p.m. In some embodiments, the adhesive layer 26 has a thickness of 150 in to 750 p.m. In some embodiments, the adhesive layer 26 has a thickness of 150 p.m to 700 p.m. In some embodiments, the adhesive layer 26 has a thickness of 150 p.m to 650 p.m. In some embodiments, the adhesive layer 26 has a thickness of 150 p.m to 600 p.m. In some embodiments, the adhesive layer 26 has a thickness of 150 p.m to 550 p.m. In some embodiments, the adhesive layer 26 has a thickness of 150 p.m to 500 p.m. In some embodiments, the adhesive layer 26 has a thickness of 150 pm to 450 pm. In some embodiments, the adhesive layer 26 has a thickness of 150 pm to 400 pm. In some embodiments, the adhesive layer 26 has a thickness of 150 pm to 350 pm In some embodiments, the adhesive layer 26 has a thickness of 150 pm to 300 pm. In some embodiments, the adhesive layer 26 has a thickness of 150 pm to 250 p.m. In some embodiments, the adhesive layer 26 has a thickness of 150 pm to 200 pm.
In some embodiments, the adhesive layer 26 has a thickness of 200 pm to 900 pm. In some embodiments, the adhesive layer 26 has a thickness of 200 p.m to 850 p.m. In some embodiments, the adhesive layer 26 has a thickness of 200 pm to 800 p.m. In some embodiments, the adhesive layer 26 has a thickness of 200 m to 750 pm. In some embodiments, the adhesive layer 26 has a thickness of 200 p.m to 700 p.m. In some embodiments, the adhesive layer 26 has a thickness of 200 pm to 650 p.m. In some embodiments, the adhesive layer 26 has a thickness of 200 pm to 600 m. In some embodiments, the adhesive layer 26 has a thickness of 200 pm to 550 m. In some embodiments, the adhesive layer 26 has a thickness of 200 pm to 500 pm. In some embodiments, the adhesive layer 26 has a thickness of 200 i.tm to 450 1.1m. In some embodiments, the adhesive layer 26 has a thickness of 200 [im to 400 p.m. In some embodiments, the adhesive layer 26 has a thickness of 200 pm to 350 [tm. In some embodiments, the adhesive layer 26 has a thickness of 200 pm to 300 pm. In some embodiments, the adhesive layer 26 has a thickness of 200 pm to 250 In some embodiments, the adhesive layer 26 has a thickness of 250 pm to 900 pm. In some embodiments, the adhesive layer 26 has a thickness of 250 m to 850 pm. In some embodiments, the adhesive layer 26 has a thickness of 250 pm to 800 p.m. In some embodiments, the adhesive layer 26 has a thickness of 250 m to 750 pm. In some embodiments, the adhesive layer 26 has a thickness of 250 pm to 700 p.m. In some embodiments, the adhesive layer 26 has a thickness of 250 m to 650 m. In some embodiments, the adhesive layer 26 has a thickness of 250 m to 600 m. In some embodiments, the adhesive layer 26 has a thickness of 250 p,m to 550 pm. In some embodiments, the adhesive layer 26 has a thickness of 250 pm to 500 pm In some embodiments, the adhesive layer 26 has a thickness of 250 p.m to 450 p.m. In some embodiments, the adhesive layer 26 has a thickness of 250 m to 400 pm. In some embodiments, the adhesive layer 26 has a thickness of 250 p.m to 350 p.m. In some embodiments, the adhesive layer 26 has a thickness of 250 p.m to 300 jam.
In some embodiments, the adhesive layer 26 has a thickness of 300 p.m to 900 p.m. In some embodiments, the adhesive layer 26 has a thickness of 300 in to 850 p.m. In some embodiments, the adhesive layer 26 has a thickness of 300 m to 800 m. In some embodiments, the adhesive layer 26 has a thickness of 300 p,m to 750 p.m. In some embodiments, the adhesive layer 26 has a thickness of 300 p.m to 700 pm. In some embodiments, the adhesive layer 26 has a thickness of 300 p,m to 650 pm. In some embodiments, the adhesive layer 26 has a thickness of 300 pm to 600 m. In some embodiments, the adhesive layer 26 has a thickness of 300 p,m to 550 p,m. In some embodiments, the adhesive layer 26 has a thickness of 300 m to 500 m. In some embodiments, the adhesive layer 26 has a thickness of 300 p.m to 450 p.m. In some embodiments, the adhesive layer 26 has a thickness of 300 m to 400 p.m. In some embodiments, the adhesive layer 26 has a thickness of 300 p.m to 350 p.m.
In some embodiments, the adhesive layer 26 has a thickness of 350 jim to 900 p.m. In some embodiments, the adhesive layer 26 has a thickness of 350 m to 850 p.m. In some embodiments, the adhesive layer 26 has a thickness of 350 p.m to 800 p.m. In some embodiments, the adhesive layer 26 has a thickness of 350 m to 750 .m. In some embodiments, the adhesive layer 26 has a thickness of 350 p.m to 700 p.m. In some embodiments, the adhesive layer 26 has a thickness of 350 tm to 650 pm. In some embodiments, the adhesive layer 26 has a thickness of 350 tm to 600 pm. In some embodiments, the adhesive layer 26 has a thickness of 350 p,m to 550 p,m. In some embodiments, the adhesive layer 26 has a thickness of 350 pm to 500 pm In some embodiments, the adhesive layer 26 has a thickness of 350 p.m to 450 p.m. In some embodiments, the adhesive layer 26 has a thickness of 350 p.m to 400 p.m.
In some embodiments, the adhesive layer 26 has a thickness of 400 p.m to 900 p.m. In some embodiments, the adhesive layer 26 has a thickness of 400 p.m to 850 p.m. In some embodiments, the adhesive layer 26 has a thickness of 400 p.m to 800 p.m. In some embodiments, the adhesive layer 26 has a thickness of 400 pm to 750 pm. In some embodiments, the adhesive layer 26 has a thickness of 400 p,m to 700 p.m. In some embodiments, the adhesive layer 26 has a thickness of 400 p..m to 650 p.m. In some embodiments, the adhesive layer 26 has a thickness of 400 p.m to 600 pm. In some embodiments, the adhesive layer 26 has a thickness of 400 p.m to 550 pm. In some embodiments, the adhesive layer 26 has a thickness of 400 p,m to 500 pm. In some embodiments, the adhesive layer 26 has a thickness of 400 pm to 450 rim.
In some embodiments, the adhesive layer 26 has a thickness of 450 tim to 900 pm. In some embodiments, the adhesive layer 26 has a thickness of 450 pm to 850 p.m. In some embodiments, the adhesive layer 26 has a thickness of 450 p.m to 800 p.m. In some embodiments, the adhesive layer 26 has a thickness of 450 pm to 750 pm. In some embodiments, the adhesive layer 26 has a thickness of 450 p,m to 700 p.m. In some embodiments, the adhesive layer 26 has a thickness of 450 p.m to 650 p.m. In some embodiments, the adhesive layer 26 has a thickness of 450 p.m to 600 p.m. In some embodiments, the adhesive layer 26 has a thickness of 450 p.m to 550 p.m. In some embodiments, the adhesive layer 26 has a thickness of 450 p.m to 500 p.m.
In some embodiments, the adhesive layer 26 has a thickness of 500 jim to 900 pm. In some embodiments, the adhesive layer 26 has a thickness of 500 pm to 850 pm. In some embodiments, the adhesive layer 26 has a thickness of 500 !Am to 800 p.m. In some embodiments, the adhesive layer 26 has a thickness of 500 jm to 750 pm In some embodiments, the adhesive layer 26 has a thickness of 500 [tm to 700 ?Am. In some embodiments, the adhesive layer 26 has a thickness of 500 pm to 650 p.m. In some embodiments, the adhesive layer 26 has a thickness of 500 pm to 600 p.m. In some embodiments, the adhesive layer 26 has a thickness of 500 p.m to 550 pm.
In some embodiments, the adhesive layer 26 has a thickness of 550 p.m to 900 pm. In some embodiments, the adhesive layer 26 has a thickness of 550 in to 850 p.m. In some embodiments, the adhesive layer 26 has a thickness of 550 pm to 800 p.m. In some embodiments, the adhesive layer 26 has a thickness of 550 in to 750 p.m. In some embodiments, the adhesive layer 26 has a thickness of 550 pm to 700 p.m. In some embodiments, the adhesive layer 26 has a thickness of 550 p.m to 650 pm. In some embodiments, the adhesive layer 26 has a thickness of 550 p.m to 600 f1111.
In some embodiments, the adhesive layer 26 has a thickness of 600 tm to 900 pm. In some embodiments, the adhesive layer 26 has a thickness of 600 l_tm to 850 vim. In some embodiments, the adhesive layer 26 has a thickness of 600 pm to 800 p.m. In some embodiments, the adhesive layer 26 has a thickness of 600 p.m to 750 p.m. In some embodiments, the adhesive layer 26 has a thickness of 600 p.m to 700 p.m. In some embodiments, the adhesive layer 26 has a thickness of 600 pm to 650 !Am.
In some embodiments, the adhesive layer 26 has a thickness of 650 p.m to 900 pm. In some embodiments, the adhesive layer 26 has a thickness of 650 in to 850 p.m. In some embodiments, the adhesive layer 26 has a thickness of 650 pm to 800 p.m. In some embodiments, the adhesive layer 26 has a thickness of 650 pm to 750 jam. In some embodiments, the adhesive layer 26 has a thickness of 650 p.m to 700 pm. In some embodiments, the adhesive layer 26 has a thickness of 700 p.m to 900 p.m. In some embodiments, the adhesive layer 26 has a thickness of 700 !Am to 850 pm In some embodiments, the adhesive layer 26 has a thickness of 700 pm to 800 pm In some embodiments, the adhesive layer 26 has a thickness of 700 in to 750 ?Am. In some embodiments, the adhesive layer 26 has a thickness of 750 m to 900 p.m. In some embodiments, the adhesive layer 26 has a thickness of 750 rn to 850 m. In some embodiments, the adhesive layer 26 has a thickness of 750 p.m to 800 p.m. In some embodiments, the adhesive layer 26 has a thickness of 800 ?Am to 900 ?Am. In some embodiments, the adhesive layer 26 has a thickness of 800 ?Am to 850 p.m. In some embodiments, the adhesive layer 26 has a thickness of 850 p.m to 900 m.
In some embodiments, the adhesive layer 26 has a thickness of 1 m. In some embodiments, the adhesive layer 26 has a thickness of 50 p.m. In some embodiments, the adhesive layer 26 has a thickness of 100 m. In some embodiments, the adhesive layer 26 has a thickness of 1 m. In some embodiments, the adhesive layer 26 has a thickness of 150 p.m. In some embodiments, the adhesive layer 26 has a thickness of 200 m. In some embodiments, the adhesive layer 26 has a thickness of 250 tim. In some embodiments, the adhesive layer 26 has a thickness of 300 p.m. In some embodiments, the adhesive layer 26 has a thickness of 350 p.m. In some embodiments, the adhesive layer 26 has a thickness of 400 ?Am. In some embodiments, the adhesive layer 26 has a thickness of 450 p.m. In some embodiments, the adhesive layer 26 has a thickness of 500 pm. In some embodiments, the adhesive layer 26 has a thickness of 550 p.m. In some embodiments, the adhesive layer 26 has a thickness of 600 pm. In some embodiments, the adhesive layer 26 has a thickness of 650 p.m. In some embodiments, the adhesive layer 26 has a thickness of 700 p.m. In some embodiments, the adhesive layer 26 has a thickness of 750 m. In some embodiments, the adhesive layer 26 has a thickness of 800 p.m. In some embodiments, the adhesive layer 26 has a thickness of 850 1.1.m. In some embodiments, the adhesive layer 26 has a thickness of 900 lam.
In some embodiments, the polymer layer 24 includes a fluoropolymer. In certain embodiments, the fluoropolymer may be ethylene tetrafluoroethylene (ETFE), fluoropolymer is polyvinylidene fluoride (PVDF), tetrafluoroethylene-hexafluoropropylene copolymers (FEP), and tetrafluoroethylene-hexafluoropropylene-vinylidene fluoride copolymers (THY), polyvinyl fluoride (PVF), or blends thereof. In some embodiments, the frontsheet includes fluoropolymers, acrylics, polyesters, silicones, polycarbonates, or combinations thereof In other embodiments, the polymer layer 24 includes polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyetheretherketone (PEEK), polyaryletherketone (PAEK), polyarylate (PAR), polyetherimide (PEI), polyarylsulfone (PAS), polyethersulfone (PES), polyamideimide (PAT), polyphenylsulfone (PPSU), polyolefin, cyclic olefin copolymers (CPCs), or polyimide. In some embodiments, the polymer layer 24 includes a crosslinked polymeric material. In some embodiments, 50% to 99%
of the polymer chains of the polymeric material are crosslinked.
In some embodiments, the polymer layer 24 has a thickness of 0.01 mm to 0.5 mm. In some embodiments, the polymer layer 24 has a thickness of 0.01 mm to 0.4 mm.
In some embodiments, the polymer layer 24 has a thickness of 0.01 mm to 0.3 mm. In some embodiments, the polymer layer 24 has a thickness of 0.01 mm to 0.2 mm. In some embodiments, the polymer layer 24 has a thickness of 0.01 mm to 0.1 mm. In some embodiments, the polymer layer 24 has a thickness of 0.01 mm to 0.09 mm. In some embodiments, the polymer layer 24 has a thickness of 0.01 mm to 0.08 mm. In some embodiments, the polymer layer 24 has a thickness of 0.01 mm to 0.07 mm. In some embodiments, the polymer layer 24 has a thickness of 0.01 mm to 0.06 mm.
In some embodiments, the polymer layer 24 has a thickness of 0.01 mm to 0.05 mm. In some embodiments, the polymer layer 24 has a thickness of 0.01 mm to 0.04 mm. In some embodiments, the polymer layer 24 has a thickness of 0.01 mm to 0.03 min_ In some embodiments, the polymer layer 24 has a thickness of 0.01 mm to 0.02 mm.
In some embodiments, the polymer layer 24 has a thickness of 0.01 mm to 0.4 mm. In some embodiments, the polymer layer 24 has a thickness of 0.02 mm to 0.4 mm.
In some embodiments, the polymer layer 24 has a thickness of 0.03 mm to 0.4 mm. In some embodiments, the polymer layer 24 has a thickness of 0.04 mm to 0.4 mm. In some embodiments, the polymer layer 24 has a thickness of 0.05 mm to 0.4 mm. In some embodiments, the polymer layer 24 has a thickness of 0.06 mm to 0.4 mm. In some embodiments, the polymer layer 24 has a thickness of 0.07 mm to 0.4 mm. In some embodiments, the polymer layer 24 has a thickness of 0.08 mm to 0.4 mm. In some embodiments, the polymer layer 24 has a thickness of 0.09 mm to 0.4 mm. In some embodiments, the polymer layer 24 has a thickness of 0.1 mm to 0.4 mm. In some embodiments, the polymer layer 24 has a thickness of 0.15 mm to 0.4 mm. In some embodiments, the polymer layer 24 has a thickness of 0.2 mm to 0.4 mm. In some embodiments, the polymer layer 24 has a thickness of 0.25 mm to 0.4 mm. In some embodiments, the polymer layer 24 has a thickness of 0.3 mm to 0.4 mm. In some embodiments, the polymer layer 24 has a thickness of 0.35 mm to 0.4 mm.
In some embodiments, the polymer layer 24 has a thickness of 0.025 mm to 0.1 mm. In some embodiments, the polymer layer 24 has a thickness of 0.03 mm to 0.1 mm.
In some embodiments, the polymer layer 24 has a thickness of 0.035 mm to 0.1 mm. In some embodiments, the polymer layer 24 has a thickness of 0.04 mm to 0.1 mm. In some embodiments, the polymer layer 24 has a thickness of 0.045 mm to 0.1 mm. In some embodiments, the polymer layer 24 has a thickness of 0.05 mm to 0.1 mm. In some embodiments, the polymer layer 24 has a thickness of 0.06 mm to 0.1 mm. In some embodiments, the polymer layer 24 has a thickness of 0.065 mm to 0 1 mm In some embodiments, the polymer layer 24 has a thickness of 007 mm to 0 1 mm In some embodiments, the polymer layer 24 has a thickness of 0.075 mm to 0.1 mm.
In some embodiments, the polymer layer 24 has a thickness of 0.08 mm to 0.1 mm. In some embodiments, the polymer layer 24 has a thickness of 0.085 mm to 0.1 mm. In some embodiments, the polymer layer 24 has a thickness of 0.09 mm to 0.1 mm. In some embodiments, the polymer layer 24 has a thickness of 0.095 mm to 0.1 mm.
In some embodiments, the frontsheet 16 includes only the glass layer 22. In some embodiments, the frontsheet 16 includes only the polymer layer 24.
Referring to FIGS. 1, 3A and 3B, in some embodiments, a backsheet 28 is juxtaposed with a second surface of the encapsulant 14. In some embodiments, the backsheet 28 includes a first surface 30, a second surface 32 opposite the first surface 30, a first side 34, a second side 36 opposite the first side 34, a first edge 38 extending from the first side 34 to the second side 36, and a second edge 40 opposite the first edge 38 and extending from the first side 34 to the second side 36.
In some embodiments, the backsheet 28 includes a first section 42 and a second section 44.
In some embodiments, the first section 42 is transparent. In some embodiments, the second section 44 is non-transparent (opaque). In some embodiments, the first section 42 extends from the first edge 38 to a first location 46 intermediate the first edge 38 and the second edge 40. In some embodiments, the first section 42 extends from the first edge 38 to the first location 46 and from the first side 34 to the second side 36. In some embodiments, the first section 42 extends from the first edge 38 to the first location 46, from the first side 34 to the second side 36, and from the first surface 30 to the second surface 32. In some embodiments, the second section 44 extends from the first location 46 to the second edge 40. In some embodiments, the second section 44 extends from the first location 46 to the second edge 40 and from the first side 34 to the second side 36 In some embodiments, the second section 44 extends from the first location 46 to the second edge 40, from the first side 34 to the second side 36, and from the first surface 30 to the second surface 32.
In some embodiments, the first section 42 includes a width WI measured from the first edge 38 to the first location 46. In some embodiments, the width WI is 5 mm to 30 mm. In some embodiments, the width WI is 5 mm to 25 mm. In some embodiments, the width WI
is 5 mm to 20 mm. In some embodiments, the width WI is 5 mm to 15 mm. In some embodiments, the width WI is 5 mm to 10 mm. In some embodiments, the width WI is 10 mm to 30 mm. In some embodiments, the width WI is 10 mm to 25 mm. In some embodiments, the width WI
is 10 mm to 20 mm. In some embodiments, the width WI is 10 mm to 15 mm. In some embodiments, the width WI is 15 mm to 30 mm. In some embodiments, the width WI is 15 mm to 25 mm. In some embodiments, the width WI is 15 mm to 20 mm. In some embodiments, the width WI
is 20 mm to 30 mm. In some embodiments, the width WI is 20 mm to 25 mm. In some embodiments, the width WI is 25 mm to 30 mm. In some embodiments, the width WI is 5 mm. In some embodiments, the width WI is 10 mm. In some embodiments, the width WI is 15 mm. In some embodiments, the width WI is 20 mm. In some embodiments, the width WI is 25 mm. In some embodiments, the width WI is 30 mm.
Referring to FIG. 3B, in some embodiments, the backsheet 28 includes a third section 48 that extends from the second edge 40 to a second location 50 intermediate the second edge 40 and the first edge 38. In some embodiments, the third section 48 extends from the second edge 40 to the second location 50 and from the first side 34 to the second side 36. In some embodiments, the third section 48 extends from the second edge 40 to the second location 50, from the first side 34 to the second side 36, and from the first surface 30 to the second surface 32 In some embodiments, the second section 44 extends from the first location 46 to the second location 50. In some embodiments, the second section 44 extends from the first location 46 to the second location 50 and from the first side 34 to the second side 36.
In some embodiments, the second section 44 extends from the first location 46 to the second location 50, from the first side 34 to the second side 36, and from the first surface 30 to the second surface 32.
In some embodiments, the backsheet 28 includes thermoplastic polyolefin (TPO).
In some embodiments, the backsheet 28 includes a single ply TPO roofing membrane. In other embodiments, non-limiting examples of TPO membranes are disclosed in U.S.
Patent No.
9,359,014 to Yang et al., which is incorporated by reference herein in its entirety. In some embodiments, the backsheet 28 includes polyvinyl chloride. In some embodiments, the backsheet 28 includes ethylene propylene diene monomer (EPDM) rubber. In some embodiments, the backsheet 28 includes a flame retardant additive. In some embodiments, the flame retardant additive may be clays, nanoclays, silicas, carbon black, metal hydroxides such as aluminum hydroxide, metal foils, graphite, and combinations thereof. In some embodiments, the backsheet 28 includes polyethylene terephthalate (PET). In some embodiments, the backsheet 28 includes ethylene tetrafluoroethylene (ETFE). In some embodiments, the backsheet 28 includes tetrafluoroethylene-hexafluoropropylene copolymers (FEP). In some embodiments, the backsheet 28 includes ethylene chlorotrifluoroethylene (ECTFE).
In some embodiments, the backsheet 28 has a thickness of 2 mil to 100 mil. In some embodiments, the backsheet 28 has a thickness of 2 mil to 90 mil. In some embodiments, the backsheet 28 has a thickness of 2 mil to 80 mil. In some embodiments, the backsheet 28 has a thickness of 2 mil to 70 mil. In some embodiments, the backsheet 28 has a thickness of 2 mil to 60 mil In some embodiments, the backsheet 28 has a thickness of 2 mil to 50 mil In some embodiments, the backsheet 28 has a thickness of 2 mil to 40 mil. In some embodiments, the backsheet 28 has a thickness of 2 mil to 30 mil. In some embodiments, the backsheet 28 has a thickness of 2 mil to 20 mil. In some embodiments, the backsheet 28 has a thickness of 2 mil to mil. In some embodiments, the backsheet 28 has a thickness of 10 mil to 100 mil. In some embodiments, the backsheet 28 has a thickness of 10 mil to 90 mil. In some embodiments, the backsheet 28 has a thickness of 10 mil to 80 mil. In some embodiments, the backsheet 28 has a thickness of 10 mil to 70 mil. In some embodiments, the backsheet 28 has a thickness of 10 mil 10 to 60 mil. In some embodiments, the backsheet 28 has a thickness of 10 mil to 50 mil. In some embodiments, the backsheet 28 has a thickness of 10 mil to 40 mil. In some embodiments, the backsheet 28 has a thickness of 10 mil to 30 mil. In some embodiments, the backsheet 28 has a thickness of 10 mil to 20 mil.
In some embodiments, the backsheet 28 has a thickness of 20 mil to 100 mil. In some embodiments, the backsheet 28 has a thickness of 20 mil to 90 mil. In some embodiments, the backsheet 28 has a thickness of 20 mil to 80 mil. In some embodiments, the backsheet 28 has a thickness of 20 mil to 70 mil. In some embodiments, the backsheet 28 has a thickness of 20 mil to 60 mil. In some embodiments, the backsheet 28 has a thickness of 20 mil to 50 mil. In some embodiments, the backsheet 28 has a thickness of 20 mil to 40 mil. In some embodiments, the backsheet 28 has a thickness of 20 mil to 30 mil. In some embodiments, the backsheet 28 has a thickness of 30 mil to 100 mil. In some embodiments, the backsheet 28 has a thickness of 30 mil to 90 mil. In some embodiments, the backsheet 28 has a thickness of 30 mil to 80 mil. In some embodiments, the backsheet 28 has a thickness of 30 mil to 70 mil. In some embodiments, the backsheet 28 has a thickness of 30 mil to 60 mil. In some embodiments, the backsheet 28 has a thickness of 30 mil to 50 mil In some embodiments, the backsheet 28 has a thickness of 30 mil to 40 mil.
In some embodiments, the backsheet 28 has a thickness of 40 mil to 100 mil. In some embodiments, the backsheet 28 has a thickness of 40 mil to 90 mil. In some embodiments, the backsheet 28 has a thickness of 40 mil to 80 mil. In some embodiments, the backsheet 28 has a thickness of 40 mil to 70 mil. In some embodiments, the backsheet 28 has a thickness of 40 mil to 60 mil. In some embodiments, the backsheet 28 has a thickness of 40 mil to 50 mil. In some embodiments, the backsheet 28 has a thickness of 50 mil to 100 mil. In some embodiments, the backsheet 28 has a thickness of 50 mil to 90 mil. In some embodiments, the backsheet 28 has a thickness of 50 mil to 80 mil. In some embodiments, the backsheet 28 has a thickness of 50 mil to 70 mil. In some embodiments, the backsheet 28 has a thickness of 50 mil to 60 mil.
In some embodiments, the backsheet 28 has a thickness of 60 mil to 100 mil. In some embodiments, the backsheet 28 has a thickness of 60 mil to 90 mil. In some embodiments, the backsheet 28 has a thickness of 60 mil to 80 mil. In some embodiments, the backsheet 28 has a thickness of 60 mil to 70 mil. In some embodiments, the backsheet 28 has a thickness of 70 mil to 100 mil. In some embodiments, the backsheet 28 has a thickness of 70 mil to 90 mil. In some embodiments, the backsheet 28 has a thickness of 70 mil to 80 mil. In some embodiments, the backsheet 28 has a thickness of 80 mil to 100 mil. In some embodiments, the backsheet 28 has a thickness of 80 mil to 90 mil. In some embodiments, the backsheet 28 has a thickness of 90 mil to 100 mil.
In some embodiments, the backsheet 28 has a thickness of 2 mil. In some embodiments, the backsheet 28 has a thickness of 10 mil. In some embodiments, the backsheet 28 has a thickness of 20 mil. In some embodiments, the backsheet 28 has a thickness of 30 mil. In some embodiments, the backsheet 28 has a thickness of 40 miL In some embodiments, the backsheet 28 has a thickness of 50 mil. In some embodiments, the backsheet 28 has a thickness of 60 mil.
In some embodiments, the backsheet 28 has a thickness of 10 mil. In some embodiments, the backsheet 28 has a thickness of 70 mil. In some embodiments, the backsheet 28 has a thickness of 80 mil. In some embodiments, the backsheet 28 has a thickness of 90 mil. In some embodiments, the backsheet 28 has a thickness of 100 mil.
In some embodiments, the second section 44 of the backsheet 28 is painted. In some embodiments, the second section 44 of the backsheet 28 is painted an opaque color. In some embodiments, the second section 44 of the backsheet 28 includes an opaque color printed thereon.
Referring to FIG. 1, in some embodiments, the photovoltaic module 10 includes an adhesive 52. In some embodiments, the adhesive 52 is attached to the second surface 32 of the backsheet 28. In some embodiments, the adhesive 52 is transparent. In some embodiments, the adhesive 52 is located proximate to the first section 42. In some embodiments, the adhesive 52 is juxtaposed with the first section 42. In some embodiments, edges 54a, 54b of the adhesive 52 are substantially aligned with corresponding edges 56a, 56b of the first section 42. In some embodiments, the edges 54a, 54b of the adhesive 52 are aligned with the edges 56a, 56b of the first section 42.
In some embodiments, the adhesive 52 is located proximate to the third section 48. In some embodiments, the adhesive 52 is juxtaposed with the third section 48. In some embodiments, the edges 54a, 54b of the adhesive 52 are substantially aligned with edges 58a, 58b of the third section 48. In some embodiments, the edges 54a, 54b of the adhesive 52 are aligned with the edges 58a, 58b of the third section 48.
In some embodiments, the adhesive 52 is silicone. In some embodiments, the adhesive 52 is a tape In some embodiments, the adhesive 52 is VEIB tape supplied by 3M In some embodiments, the adhesive 52 is an acrylic adhesive. In some embodiments, the adhesive 52 is a urethane adhesive. In some embodiments, the adhesive 52 is an epoxy. In some embodiments, the adhesive 52 is butyl. In some embodiments, the adhesive 52 is a poly-vinyl acetate (PVA) adhesive.
In some embodiments, the adhesive 52 is applied to the photovoltaic module 10 during the manufacture thereof. In some embodiments, the adhesive 52 is applied to the photovoltaic module during the installation of the photovoltaic module 10 on a roof deck.
In some embodiments, the adhesive 52 has a thickness of 1 mil to 100 mil. In some embodiments, the adhesive 52 has a thickness of 1 mil to 90 mil. In some embodiments, the adhesive 52 has a thickness of 1 mil to 80 mil. In some embodiments, the adhesive 52 has a thickness of 1 mil to 70 mil. In some embodiments, the adhesive 52 has a thickness of 1 mil to 60 mil. In some embodiments, the adhesive 52 has a thickness of 1 mil to 50 mil.
In some embodiments, the adhesive 52 has a thickness of 1 mil to 40 mil. In some embodiments, the adhesive 52 has a thickness of 1 mil to 30 mil. In some embodiments, the adhesive 52 has a thickness of 1 mil to 20 mil. In some embodiments, the adhesive 52 has a thickness of 1 mil to 10 mil.
In some embodiments, the adhesive 52 has a thickness of 10 mil to 100 mil. In some embodiments, the adhesive 52 has a thickness of 10 mil to 90 mil. In some embodiments, the adhesive 52 has a thickness of 10 mil to 80 mil. In some embodiments, the adhesive 52 has a thickness of 10 mil to 70 mil. In some embodiments, the adhesive 52 has a thickness of 10 mil to 60 mil. In some embodiments, the adhesive 52 has a thickness of 10 mil to 50 mil. In some embodiments, the adhesive 52 has a thickness of 10 mil to 40 mil. In some embodiments, the adhesive 52 has a thickness of 10 mil to 30 mil In some embodiments, the adhesive 52 has a thickness of 10 mil to 20 mil.
In some embodiments, the adhesive 52 has a thickness of 20 mil to 100 mil. In some embodiments, the adhesive 52 has a thickness of 20 mil to 90 mil. In some embodiments, the adhesive 52 has a thickness of 20 mil to 80 mil. In some embodiments, the adhesive 52 has a thickness of 20 mil to 70 mil. In some embodiments, the adhesive 52 has a thickness of 20 mil to 60 mil. In some embodiments, the adhesive 52 has a thickness of 20 mil to 50 mil. In some embodiments, the adhesive 52 has a thickness of 20 mil to 40 mil. In some embodiments, the adhesive 52 has a thickness of 20 mil to 30 mil.
In some embodiments, the adhesive 52 has a thickness of 30 mil to 100 mil. In some embodiments, the adhesive 52 has a thickness of 30 mil to 90 mil. In some embodiments, the adhesive 52 has a thickness of 30 mil to 80 mil. In some embodiments, the adhesive 52 has a thickness of 30 mil to 70 mil. In some embodiments, the adhesive 52 has a thickness of 30 mil to 60 mil. In some embodiments, the adhesive 52 has a thickness of 30 mil to 50 mil. In some embodiments, the adhesive 52 has a thickness of 30 mil to 40 mil.
In some embodiments, the adhesive 52 has a thickness of 40 mil to 100 mil. In some embodiments, the adhesive 52 has a thickness of 40 mil to 90 mil. In some embodiments, the adhesive 52 has a thickness of 40 mil to 80 mil. In some embodiments, the adhesive 52 has a thickness of 40 mil to 70 mil. In some embodiments, the adhesive 52 has a thickness of 40 mil to 60 mil. In some embodiments, the adhesive 52 has a thickness of 40 mil to 50 mil. In some embodiments, the adhesive 52 has a thickness of 50 mil to 100 mil. In some embodiments, the adhesive 52 has a thickness of 50 mil to 90 mil. In some embodiments, the adhesive 52 has a thickness of 50 mil to 80 mil. In some embodiments, the adhesive 52 has a thickness of 50 mil to 70 mil In some embodiments, the adhesive 52 has a thickness of 50 mil to 60 mil In some embodiments, the adhesive 52 has a thickness of 60 mil to 100 mil. In some embodiments, the adhesive 52 has a thickness of 60 mil to 90 mil. In some embodiments, the adhesive 52 has a thickness of 60 mil to 80 mil. In some embodiments, the adhesive 52 has a thickness of 60 mil to 70 mil. In some embodiments, the adhesive 52 has a thickness of 70 mil to 100 mil. In some embodiments, the adhesive 52 has a thickness of 70 mil to 90 mil. In some embodiments, the adhesive 52 has a thickness of 70 mil to 80 mil. In some embodiments, the adhesive 52 has a thickness of 80 mil to 100 mil. In some embodiments, the adhesive 52 has a thickness of 80 mil to 90 mil. In some embodiments, the adhesive 52 has a thickness of 90 mil to 100 mil.
In some embodiments, the adhesive 52 has a thickness of 1 mil. In some embodiments, the adhesive 52 has a thickness of 10 mil. In some embodiments, the adhesive 52 has a thickness of 20 mil. In some embodiments, the adhesive 52 has a thickness of 30 mil. In some embodiments, the adhesive 52 has a thickness of 40 mil. In some embodiments, the adhesive 52 has a thickness of 50 mil. In some embodiments, the adhesive 52 has a thickness of 60 mil. In some embodiments, the adhesive 52 has a thickness of 70 mil. In some embodiments, the adhesive 52 has a thickness of 80 mil. In some embodiments, the adhesive 52 has a thickness of 90 mil. In some embodiments, the adhesive 52 has a thickness of 100 mil.
In some embodiments, the adhesive 52 optically couples the photovoltaic module 10 with another photovoltaic module. In some embodiments, the adhesive 52 mechanically couples the photovoltaic module 10 with another photovoltaic module overlayed by the photovoltaic module 10. As used herein and with respect to certain embodiments of the photovoltaic module 10, the term "optically couples- means each of a first photovoltaic module and a second photovoltaic module include a stnicture and an installed position such that solar light is capable of being transmitted through the first photovoltaic module to the second photovoltaic module.
In some embodiments, the adhesive 52 has a solar weighted transmission of 50%
to 100%.
In some embodiments, the adhesive 52 has a solar weighted transmission of 50%
to 95%. In some embodiments, the adhesive 52 has a solar weighted transmission of 50% to 90%.
In some embodiments, the adhesive 52 has a solar weighted transmission of 50% to 80%.
In some embodiments, the adhesive 52 has a solar weighted transmission of 50% to 70%.
In some embodiments, the adhesive 52 has a solar weighted transmission of 50% to 60%.
In some embodiments, the adhesive 52 has a solar weighted transmission of 60% to 100%
In some embodiments, the adhesive 52 has a solar weighted transmission of 60% to 90%.
In some embodiments, the adhesive 52 has a solar weighted transmission of 60% to 80%.
In some embodiments, the adhesive 52 has a solar weighted transmission of 60% to 70%.
In some embodiments, the adhesive 52 has a solar weighted transmission of 70% to 100%
In some embodiments, the adhesive 52 has a solar weighted transmission of 70% to 90%.
In some embodiments, the adhesive 52 has a solar weighted transmission of 70% to 80%.
In some embodiments, the adhesive 52 has a solar weighted transmission of 80% to 100%
In some embodiments, the adhesive 52 has a solar weighted transmission of 80% to 90%.
In some embodiments, the adhesive 52 has a solar weighted transmission of 90% to 100%
In some embodiments, the adhesive 52 has a solar weighted transmission of 50%.
In some embodiments, the adhesive 52 has a solar weighted transmission of 60%. In some embodiments, the adhesive 52 has a solar weighted transmission of 70%. In some embodiments, the adhesive 52 has a solar weighted transmission of 80%. In some embodiments, the adhesive 52 has a solar weighted transmission of 90%. In some embodiments, the adhesive 52 has a solar weighted transmission of 95% In some embodiments, the adhesive 52 has a solar weighted transmission of 99.9%. In some embodiments, the adhesive 52 has a solar weighted transmission of 100%.
In some embodiments, the adhesive 52 has an index of refraction of 1 to 1.7.
In some embodiments, the adhesive 52 has an index of refraction of 1 to 1.6. In some embodiments, the adhesive 52 has an index of refraction of 1 to 1.5. In some embodiments, the adhesive 52 has an index of refraction of 1 to 1.4. In some embodiments, the adhesive 52 has an index of refraction of 1 to 1.3. In some embodiments, the adhesive 52 has an index of refraction of 1 to 1.2. In some embodiments, the adhesive 52 has an index of refraction of 1 to 1.1.
In some embodiments, the adhesive 52 has an index of refraction of 1.1 to 1.7.
In some embodiments, the adhesive 52 has an index of refraction of 1.1 to 1.6. In some embodiments, the adhesive 52 has an index of refraction of 1.1 to 1.5. In some embodiments, the adhesive 52 has an index of refraction of 1.1 to 1.4. In some embodiments, the adhesive 52 has an index of refraction of 1.1 to 1.3. In some embodiments, the adhesive 52 has an index of refraction of 1.1 to 12. In some embodiments, the adhesive 52 has an index of refraction of 1.2 to 1.7. In some embodiments, the adhesive 52 has an index of refraction of 1.2 to 1.6. In some embodiments, the adhesive 52 has an index of refraction of 1.2 to 1.5. In some embodiments, the adhesive 52 has an index of refraction of 1.2 to 1.4. In some embodiments, the adhesive 52 has an index of refraction of 1.2 to 1.3.
In some embodiments, the adhesive 52 has an index of refraction of 1.3 to 1.7.
In some embodiments, the adhesive 52 has an index of refraction of 1.3 to 1.6. In some embodiments, the adhesive 52 has an index of refraction of 1.3 to 1.5. In some embodiments, the adhesive 52 has an index of refraction of 1.3 to 1.4. In some embodiments, the adhesive 52 has an index of refraction of 1.4 to 1.7. In some embodiments, the adhesive 52 has an index of refraction of 1.4 to 1.6. In some embodiments, the adhesive 52 has an index of refraction of 1 4 to 1.5. In some embodiments, the adhesive 52 has an index of refraction of 1.5 to 1.7. In some embodiments, the adhesive 52 has an index of refraction of 1.5 to 1.6. In some embodiments, the adhesive 52 has an index of refraction of 1.6 to 1.7.
In some embodiments, the adhesive 52 has an index of refraction of I. In some embodiments, the adhesive 52 has an index of refraction of 1.1. In some embodiments, the adhesive 52 has an index of refraction of 1.2. In some embodiments, the adhesive 52 has an index of refraction of 1.3. In some embodiments, the adhesive 52 has an index of refraction of 1.4. In some embodiments, the adhesive 52 has an index of refraction of 1.5. In some embodiments, the adhesive 52 has an index of refraction of 1.6. In some embodiments, the adhesive 52 has an index of refraction of 1.7.
In some embodiments, at least one solar cell 12 includes a first end 60 and a second end 62 opposite the first end 60. In some embodiments, the first end 60 is located proximate to the first end 18 of the photovoltaic module 10. In some embodiments, the second end 62 is located proximate to the second end 20 of the photovoltaic module 10.
Referring to FIG. 4, in some embodiments, a transparent portion 64 (transparent edge) is formed by a portion of the frontsheet 16, a portion of the encapsulant 14, the first section 42 of the backsheet 28, and the adhesive 52. In some embodiments, the transparent portion 64 extends from the first surface 19 to a surface 23 of the adhesive 52. In some embodiments, a creepage distance D1 extends from the first end 18 of the photovoltaic module 10 to the first end 60 of the at least one solar cell 12. In some embodiments, the creepage distance D1 is equal to the width W1 of the first section 42 of the backsheet 28. In some embodiments, the creepage distance D1 extends from the second end 20 of the photovoltaic module 10 to the second end 62 of the at least one solar cell Referring to FIGS. 4 through 6, in some embodiments, a system includes a plurality of the photovoltaic modules 10 installed on a roof deck. In some embodiments, the plurality of photovoltaic modules 10 includes a first photovoltaic module 10a and a second photovoltaic module 10b. In some embodiments, a portion of the first photovoltaic module 10a overlays a portion of the second photovoltaic module 10b. In some embodiments, the first end 18 of the first photovoltaic module 10a overlays the second end 20 of the second photovoltaic module 10b. In some embodiments, the transparent portion 64 of the first photovoltaic module 10a overlays a portion of the at least one solar cell 12 at the second end 62 thereof. In some embodiments, the transparent portion 64 overlaps the at least one solar cell 12 at an overlap distance D2. In some embodiments, the overlap distance D2 is equal to the creepage distance Dl. In some embodiments, the overlap distance D2 is less than the creepage distance Dl. In some embodiments, the adhesive 52 of the first photovoltaic module 10a is attached to the first surface 19 of the second photovoltaic module 10b. In some embodiments, the total amount of overlap D3 of the first photovoltaic module 10a over the second photovoltaic module 10b is twice the creepage distance Dl. In some embodiments, the total amount of overlap D3 of the first photovoltaic module 10a over the second photovoltaic module 10b is approximately twice the creepage distance Dl. In some embodiments, the reveal 04 of the second photovoltaic module 10b is equal to the length of the at least one solar cell 12. In some embodiments, the reveal D4 of the second photovoltaic module 10b is approximately equal to the length of the at least one solar cell 12.
In some embodiments, solar light transmission L travels through transparent portion 64 (the frontsheet 16, the encapsulant 14, the first section 42 of the backsheet 28 and the adhesive 52) of the first photovoltaic module 10a and through the frontsheet 16 and the encapsulant 14 of the second photovoltaic module 10b to the at least one solar cell 12 of the second photovoltaic module 10b. In some embodiments, a power density (PD) of an array of the photovoltaic modules 10 is relative to the proportion of the area covered by solar cells U. In some embodiments, the power density (PD) is calculated as:
PD = n*S/(2C+n*S) where C = creepage distance D1, S = the length of the at least one solar cell 12, and n=
number of the photovoltaic modules 10 in the array. In some embodiments, for relatively large numbers of the photovoltaic modules 10 in the array (for example, with n = 10 or greater), the proportion of the total array height covered by the solar cells 12 approaches 100%. In some embodiments, if C= 15 mm, S = 166 mm, n = 10, then PD = 98%.
FIG. 6 shows an embodiment of a photovoltaic module 110. The photovoltaic module 110 has a structure and function similar to those of the photovoltaic module 10, with certain differences described below. In some embodiments, the photovoltaic module 110 includes at least one solar cell 112, an encapsulant 114 encapsulating the at least one solar cell 112, a frontsheet 116 juxtaposed with a first surface of the encapsulant 114, and a backsheet 128 juxtaposed with a second surface of the encapsulant 114. In some embodiments, the backsheet 128 is transparent.
In some embodiments, the entire area of the backsheet 128 is transparent.
In some embodiments, the photovoltaic module 110 includes an adhesive 152. In some embodiments, the adhesive 152 is attached to a surface 132 of the backsheet 128. In some embodiments, the adhesive 152 is transparent. In some embodiments, the adhesive 152 is located proximate to a first end 118 of the photovoltaic module 110. In some embodiments, the adhesive 152 is located proximate to a second end 120 of the photovoltaic module 110.
In some embodiments, a transparent portion 164 is formed by the frontsheet 116, the encapsulant 114, the backsheet 128, and the adhesive 152 In some embodiments, the transparent portion 164 extends from a first surface 119 to the second surface 121 of the photovoltaic module HO. In some embodiments, a creepage distance DI extends from the first end 118 of the photovoltaic module 110 to a first end 160 of the at least one solar cell 112.
FIG. 7 shows an embodiment of a photovoltaic module 210. The photovoltaic module 210 has a structure and function similar to those of the photovoltaic module 10, with certain differences described below. In some embodiments, the photovoltaic module 210 includes at least one solar cell 212, an encapsulant 214 encapsulating the at least one solar cell 212, and a frontsheet 216 juxtaposed with a first surface of the encapsulant 214. In some embodiments, a backsheet 228 is juxtaposed with a second surface of the encapsulant 214.
In some embodiments, the backsheet 228 includes a first layer 229 and a second layer 231.
In some embodiments, the first layer 229 is juxtaposed with the second surface of the encapsulant 214. In some embodiments, the first layer 229 extends from a first end 218 of the photovoltaic module 210 to a second end 220 of the photovoltaic module 210, In some embodiments, the first layer 229 is transparent. In some embodiments, the first layer 229 includes polyethylene terephthalate (PET).
In some embodiments, the first layer 229 includes ethylene tetrafluoroethylene (ETFE).
In some embodiments, the first layer 229 includes tetrafluoroethylene-hexafluoropropylene copolymers (FEP). In some embodiments, the first layer 229 includes ethylene chlorotrifluoroethylene (ECTFE).
In some embodiments, the second layer 231 is juxtaposed with the first layer 229. In some embodiments, the second layer 231 extends from the second end 220 to a first location 246 intermediate the first end 218 and the second end 220. In some embodiments, the second layer 231 is non-transparent. In some embodiments, the second layer 231 is attached to the first layer 229 by an adhesive layer 233W In some embodiments, the adhesive layer 233 extends from the second end 220 to the first location 246.
In some embodiments, an adhesive 252 is attached to a surface 232 of the first layer 229.
In some embodiments, the adhesive 252 extends from the first end 218 to the first location 246.
In some embodiments, the adhesive 252 is juxtaposed with an end of the second layer 231 and an end of the adhesive layer 233. In some embodiments, a thickness Ti of the adhesive 252 is equal to a total thickness of the second layer 2M and the adhesive layer 233. In some embodiments, the thickness Ti of the adhesive 252 is greater than a total thickness T2 of the second layer 231 and the adhesive layer 233. In some embodiments, the adhesive layer 233 is transparent. In some embodiments, the adhesive layer 233 has a structure similar to that of the adhesive layer 26. In some embodiments, the adhesive layer 233 is selected from the group consisting of polyvinyl butyrate, acrylic, silicone, and polycarbonate adhesives. In some embodiments, the adhesive layer 233 is selected from the group consisting of thermosetting polyolefin, thermosetting polyolefin encapsulant material, thermosetting ethylene-vinyl acetate (EVA), EVA
encapsulants, thermoplastic olefin, thermoplastic polyolefin (TPO) and hybrids and combinations thereof. In some embodiments, the adhesive layer 233 includes a thermosetting polyolefin encapsulant material. In some embodiments, the adhesive layer 233 includes a thickness of 1 um to 900 um.
In some embodiments, the adhesive layer 233 includes a thickness in the same subranges as identified above with respect to the adhesive layer 26.
In some embodiments, a transparent portion 264 is formed by a portion of the frontsheet 216, a portion of the encapsulant 214, a portion of the first layer 229 of the backsheet 228, and the adhesive 252. In some embodiments, the transparent portion 264 extends from a first surface 219 to a second surface 221 of the photovoltaic module 210. In some embodiments, a creepage distance D1 extends from the first end 218 of the photovoltaic module 210 to the first end 260 of the at least one solar cell 212. In some embodiments, the creepage distance D1 is equal to a width WI of the adhesive 252.
In some embodiments, the adhesive 252 is silicone. In some embodiments, the adhesive 252 is a tape. In some embodiments, the adhesive 252 is VHB tape supplied by 3M. In some embodiments, the adhesive 252 is an acrylic adhesive. In some embodiments, the adhesive 252 is a urethane adhesive. In some embodiments, the adhesive 252 is an epoxy. In some embodiments, the adhesive 252 is butyl. In some embodiments, the adhesive 252 is a poly-vinyl acetate (PVA) adhesive.In some embodiments, the adhesive 252 is applied to the photovoltaic module 210 during the manufacture thereof In some embodiments, the adhesive 252 is applied to the photovoltaic module 210 during the installation of the photovoltaic module 210 on a roof deck. In some embodiments, the adhesive 252 optically couples the photovoltaic module 210 with another photovoltaic module. In some embodiments, the adhesive 252 mechanically couples the photovoltaic module 210 with another photovoltaic module overlayed by the photovoltaic module 210.
FIG. 8 shows a side schematic view of embodiments of a system of a plurality of photovoltaic modules 310a, 310b. In some embodiments, the photovoltaic modules 310a, 310b have a structure, function and arrangement similar to those of the photovoltaic modules 10a, 10b, with certain differences described below. In some embodiments, the photovoltaic module 310a includes an encapsulant 314 having a surface 315 and a backsheet 328 juxtaposed with the surface 315 of the encapsulant 314. In some embodiments, the backsheet 328 includes a first surface 330, a second surface 332 opposite the first surface 330, a first edge 338, and a second edge 340 opposite the first edge 338. In some embodiments, the backsheet 328 is transparent. In some embodiments, the backsheet 328 is non-transparent In some embodiments, the backsheet 328 includes a beveled portion 345. In some embodiments, the beveled portion 345 extends from the first edge 338 to a location 347 intermediate the first edge 338 and the second edge 340. In some embodiments, the beveled portion 345 has a width Wl. In some embodiments, the width W1 extends from the first edge 338 to the location 347. In some embodiments, the width W1 is equal to an overlap distance D2. In some embodiments, the width W1 is substantially equal to the overlap distance D2. In some embodiments, the width W1 is greater than the overlap distance D2. In some embodiments, the width W1 is less than the overlap distance D2.
In some embodiments, the beveled portion 345 is beveled at an angle A of 5 degrees to 30 degrees relative to a lower surface 315 of the encapsulant 314. In some embodiments, the angle A is 5 degrees to 25 degrees. In some embodiments, the angle A is 5 degrees to 20 degrees. In some embodiments, the angle A is 5 degrees to 15 degrees. In some embodiments, the angle A is 5 degrees to 10 degrees. In some embodiments, the angle A is 10 degrees to 30 degrees. In some embodiments, the angle A is 10 degrees to 25 degrees. In some embodiments, the angle A is 10 degrees to 20 degrees. In some embodiments, the angle A is 10 degrees to 15 degrees. In some embodiments, the angle A is 15 degrees to 30 degrees. In some embodiments, the angle A is 15 degrees to 25 degrees. In some embodiments, the angle A is 15 degrees to 20 degrees. In some embodiments, the angle A is 20 degrees to 30 degrees. In some embodiments, the angle A is 20 degrees to 25 degrees. In some embodiments, the angle A is 25 degrees to 30 degrees.
In some embodiments, the photovoltaic modules 310a, 310b are installed on a roof deck surface of a steep slope roof. As defined herein, a "steep slope roof' is any roof substrate that is disposed on a roof having a pitch of Y/X, where Y and X are in a ratio of 2:12 to 18:12, where Y
corresponds to the "rise" of the roof, and where X corresponds to the "run" of the roof In some embodiments, Y and X are in a ratio of 5:12 to 12:12. In some embodiments, Y
and X are in a ratio of 6:12 to 12:12. In some embodiments, Y and X are in a ratio of 7:12 to 12:12. In some embodiments, Y and X are in a ratio of 6:12 to 12:12. In some embodiments, Y
and X are in a ratio of 8:12 to 12:12. In some embodiments, Y and X are in a ratio of 6:12 to 12:12.
In some embodiments, Y and X are in a ratio of 9:12 to 12:12. In some embodiments, Y and X are in a ratio of 10:12 to 12:12. In some embodiments, Y and X are in a ratio of
In some embodiments, the glass layer 22 has a thickness of 2.5 mm to 4 mm. In some embodiments, the glass layer 22 has a thickness of 2.5 mm to 3.5 mm. In some embodiments, the glass layer 22 has a thickness of 2.5 mm to 3 mm. In some embodiments, the glass layer 22 has a thickness of 3 mm to 4 mm. In some embodiments, the glass layer 22 has a thickness of 3.5 mm to 4 mm. In some embodiments, the glass layer 22 has a thickness of 2.6 mm to 3.5 mm. In some embodiments, the glass layer 22 has a thickness of 2.7 mm to 3.5 mm. In some embodiments, the glass layer 22 has a thickness of 2.8 mm to 3.5 mm. In some embodiments, the glass layer 22 has a thickness of 2.9 mm to 3.5 mm. In some embodiments, the glass layer 22 has a thickness of 3 mm to 3.5 mm. In some embodiments, the glass layer 22 has a thickness of 3.1 mm to 3.5 mm.
In some embodiments, the glass layer 22 has a thickness of 3.2 mm to 3.5 mm.
In some embodiments, the glass layer 22 has a thickness of 3.3 mm to 3.5 mm. In some embodiments, the glass layer 22 has a thickness of 3.4 mm to 3.5 mm. In some embodiments, the glass layer 22 has a thickness of 2.5 mm to 3.4 mm. In some embodiments, the glass layer 22 has a thickness of 2.5 mm to 3.3 mm. In some embodiments, the glass layer 22 has a thickness of 2.5 mm to 3.2 mm.
In some embodiments, the glass layer 22 has a thickness of 2.5 mm to 3.1 mm.
In some embodiments, the glass layer 22 has a thickness of 2.5 mm to 2.9 mm. In some embodiments, the glass layer 22 has a thickness of 2.5 mm to 2.8 mm. In some embodiments, the glass layer 22 has a thickness of 2.5 mm to 2.7 mm. In some embodiments, the glass layer 22 has a thickness of 2.5 mm to 2.6 mm.
In some embodiments, the glass layer 22 has a thickness of 2.5 mm. In some embodiments, the glass layer 22 has a thickness of 2.6 mm. In some embodiments, the glass layer 22 has a thickness of 2.7 mm. In some embodiments, the glass layer 22 has a thickness of 2.8 mm. In some embodiments, the glass layer 22 has a thickness of 2.9 mm In some embodiments, the glass layer 22 has a thickness of 3 mm. In some embodiments, the glass layer 22 has a thickness of 3.1 mm.
In some embodiments, the glass layer 22 has a thickness of 3.2 mm. In some embodiments, the glass layer 22 has a thickness of 3.3 mm. In some embodiments, the glass layer 22 has a thickness of 3.4 mm. In some embodiments, the glass layer 22 has a thickness of 3.5 mm.
In some embodiments, the glass layer 22 has a thickness of 3.6 mm. In some embodiments, the glass layer 22 has a thickness of 3.7 mm. In some embodiments, the glass layer 22 has a thickness of 3.8 mm.
In some embodiments, the glass layer 22 has a thickness of 3.9 mm. In some embodiments, the glass layer 22 has a thickness of 4 mm.
In some embodiments, the adhesive layer 26 includes thermosetting polyolefin, thermosetting polyolefin encapsulant material, thermosetting ethylene-vinyl acetate (EVA), EVA
encapsulants, thermoplastic olefin, thermoplastic polyolefin (TPO) or hybrids/combinations thereof.
In some embodiments, the adhesive layer 26 has a thickness of 1 gm to 900 gm.
In some embodiments, the adhesive layer 26 has a thickness of 1 gm to 900 gm. In some embodiments, the adhesive layer 26 has a thickness of 1 gm to 850 gm. In some embodiments, the adhesive layer 26 has a thickness of 1 gm to 800 1.1111. In some embodiments, the adhesive layer 26 has a thickness of 1 gm to 750 gm. In some embodiments, the adhesive layer 26 has a thickness of 1 p.m to 700 jam. In some embodiments, the adhesive layer 26 has a thickness of 1 gm to 650 gm.
In some embodiments, the adhesive layer 26 has a thickness of 1 gm to 600 gm.
In some embodiments, the adhesive layer 26 has a thickness of 1 p.m to 550 gm. In some embodiments, the adhesive layer 26 has a thickness of 1 gm to 500 gm. In some embodiments, the adhesive layer 26 has a thickness of 1 hm to 450 hm. In some embodiments, the adhesive layer 26 has a thickness of 1 pm to 400 hm In some embodiments, the adhesive layer 26 has a thickness of 1 p.m to 350 hm. In some embodiments, the adhesive layer 26 has a thickness of 1 hm to 300 hm.
In some embodiments, the adhesive layer 26 has a thickness of 1 ttm to 250 hm.
In some embodiments, the adhesive layer 26 has a thickness of 1 hm to 200 hm. In some embodiments, the adhesive layer 26 has a thickness of 1 hm to 150 hm. In some embodiments, the adhesive layer 26 has a thickness of 1 hm to 100 hm. In some embodiments, the adhesive layer 26 has a thickness of 1 hm to 50 gm.
In some embodiments, the adhesive layer 26 has a thickness of 50 hm to 900 ttm. In some embodiments, the adhesive layer 26 has a thickness of 50 hm to 850 hm. In some embodiments, the adhesive layer 26 has a thickness of 50 p.m to 800 hm. In some embodiments, the adhesive layer 26 has a thickness of 50 hm to 750 hm. In some embodiments, the adhesive layer 26 has a thickness of 50 hm to 700 hm. In some embodiments, the adhesive layer 26 has a thickness of 50 hm to 650 vim. In some embodiments, the adhesive layer 26 has a thickness of 50 vim to 600 vim.
In some embodiments, the adhesive layer 26 has a thickness of 50 hm to 550 hm.
In some embodiments, the adhesive layer 26 has a thickness of 50 hm to 500 hm. In some embodiments, the adhesive layer 26 has a thickness of 50 hm to 450 hm. In some embodiments, the adhesive layer 26 has a thickness of 50 hm to 400 hm. In some embodiments, the adhesive layer 26 has a thickness of 50 hm to 350 hm. In some embodiments, the adhesive layer 26 has a thickness of 50 p.m to 300 hm. In some embodiments, the adhesive layer 26 has a thickness of 50 hm to 250 hm.
In some embodiments, the adhesive layer 26 has a thickness of 50 hm to 200 hm.
In some embodiments, the adhesive layer 26 has a thickness of 50 hm to 150 hm. In some embodiments, the adhesive layer 26 has a thickness of 50 hm to 100 hm.
In some embodiments, the adhesive layer 26 has a thickness of 100 m to 900 p.m. In some embodiments, the adhesive layer 26 has a thickness of 100 pm to 850 pm In some embodiments, the adhesive layer 26 has a thickness of 100 p.m to 800 p.m. In some embodiments, the adhesive layer 26 has a thickness of 100 m to 750 p.m. In some embodiments, the adhesive layer 26 has a thickness of 100 p.m to 700 p.m. In some embodiments, the adhesive layer 26 has a thickness of 100 p.m to 650 p.m. In some embodiments, the adhesive layer 26 has a thickness of 100 p.m to 600 p.m. In some embodiments, the adhesive layer 26 has a thickness of 100 p.m to 550 p.m. In some embodiments, the adhesive layer 26 has a thickness of 100 m to 500 p.m. In some embodiments, the adhesive layer 26 has a thickness of 100 p.m to 450 p.m. In some embodiments, the adhesive layer 26 has a thickness of 100 p.m to 400 p.m. In some embodiments, the adhesive layer 26 has a thickness of 100 p.m to 350 pm. In some embodiments, the adhesive layer 26 has a thickness of 100 p.m to 300 p.m. In some embodiments, the adhesive layer 26 has a thickness of 100 p.m to 250 In some embodiments, the adhesive layer 26 has a thickness of 100 p.m to 200 p.m. In some embodiments, the adhesive layer 26 has a thickness of 100 tint to 150 tint.
In some embodiments, the adhesive layer 26 has a thickness of 150 p.m to 900 p.m. In some embodiments, the adhesive layer 26 has a thickness of 150 m to 850 p.m. In some embodiments, the adhesive layer 26 has a thickness of 150 p.m to 800 p.m. In some embodiments, the adhesive layer 26 has a thickness of 150 in to 750 p.m. In some embodiments, the adhesive layer 26 has a thickness of 150 p.m to 700 p.m. In some embodiments, the adhesive layer 26 has a thickness of 150 p.m to 650 p.m. In some embodiments, the adhesive layer 26 has a thickness of 150 p.m to 600 p.m. In some embodiments, the adhesive layer 26 has a thickness of 150 p.m to 550 p.m. In some embodiments, the adhesive layer 26 has a thickness of 150 p.m to 500 p.m. In some embodiments, the adhesive layer 26 has a thickness of 150 pm to 450 pm. In some embodiments, the adhesive layer 26 has a thickness of 150 pm to 400 pm. In some embodiments, the adhesive layer 26 has a thickness of 150 pm to 350 pm In some embodiments, the adhesive layer 26 has a thickness of 150 pm to 300 pm. In some embodiments, the adhesive layer 26 has a thickness of 150 pm to 250 p.m. In some embodiments, the adhesive layer 26 has a thickness of 150 pm to 200 pm.
In some embodiments, the adhesive layer 26 has a thickness of 200 pm to 900 pm. In some embodiments, the adhesive layer 26 has a thickness of 200 p.m to 850 p.m. In some embodiments, the adhesive layer 26 has a thickness of 200 pm to 800 p.m. In some embodiments, the adhesive layer 26 has a thickness of 200 m to 750 pm. In some embodiments, the adhesive layer 26 has a thickness of 200 p.m to 700 p.m. In some embodiments, the adhesive layer 26 has a thickness of 200 pm to 650 p.m. In some embodiments, the adhesive layer 26 has a thickness of 200 pm to 600 m. In some embodiments, the adhesive layer 26 has a thickness of 200 pm to 550 m. In some embodiments, the adhesive layer 26 has a thickness of 200 pm to 500 pm. In some embodiments, the adhesive layer 26 has a thickness of 200 i.tm to 450 1.1m. In some embodiments, the adhesive layer 26 has a thickness of 200 [im to 400 p.m. In some embodiments, the adhesive layer 26 has a thickness of 200 pm to 350 [tm. In some embodiments, the adhesive layer 26 has a thickness of 200 pm to 300 pm. In some embodiments, the adhesive layer 26 has a thickness of 200 pm to 250 In some embodiments, the adhesive layer 26 has a thickness of 250 pm to 900 pm. In some embodiments, the adhesive layer 26 has a thickness of 250 m to 850 pm. In some embodiments, the adhesive layer 26 has a thickness of 250 pm to 800 p.m. In some embodiments, the adhesive layer 26 has a thickness of 250 m to 750 pm. In some embodiments, the adhesive layer 26 has a thickness of 250 pm to 700 p.m. In some embodiments, the adhesive layer 26 has a thickness of 250 m to 650 m. In some embodiments, the adhesive layer 26 has a thickness of 250 m to 600 m. In some embodiments, the adhesive layer 26 has a thickness of 250 p,m to 550 pm. In some embodiments, the adhesive layer 26 has a thickness of 250 pm to 500 pm In some embodiments, the adhesive layer 26 has a thickness of 250 p.m to 450 p.m. In some embodiments, the adhesive layer 26 has a thickness of 250 m to 400 pm. In some embodiments, the adhesive layer 26 has a thickness of 250 p.m to 350 p.m. In some embodiments, the adhesive layer 26 has a thickness of 250 p.m to 300 jam.
In some embodiments, the adhesive layer 26 has a thickness of 300 p.m to 900 p.m. In some embodiments, the adhesive layer 26 has a thickness of 300 in to 850 p.m. In some embodiments, the adhesive layer 26 has a thickness of 300 m to 800 m. In some embodiments, the adhesive layer 26 has a thickness of 300 p,m to 750 p.m. In some embodiments, the adhesive layer 26 has a thickness of 300 p.m to 700 pm. In some embodiments, the adhesive layer 26 has a thickness of 300 p,m to 650 pm. In some embodiments, the adhesive layer 26 has a thickness of 300 pm to 600 m. In some embodiments, the adhesive layer 26 has a thickness of 300 p,m to 550 p,m. In some embodiments, the adhesive layer 26 has a thickness of 300 m to 500 m. In some embodiments, the adhesive layer 26 has a thickness of 300 p.m to 450 p.m. In some embodiments, the adhesive layer 26 has a thickness of 300 m to 400 p.m. In some embodiments, the adhesive layer 26 has a thickness of 300 p.m to 350 p.m.
In some embodiments, the adhesive layer 26 has a thickness of 350 jim to 900 p.m. In some embodiments, the adhesive layer 26 has a thickness of 350 m to 850 p.m. In some embodiments, the adhesive layer 26 has a thickness of 350 p.m to 800 p.m. In some embodiments, the adhesive layer 26 has a thickness of 350 m to 750 .m. In some embodiments, the adhesive layer 26 has a thickness of 350 p.m to 700 p.m. In some embodiments, the adhesive layer 26 has a thickness of 350 tm to 650 pm. In some embodiments, the adhesive layer 26 has a thickness of 350 tm to 600 pm. In some embodiments, the adhesive layer 26 has a thickness of 350 p,m to 550 p,m. In some embodiments, the adhesive layer 26 has a thickness of 350 pm to 500 pm In some embodiments, the adhesive layer 26 has a thickness of 350 p.m to 450 p.m. In some embodiments, the adhesive layer 26 has a thickness of 350 p.m to 400 p.m.
In some embodiments, the adhesive layer 26 has a thickness of 400 p.m to 900 p.m. In some embodiments, the adhesive layer 26 has a thickness of 400 p.m to 850 p.m. In some embodiments, the adhesive layer 26 has a thickness of 400 p.m to 800 p.m. In some embodiments, the adhesive layer 26 has a thickness of 400 pm to 750 pm. In some embodiments, the adhesive layer 26 has a thickness of 400 p,m to 700 p.m. In some embodiments, the adhesive layer 26 has a thickness of 400 p..m to 650 p.m. In some embodiments, the adhesive layer 26 has a thickness of 400 p.m to 600 pm. In some embodiments, the adhesive layer 26 has a thickness of 400 p.m to 550 pm. In some embodiments, the adhesive layer 26 has a thickness of 400 p,m to 500 pm. In some embodiments, the adhesive layer 26 has a thickness of 400 pm to 450 rim.
In some embodiments, the adhesive layer 26 has a thickness of 450 tim to 900 pm. In some embodiments, the adhesive layer 26 has a thickness of 450 pm to 850 p.m. In some embodiments, the adhesive layer 26 has a thickness of 450 p.m to 800 p.m. In some embodiments, the adhesive layer 26 has a thickness of 450 pm to 750 pm. In some embodiments, the adhesive layer 26 has a thickness of 450 p,m to 700 p.m. In some embodiments, the adhesive layer 26 has a thickness of 450 p.m to 650 p.m. In some embodiments, the adhesive layer 26 has a thickness of 450 p.m to 600 p.m. In some embodiments, the adhesive layer 26 has a thickness of 450 p.m to 550 p.m. In some embodiments, the adhesive layer 26 has a thickness of 450 p.m to 500 p.m.
In some embodiments, the adhesive layer 26 has a thickness of 500 jim to 900 pm. In some embodiments, the adhesive layer 26 has a thickness of 500 pm to 850 pm. In some embodiments, the adhesive layer 26 has a thickness of 500 !Am to 800 p.m. In some embodiments, the adhesive layer 26 has a thickness of 500 jm to 750 pm In some embodiments, the adhesive layer 26 has a thickness of 500 [tm to 700 ?Am. In some embodiments, the adhesive layer 26 has a thickness of 500 pm to 650 p.m. In some embodiments, the adhesive layer 26 has a thickness of 500 pm to 600 p.m. In some embodiments, the adhesive layer 26 has a thickness of 500 p.m to 550 pm.
In some embodiments, the adhesive layer 26 has a thickness of 550 p.m to 900 pm. In some embodiments, the adhesive layer 26 has a thickness of 550 in to 850 p.m. In some embodiments, the adhesive layer 26 has a thickness of 550 pm to 800 p.m. In some embodiments, the adhesive layer 26 has a thickness of 550 in to 750 p.m. In some embodiments, the adhesive layer 26 has a thickness of 550 pm to 700 p.m. In some embodiments, the adhesive layer 26 has a thickness of 550 p.m to 650 pm. In some embodiments, the adhesive layer 26 has a thickness of 550 p.m to 600 f1111.
In some embodiments, the adhesive layer 26 has a thickness of 600 tm to 900 pm. In some embodiments, the adhesive layer 26 has a thickness of 600 l_tm to 850 vim. In some embodiments, the adhesive layer 26 has a thickness of 600 pm to 800 p.m. In some embodiments, the adhesive layer 26 has a thickness of 600 p.m to 750 p.m. In some embodiments, the adhesive layer 26 has a thickness of 600 p.m to 700 p.m. In some embodiments, the adhesive layer 26 has a thickness of 600 pm to 650 !Am.
In some embodiments, the adhesive layer 26 has a thickness of 650 p.m to 900 pm. In some embodiments, the adhesive layer 26 has a thickness of 650 in to 850 p.m. In some embodiments, the adhesive layer 26 has a thickness of 650 pm to 800 p.m. In some embodiments, the adhesive layer 26 has a thickness of 650 pm to 750 jam. In some embodiments, the adhesive layer 26 has a thickness of 650 p.m to 700 pm. In some embodiments, the adhesive layer 26 has a thickness of 700 p.m to 900 p.m. In some embodiments, the adhesive layer 26 has a thickness of 700 !Am to 850 pm In some embodiments, the adhesive layer 26 has a thickness of 700 pm to 800 pm In some embodiments, the adhesive layer 26 has a thickness of 700 in to 750 ?Am. In some embodiments, the adhesive layer 26 has a thickness of 750 m to 900 p.m. In some embodiments, the adhesive layer 26 has a thickness of 750 rn to 850 m. In some embodiments, the adhesive layer 26 has a thickness of 750 p.m to 800 p.m. In some embodiments, the adhesive layer 26 has a thickness of 800 ?Am to 900 ?Am. In some embodiments, the adhesive layer 26 has a thickness of 800 ?Am to 850 p.m. In some embodiments, the adhesive layer 26 has a thickness of 850 p.m to 900 m.
In some embodiments, the adhesive layer 26 has a thickness of 1 m. In some embodiments, the adhesive layer 26 has a thickness of 50 p.m. In some embodiments, the adhesive layer 26 has a thickness of 100 m. In some embodiments, the adhesive layer 26 has a thickness of 1 m. In some embodiments, the adhesive layer 26 has a thickness of 150 p.m. In some embodiments, the adhesive layer 26 has a thickness of 200 m. In some embodiments, the adhesive layer 26 has a thickness of 250 tim. In some embodiments, the adhesive layer 26 has a thickness of 300 p.m. In some embodiments, the adhesive layer 26 has a thickness of 350 p.m. In some embodiments, the adhesive layer 26 has a thickness of 400 ?Am. In some embodiments, the adhesive layer 26 has a thickness of 450 p.m. In some embodiments, the adhesive layer 26 has a thickness of 500 pm. In some embodiments, the adhesive layer 26 has a thickness of 550 p.m. In some embodiments, the adhesive layer 26 has a thickness of 600 pm. In some embodiments, the adhesive layer 26 has a thickness of 650 p.m. In some embodiments, the adhesive layer 26 has a thickness of 700 p.m. In some embodiments, the adhesive layer 26 has a thickness of 750 m. In some embodiments, the adhesive layer 26 has a thickness of 800 p.m. In some embodiments, the adhesive layer 26 has a thickness of 850 1.1.m. In some embodiments, the adhesive layer 26 has a thickness of 900 lam.
In some embodiments, the polymer layer 24 includes a fluoropolymer. In certain embodiments, the fluoropolymer may be ethylene tetrafluoroethylene (ETFE), fluoropolymer is polyvinylidene fluoride (PVDF), tetrafluoroethylene-hexafluoropropylene copolymers (FEP), and tetrafluoroethylene-hexafluoropropylene-vinylidene fluoride copolymers (THY), polyvinyl fluoride (PVF), or blends thereof. In some embodiments, the frontsheet includes fluoropolymers, acrylics, polyesters, silicones, polycarbonates, or combinations thereof In other embodiments, the polymer layer 24 includes polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyetheretherketone (PEEK), polyaryletherketone (PAEK), polyarylate (PAR), polyetherimide (PEI), polyarylsulfone (PAS), polyethersulfone (PES), polyamideimide (PAT), polyphenylsulfone (PPSU), polyolefin, cyclic olefin copolymers (CPCs), or polyimide. In some embodiments, the polymer layer 24 includes a crosslinked polymeric material. In some embodiments, 50% to 99%
of the polymer chains of the polymeric material are crosslinked.
In some embodiments, the polymer layer 24 has a thickness of 0.01 mm to 0.5 mm. In some embodiments, the polymer layer 24 has a thickness of 0.01 mm to 0.4 mm.
In some embodiments, the polymer layer 24 has a thickness of 0.01 mm to 0.3 mm. In some embodiments, the polymer layer 24 has a thickness of 0.01 mm to 0.2 mm. In some embodiments, the polymer layer 24 has a thickness of 0.01 mm to 0.1 mm. In some embodiments, the polymer layer 24 has a thickness of 0.01 mm to 0.09 mm. In some embodiments, the polymer layer 24 has a thickness of 0.01 mm to 0.08 mm. In some embodiments, the polymer layer 24 has a thickness of 0.01 mm to 0.07 mm. In some embodiments, the polymer layer 24 has a thickness of 0.01 mm to 0.06 mm.
In some embodiments, the polymer layer 24 has a thickness of 0.01 mm to 0.05 mm. In some embodiments, the polymer layer 24 has a thickness of 0.01 mm to 0.04 mm. In some embodiments, the polymer layer 24 has a thickness of 0.01 mm to 0.03 min_ In some embodiments, the polymer layer 24 has a thickness of 0.01 mm to 0.02 mm.
In some embodiments, the polymer layer 24 has a thickness of 0.01 mm to 0.4 mm. In some embodiments, the polymer layer 24 has a thickness of 0.02 mm to 0.4 mm.
In some embodiments, the polymer layer 24 has a thickness of 0.03 mm to 0.4 mm. In some embodiments, the polymer layer 24 has a thickness of 0.04 mm to 0.4 mm. In some embodiments, the polymer layer 24 has a thickness of 0.05 mm to 0.4 mm. In some embodiments, the polymer layer 24 has a thickness of 0.06 mm to 0.4 mm. In some embodiments, the polymer layer 24 has a thickness of 0.07 mm to 0.4 mm. In some embodiments, the polymer layer 24 has a thickness of 0.08 mm to 0.4 mm. In some embodiments, the polymer layer 24 has a thickness of 0.09 mm to 0.4 mm. In some embodiments, the polymer layer 24 has a thickness of 0.1 mm to 0.4 mm. In some embodiments, the polymer layer 24 has a thickness of 0.15 mm to 0.4 mm. In some embodiments, the polymer layer 24 has a thickness of 0.2 mm to 0.4 mm. In some embodiments, the polymer layer 24 has a thickness of 0.25 mm to 0.4 mm. In some embodiments, the polymer layer 24 has a thickness of 0.3 mm to 0.4 mm. In some embodiments, the polymer layer 24 has a thickness of 0.35 mm to 0.4 mm.
In some embodiments, the polymer layer 24 has a thickness of 0.025 mm to 0.1 mm. In some embodiments, the polymer layer 24 has a thickness of 0.03 mm to 0.1 mm.
In some embodiments, the polymer layer 24 has a thickness of 0.035 mm to 0.1 mm. In some embodiments, the polymer layer 24 has a thickness of 0.04 mm to 0.1 mm. In some embodiments, the polymer layer 24 has a thickness of 0.045 mm to 0.1 mm. In some embodiments, the polymer layer 24 has a thickness of 0.05 mm to 0.1 mm. In some embodiments, the polymer layer 24 has a thickness of 0.06 mm to 0.1 mm. In some embodiments, the polymer layer 24 has a thickness of 0.065 mm to 0 1 mm In some embodiments, the polymer layer 24 has a thickness of 007 mm to 0 1 mm In some embodiments, the polymer layer 24 has a thickness of 0.075 mm to 0.1 mm.
In some embodiments, the polymer layer 24 has a thickness of 0.08 mm to 0.1 mm. In some embodiments, the polymer layer 24 has a thickness of 0.085 mm to 0.1 mm. In some embodiments, the polymer layer 24 has a thickness of 0.09 mm to 0.1 mm. In some embodiments, the polymer layer 24 has a thickness of 0.095 mm to 0.1 mm.
In some embodiments, the frontsheet 16 includes only the glass layer 22. In some embodiments, the frontsheet 16 includes only the polymer layer 24.
Referring to FIGS. 1, 3A and 3B, in some embodiments, a backsheet 28 is juxtaposed with a second surface of the encapsulant 14. In some embodiments, the backsheet 28 includes a first surface 30, a second surface 32 opposite the first surface 30, a first side 34, a second side 36 opposite the first side 34, a first edge 38 extending from the first side 34 to the second side 36, and a second edge 40 opposite the first edge 38 and extending from the first side 34 to the second side 36.
In some embodiments, the backsheet 28 includes a first section 42 and a second section 44.
In some embodiments, the first section 42 is transparent. In some embodiments, the second section 44 is non-transparent (opaque). In some embodiments, the first section 42 extends from the first edge 38 to a first location 46 intermediate the first edge 38 and the second edge 40. In some embodiments, the first section 42 extends from the first edge 38 to the first location 46 and from the first side 34 to the second side 36. In some embodiments, the first section 42 extends from the first edge 38 to the first location 46, from the first side 34 to the second side 36, and from the first surface 30 to the second surface 32. In some embodiments, the second section 44 extends from the first location 46 to the second edge 40. In some embodiments, the second section 44 extends from the first location 46 to the second edge 40 and from the first side 34 to the second side 36 In some embodiments, the second section 44 extends from the first location 46 to the second edge 40, from the first side 34 to the second side 36, and from the first surface 30 to the second surface 32.
In some embodiments, the first section 42 includes a width WI measured from the first edge 38 to the first location 46. In some embodiments, the width WI is 5 mm to 30 mm. In some embodiments, the width WI is 5 mm to 25 mm. In some embodiments, the width WI
is 5 mm to 20 mm. In some embodiments, the width WI is 5 mm to 15 mm. In some embodiments, the width WI is 5 mm to 10 mm. In some embodiments, the width WI is 10 mm to 30 mm. In some embodiments, the width WI is 10 mm to 25 mm. In some embodiments, the width WI
is 10 mm to 20 mm. In some embodiments, the width WI is 10 mm to 15 mm. In some embodiments, the width WI is 15 mm to 30 mm. In some embodiments, the width WI is 15 mm to 25 mm. In some embodiments, the width WI is 15 mm to 20 mm. In some embodiments, the width WI
is 20 mm to 30 mm. In some embodiments, the width WI is 20 mm to 25 mm. In some embodiments, the width WI is 25 mm to 30 mm. In some embodiments, the width WI is 5 mm. In some embodiments, the width WI is 10 mm. In some embodiments, the width WI is 15 mm. In some embodiments, the width WI is 20 mm. In some embodiments, the width WI is 25 mm. In some embodiments, the width WI is 30 mm.
Referring to FIG. 3B, in some embodiments, the backsheet 28 includes a third section 48 that extends from the second edge 40 to a second location 50 intermediate the second edge 40 and the first edge 38. In some embodiments, the third section 48 extends from the second edge 40 to the second location 50 and from the first side 34 to the second side 36. In some embodiments, the third section 48 extends from the second edge 40 to the second location 50, from the first side 34 to the second side 36, and from the first surface 30 to the second surface 32 In some embodiments, the second section 44 extends from the first location 46 to the second location 50. In some embodiments, the second section 44 extends from the first location 46 to the second location 50 and from the first side 34 to the second side 36.
In some embodiments, the second section 44 extends from the first location 46 to the second location 50, from the first side 34 to the second side 36, and from the first surface 30 to the second surface 32.
In some embodiments, the backsheet 28 includes thermoplastic polyolefin (TPO).
In some embodiments, the backsheet 28 includes a single ply TPO roofing membrane. In other embodiments, non-limiting examples of TPO membranes are disclosed in U.S.
Patent No.
9,359,014 to Yang et al., which is incorporated by reference herein in its entirety. In some embodiments, the backsheet 28 includes polyvinyl chloride. In some embodiments, the backsheet 28 includes ethylene propylene diene monomer (EPDM) rubber. In some embodiments, the backsheet 28 includes a flame retardant additive. In some embodiments, the flame retardant additive may be clays, nanoclays, silicas, carbon black, metal hydroxides such as aluminum hydroxide, metal foils, graphite, and combinations thereof. In some embodiments, the backsheet 28 includes polyethylene terephthalate (PET). In some embodiments, the backsheet 28 includes ethylene tetrafluoroethylene (ETFE). In some embodiments, the backsheet 28 includes tetrafluoroethylene-hexafluoropropylene copolymers (FEP). In some embodiments, the backsheet 28 includes ethylene chlorotrifluoroethylene (ECTFE).
In some embodiments, the backsheet 28 has a thickness of 2 mil to 100 mil. In some embodiments, the backsheet 28 has a thickness of 2 mil to 90 mil. In some embodiments, the backsheet 28 has a thickness of 2 mil to 80 mil. In some embodiments, the backsheet 28 has a thickness of 2 mil to 70 mil. In some embodiments, the backsheet 28 has a thickness of 2 mil to 60 mil In some embodiments, the backsheet 28 has a thickness of 2 mil to 50 mil In some embodiments, the backsheet 28 has a thickness of 2 mil to 40 mil. In some embodiments, the backsheet 28 has a thickness of 2 mil to 30 mil. In some embodiments, the backsheet 28 has a thickness of 2 mil to 20 mil. In some embodiments, the backsheet 28 has a thickness of 2 mil to mil. In some embodiments, the backsheet 28 has a thickness of 10 mil to 100 mil. In some embodiments, the backsheet 28 has a thickness of 10 mil to 90 mil. In some embodiments, the backsheet 28 has a thickness of 10 mil to 80 mil. In some embodiments, the backsheet 28 has a thickness of 10 mil to 70 mil. In some embodiments, the backsheet 28 has a thickness of 10 mil 10 to 60 mil. In some embodiments, the backsheet 28 has a thickness of 10 mil to 50 mil. In some embodiments, the backsheet 28 has a thickness of 10 mil to 40 mil. In some embodiments, the backsheet 28 has a thickness of 10 mil to 30 mil. In some embodiments, the backsheet 28 has a thickness of 10 mil to 20 mil.
In some embodiments, the backsheet 28 has a thickness of 20 mil to 100 mil. In some embodiments, the backsheet 28 has a thickness of 20 mil to 90 mil. In some embodiments, the backsheet 28 has a thickness of 20 mil to 80 mil. In some embodiments, the backsheet 28 has a thickness of 20 mil to 70 mil. In some embodiments, the backsheet 28 has a thickness of 20 mil to 60 mil. In some embodiments, the backsheet 28 has a thickness of 20 mil to 50 mil. In some embodiments, the backsheet 28 has a thickness of 20 mil to 40 mil. In some embodiments, the backsheet 28 has a thickness of 20 mil to 30 mil. In some embodiments, the backsheet 28 has a thickness of 30 mil to 100 mil. In some embodiments, the backsheet 28 has a thickness of 30 mil to 90 mil. In some embodiments, the backsheet 28 has a thickness of 30 mil to 80 mil. In some embodiments, the backsheet 28 has a thickness of 30 mil to 70 mil. In some embodiments, the backsheet 28 has a thickness of 30 mil to 60 mil. In some embodiments, the backsheet 28 has a thickness of 30 mil to 50 mil In some embodiments, the backsheet 28 has a thickness of 30 mil to 40 mil.
In some embodiments, the backsheet 28 has a thickness of 40 mil to 100 mil. In some embodiments, the backsheet 28 has a thickness of 40 mil to 90 mil. In some embodiments, the backsheet 28 has a thickness of 40 mil to 80 mil. In some embodiments, the backsheet 28 has a thickness of 40 mil to 70 mil. In some embodiments, the backsheet 28 has a thickness of 40 mil to 60 mil. In some embodiments, the backsheet 28 has a thickness of 40 mil to 50 mil. In some embodiments, the backsheet 28 has a thickness of 50 mil to 100 mil. In some embodiments, the backsheet 28 has a thickness of 50 mil to 90 mil. In some embodiments, the backsheet 28 has a thickness of 50 mil to 80 mil. In some embodiments, the backsheet 28 has a thickness of 50 mil to 70 mil. In some embodiments, the backsheet 28 has a thickness of 50 mil to 60 mil.
In some embodiments, the backsheet 28 has a thickness of 60 mil to 100 mil. In some embodiments, the backsheet 28 has a thickness of 60 mil to 90 mil. In some embodiments, the backsheet 28 has a thickness of 60 mil to 80 mil. In some embodiments, the backsheet 28 has a thickness of 60 mil to 70 mil. In some embodiments, the backsheet 28 has a thickness of 70 mil to 100 mil. In some embodiments, the backsheet 28 has a thickness of 70 mil to 90 mil. In some embodiments, the backsheet 28 has a thickness of 70 mil to 80 mil. In some embodiments, the backsheet 28 has a thickness of 80 mil to 100 mil. In some embodiments, the backsheet 28 has a thickness of 80 mil to 90 mil. In some embodiments, the backsheet 28 has a thickness of 90 mil to 100 mil.
In some embodiments, the backsheet 28 has a thickness of 2 mil. In some embodiments, the backsheet 28 has a thickness of 10 mil. In some embodiments, the backsheet 28 has a thickness of 20 mil. In some embodiments, the backsheet 28 has a thickness of 30 mil. In some embodiments, the backsheet 28 has a thickness of 40 miL In some embodiments, the backsheet 28 has a thickness of 50 mil. In some embodiments, the backsheet 28 has a thickness of 60 mil.
In some embodiments, the backsheet 28 has a thickness of 10 mil. In some embodiments, the backsheet 28 has a thickness of 70 mil. In some embodiments, the backsheet 28 has a thickness of 80 mil. In some embodiments, the backsheet 28 has a thickness of 90 mil. In some embodiments, the backsheet 28 has a thickness of 100 mil.
In some embodiments, the second section 44 of the backsheet 28 is painted. In some embodiments, the second section 44 of the backsheet 28 is painted an opaque color. In some embodiments, the second section 44 of the backsheet 28 includes an opaque color printed thereon.
Referring to FIG. 1, in some embodiments, the photovoltaic module 10 includes an adhesive 52. In some embodiments, the adhesive 52 is attached to the second surface 32 of the backsheet 28. In some embodiments, the adhesive 52 is transparent. In some embodiments, the adhesive 52 is located proximate to the first section 42. In some embodiments, the adhesive 52 is juxtaposed with the first section 42. In some embodiments, edges 54a, 54b of the adhesive 52 are substantially aligned with corresponding edges 56a, 56b of the first section 42. In some embodiments, the edges 54a, 54b of the adhesive 52 are aligned with the edges 56a, 56b of the first section 42.
In some embodiments, the adhesive 52 is located proximate to the third section 48. In some embodiments, the adhesive 52 is juxtaposed with the third section 48. In some embodiments, the edges 54a, 54b of the adhesive 52 are substantially aligned with edges 58a, 58b of the third section 48. In some embodiments, the edges 54a, 54b of the adhesive 52 are aligned with the edges 58a, 58b of the third section 48.
In some embodiments, the adhesive 52 is silicone. In some embodiments, the adhesive 52 is a tape In some embodiments, the adhesive 52 is VEIB tape supplied by 3M In some embodiments, the adhesive 52 is an acrylic adhesive. In some embodiments, the adhesive 52 is a urethane adhesive. In some embodiments, the adhesive 52 is an epoxy. In some embodiments, the adhesive 52 is butyl. In some embodiments, the adhesive 52 is a poly-vinyl acetate (PVA) adhesive.
In some embodiments, the adhesive 52 is applied to the photovoltaic module 10 during the manufacture thereof. In some embodiments, the adhesive 52 is applied to the photovoltaic module during the installation of the photovoltaic module 10 on a roof deck.
In some embodiments, the adhesive 52 has a thickness of 1 mil to 100 mil. In some embodiments, the adhesive 52 has a thickness of 1 mil to 90 mil. In some embodiments, the adhesive 52 has a thickness of 1 mil to 80 mil. In some embodiments, the adhesive 52 has a thickness of 1 mil to 70 mil. In some embodiments, the adhesive 52 has a thickness of 1 mil to 60 mil. In some embodiments, the adhesive 52 has a thickness of 1 mil to 50 mil.
In some embodiments, the adhesive 52 has a thickness of 1 mil to 40 mil. In some embodiments, the adhesive 52 has a thickness of 1 mil to 30 mil. In some embodiments, the adhesive 52 has a thickness of 1 mil to 20 mil. In some embodiments, the adhesive 52 has a thickness of 1 mil to 10 mil.
In some embodiments, the adhesive 52 has a thickness of 10 mil to 100 mil. In some embodiments, the adhesive 52 has a thickness of 10 mil to 90 mil. In some embodiments, the adhesive 52 has a thickness of 10 mil to 80 mil. In some embodiments, the adhesive 52 has a thickness of 10 mil to 70 mil. In some embodiments, the adhesive 52 has a thickness of 10 mil to 60 mil. In some embodiments, the adhesive 52 has a thickness of 10 mil to 50 mil. In some embodiments, the adhesive 52 has a thickness of 10 mil to 40 mil. In some embodiments, the adhesive 52 has a thickness of 10 mil to 30 mil In some embodiments, the adhesive 52 has a thickness of 10 mil to 20 mil.
In some embodiments, the adhesive 52 has a thickness of 20 mil to 100 mil. In some embodiments, the adhesive 52 has a thickness of 20 mil to 90 mil. In some embodiments, the adhesive 52 has a thickness of 20 mil to 80 mil. In some embodiments, the adhesive 52 has a thickness of 20 mil to 70 mil. In some embodiments, the adhesive 52 has a thickness of 20 mil to 60 mil. In some embodiments, the adhesive 52 has a thickness of 20 mil to 50 mil. In some embodiments, the adhesive 52 has a thickness of 20 mil to 40 mil. In some embodiments, the adhesive 52 has a thickness of 20 mil to 30 mil.
In some embodiments, the adhesive 52 has a thickness of 30 mil to 100 mil. In some embodiments, the adhesive 52 has a thickness of 30 mil to 90 mil. In some embodiments, the adhesive 52 has a thickness of 30 mil to 80 mil. In some embodiments, the adhesive 52 has a thickness of 30 mil to 70 mil. In some embodiments, the adhesive 52 has a thickness of 30 mil to 60 mil. In some embodiments, the adhesive 52 has a thickness of 30 mil to 50 mil. In some embodiments, the adhesive 52 has a thickness of 30 mil to 40 mil.
In some embodiments, the adhesive 52 has a thickness of 40 mil to 100 mil. In some embodiments, the adhesive 52 has a thickness of 40 mil to 90 mil. In some embodiments, the adhesive 52 has a thickness of 40 mil to 80 mil. In some embodiments, the adhesive 52 has a thickness of 40 mil to 70 mil. In some embodiments, the adhesive 52 has a thickness of 40 mil to 60 mil. In some embodiments, the adhesive 52 has a thickness of 40 mil to 50 mil. In some embodiments, the adhesive 52 has a thickness of 50 mil to 100 mil. In some embodiments, the adhesive 52 has a thickness of 50 mil to 90 mil. In some embodiments, the adhesive 52 has a thickness of 50 mil to 80 mil. In some embodiments, the adhesive 52 has a thickness of 50 mil to 70 mil In some embodiments, the adhesive 52 has a thickness of 50 mil to 60 mil In some embodiments, the adhesive 52 has a thickness of 60 mil to 100 mil. In some embodiments, the adhesive 52 has a thickness of 60 mil to 90 mil. In some embodiments, the adhesive 52 has a thickness of 60 mil to 80 mil. In some embodiments, the adhesive 52 has a thickness of 60 mil to 70 mil. In some embodiments, the adhesive 52 has a thickness of 70 mil to 100 mil. In some embodiments, the adhesive 52 has a thickness of 70 mil to 90 mil. In some embodiments, the adhesive 52 has a thickness of 70 mil to 80 mil. In some embodiments, the adhesive 52 has a thickness of 80 mil to 100 mil. In some embodiments, the adhesive 52 has a thickness of 80 mil to 90 mil. In some embodiments, the adhesive 52 has a thickness of 90 mil to 100 mil.
In some embodiments, the adhesive 52 has a thickness of 1 mil. In some embodiments, the adhesive 52 has a thickness of 10 mil. In some embodiments, the adhesive 52 has a thickness of 20 mil. In some embodiments, the adhesive 52 has a thickness of 30 mil. In some embodiments, the adhesive 52 has a thickness of 40 mil. In some embodiments, the adhesive 52 has a thickness of 50 mil. In some embodiments, the adhesive 52 has a thickness of 60 mil. In some embodiments, the adhesive 52 has a thickness of 70 mil. In some embodiments, the adhesive 52 has a thickness of 80 mil. In some embodiments, the adhesive 52 has a thickness of 90 mil. In some embodiments, the adhesive 52 has a thickness of 100 mil.
In some embodiments, the adhesive 52 optically couples the photovoltaic module 10 with another photovoltaic module. In some embodiments, the adhesive 52 mechanically couples the photovoltaic module 10 with another photovoltaic module overlayed by the photovoltaic module 10. As used herein and with respect to certain embodiments of the photovoltaic module 10, the term "optically couples- means each of a first photovoltaic module and a second photovoltaic module include a stnicture and an installed position such that solar light is capable of being transmitted through the first photovoltaic module to the second photovoltaic module.
In some embodiments, the adhesive 52 has a solar weighted transmission of 50%
to 100%.
In some embodiments, the adhesive 52 has a solar weighted transmission of 50%
to 95%. In some embodiments, the adhesive 52 has a solar weighted transmission of 50% to 90%.
In some embodiments, the adhesive 52 has a solar weighted transmission of 50% to 80%.
In some embodiments, the adhesive 52 has a solar weighted transmission of 50% to 70%.
In some embodiments, the adhesive 52 has a solar weighted transmission of 50% to 60%.
In some embodiments, the adhesive 52 has a solar weighted transmission of 60% to 100%
In some embodiments, the adhesive 52 has a solar weighted transmission of 60% to 90%.
In some embodiments, the adhesive 52 has a solar weighted transmission of 60% to 80%.
In some embodiments, the adhesive 52 has a solar weighted transmission of 60% to 70%.
In some embodiments, the adhesive 52 has a solar weighted transmission of 70% to 100%
In some embodiments, the adhesive 52 has a solar weighted transmission of 70% to 90%.
In some embodiments, the adhesive 52 has a solar weighted transmission of 70% to 80%.
In some embodiments, the adhesive 52 has a solar weighted transmission of 80% to 100%
In some embodiments, the adhesive 52 has a solar weighted transmission of 80% to 90%.
In some embodiments, the adhesive 52 has a solar weighted transmission of 90% to 100%
In some embodiments, the adhesive 52 has a solar weighted transmission of 50%.
In some embodiments, the adhesive 52 has a solar weighted transmission of 60%. In some embodiments, the adhesive 52 has a solar weighted transmission of 70%. In some embodiments, the adhesive 52 has a solar weighted transmission of 80%. In some embodiments, the adhesive 52 has a solar weighted transmission of 90%. In some embodiments, the adhesive 52 has a solar weighted transmission of 95% In some embodiments, the adhesive 52 has a solar weighted transmission of 99.9%. In some embodiments, the adhesive 52 has a solar weighted transmission of 100%.
In some embodiments, the adhesive 52 has an index of refraction of 1 to 1.7.
In some embodiments, the adhesive 52 has an index of refraction of 1 to 1.6. In some embodiments, the adhesive 52 has an index of refraction of 1 to 1.5. In some embodiments, the adhesive 52 has an index of refraction of 1 to 1.4. In some embodiments, the adhesive 52 has an index of refraction of 1 to 1.3. In some embodiments, the adhesive 52 has an index of refraction of 1 to 1.2. In some embodiments, the adhesive 52 has an index of refraction of 1 to 1.1.
In some embodiments, the adhesive 52 has an index of refraction of 1.1 to 1.7.
In some embodiments, the adhesive 52 has an index of refraction of 1.1 to 1.6. In some embodiments, the adhesive 52 has an index of refraction of 1.1 to 1.5. In some embodiments, the adhesive 52 has an index of refraction of 1.1 to 1.4. In some embodiments, the adhesive 52 has an index of refraction of 1.1 to 1.3. In some embodiments, the adhesive 52 has an index of refraction of 1.1 to 12. In some embodiments, the adhesive 52 has an index of refraction of 1.2 to 1.7. In some embodiments, the adhesive 52 has an index of refraction of 1.2 to 1.6. In some embodiments, the adhesive 52 has an index of refraction of 1.2 to 1.5. In some embodiments, the adhesive 52 has an index of refraction of 1.2 to 1.4. In some embodiments, the adhesive 52 has an index of refraction of 1.2 to 1.3.
In some embodiments, the adhesive 52 has an index of refraction of 1.3 to 1.7.
In some embodiments, the adhesive 52 has an index of refraction of 1.3 to 1.6. In some embodiments, the adhesive 52 has an index of refraction of 1.3 to 1.5. In some embodiments, the adhesive 52 has an index of refraction of 1.3 to 1.4. In some embodiments, the adhesive 52 has an index of refraction of 1.4 to 1.7. In some embodiments, the adhesive 52 has an index of refraction of 1.4 to 1.6. In some embodiments, the adhesive 52 has an index of refraction of 1 4 to 1.5. In some embodiments, the adhesive 52 has an index of refraction of 1.5 to 1.7. In some embodiments, the adhesive 52 has an index of refraction of 1.5 to 1.6. In some embodiments, the adhesive 52 has an index of refraction of 1.6 to 1.7.
In some embodiments, the adhesive 52 has an index of refraction of I. In some embodiments, the adhesive 52 has an index of refraction of 1.1. In some embodiments, the adhesive 52 has an index of refraction of 1.2. In some embodiments, the adhesive 52 has an index of refraction of 1.3. In some embodiments, the adhesive 52 has an index of refraction of 1.4. In some embodiments, the adhesive 52 has an index of refraction of 1.5. In some embodiments, the adhesive 52 has an index of refraction of 1.6. In some embodiments, the adhesive 52 has an index of refraction of 1.7.
In some embodiments, at least one solar cell 12 includes a first end 60 and a second end 62 opposite the first end 60. In some embodiments, the first end 60 is located proximate to the first end 18 of the photovoltaic module 10. In some embodiments, the second end 62 is located proximate to the second end 20 of the photovoltaic module 10.
Referring to FIG. 4, in some embodiments, a transparent portion 64 (transparent edge) is formed by a portion of the frontsheet 16, a portion of the encapsulant 14, the first section 42 of the backsheet 28, and the adhesive 52. In some embodiments, the transparent portion 64 extends from the first surface 19 to a surface 23 of the adhesive 52. In some embodiments, a creepage distance D1 extends from the first end 18 of the photovoltaic module 10 to the first end 60 of the at least one solar cell 12. In some embodiments, the creepage distance D1 is equal to the width W1 of the first section 42 of the backsheet 28. In some embodiments, the creepage distance D1 extends from the second end 20 of the photovoltaic module 10 to the second end 62 of the at least one solar cell Referring to FIGS. 4 through 6, in some embodiments, a system includes a plurality of the photovoltaic modules 10 installed on a roof deck. In some embodiments, the plurality of photovoltaic modules 10 includes a first photovoltaic module 10a and a second photovoltaic module 10b. In some embodiments, a portion of the first photovoltaic module 10a overlays a portion of the second photovoltaic module 10b. In some embodiments, the first end 18 of the first photovoltaic module 10a overlays the second end 20 of the second photovoltaic module 10b. In some embodiments, the transparent portion 64 of the first photovoltaic module 10a overlays a portion of the at least one solar cell 12 at the second end 62 thereof. In some embodiments, the transparent portion 64 overlaps the at least one solar cell 12 at an overlap distance D2. In some embodiments, the overlap distance D2 is equal to the creepage distance Dl. In some embodiments, the overlap distance D2 is less than the creepage distance Dl. In some embodiments, the adhesive 52 of the first photovoltaic module 10a is attached to the first surface 19 of the second photovoltaic module 10b. In some embodiments, the total amount of overlap D3 of the first photovoltaic module 10a over the second photovoltaic module 10b is twice the creepage distance Dl. In some embodiments, the total amount of overlap D3 of the first photovoltaic module 10a over the second photovoltaic module 10b is approximately twice the creepage distance Dl. In some embodiments, the reveal 04 of the second photovoltaic module 10b is equal to the length of the at least one solar cell 12. In some embodiments, the reveal D4 of the second photovoltaic module 10b is approximately equal to the length of the at least one solar cell 12.
In some embodiments, solar light transmission L travels through transparent portion 64 (the frontsheet 16, the encapsulant 14, the first section 42 of the backsheet 28 and the adhesive 52) of the first photovoltaic module 10a and through the frontsheet 16 and the encapsulant 14 of the second photovoltaic module 10b to the at least one solar cell 12 of the second photovoltaic module 10b. In some embodiments, a power density (PD) of an array of the photovoltaic modules 10 is relative to the proportion of the area covered by solar cells U. In some embodiments, the power density (PD) is calculated as:
PD = n*S/(2C+n*S) where C = creepage distance D1, S = the length of the at least one solar cell 12, and n=
number of the photovoltaic modules 10 in the array. In some embodiments, for relatively large numbers of the photovoltaic modules 10 in the array (for example, with n = 10 or greater), the proportion of the total array height covered by the solar cells 12 approaches 100%. In some embodiments, if C= 15 mm, S = 166 mm, n = 10, then PD = 98%.
FIG. 6 shows an embodiment of a photovoltaic module 110. The photovoltaic module 110 has a structure and function similar to those of the photovoltaic module 10, with certain differences described below. In some embodiments, the photovoltaic module 110 includes at least one solar cell 112, an encapsulant 114 encapsulating the at least one solar cell 112, a frontsheet 116 juxtaposed with a first surface of the encapsulant 114, and a backsheet 128 juxtaposed with a second surface of the encapsulant 114. In some embodiments, the backsheet 128 is transparent.
In some embodiments, the entire area of the backsheet 128 is transparent.
In some embodiments, the photovoltaic module 110 includes an adhesive 152. In some embodiments, the adhesive 152 is attached to a surface 132 of the backsheet 128. In some embodiments, the adhesive 152 is transparent. In some embodiments, the adhesive 152 is located proximate to a first end 118 of the photovoltaic module 110. In some embodiments, the adhesive 152 is located proximate to a second end 120 of the photovoltaic module 110.
In some embodiments, a transparent portion 164 is formed by the frontsheet 116, the encapsulant 114, the backsheet 128, and the adhesive 152 In some embodiments, the transparent portion 164 extends from a first surface 119 to the second surface 121 of the photovoltaic module HO. In some embodiments, a creepage distance DI extends from the first end 118 of the photovoltaic module 110 to a first end 160 of the at least one solar cell 112.
FIG. 7 shows an embodiment of a photovoltaic module 210. The photovoltaic module 210 has a structure and function similar to those of the photovoltaic module 10, with certain differences described below. In some embodiments, the photovoltaic module 210 includes at least one solar cell 212, an encapsulant 214 encapsulating the at least one solar cell 212, and a frontsheet 216 juxtaposed with a first surface of the encapsulant 214. In some embodiments, a backsheet 228 is juxtaposed with a second surface of the encapsulant 214.
In some embodiments, the backsheet 228 includes a first layer 229 and a second layer 231.
In some embodiments, the first layer 229 is juxtaposed with the second surface of the encapsulant 214. In some embodiments, the first layer 229 extends from a first end 218 of the photovoltaic module 210 to a second end 220 of the photovoltaic module 210, In some embodiments, the first layer 229 is transparent. In some embodiments, the first layer 229 includes polyethylene terephthalate (PET).
In some embodiments, the first layer 229 includes ethylene tetrafluoroethylene (ETFE).
In some embodiments, the first layer 229 includes tetrafluoroethylene-hexafluoropropylene copolymers (FEP). In some embodiments, the first layer 229 includes ethylene chlorotrifluoroethylene (ECTFE).
In some embodiments, the second layer 231 is juxtaposed with the first layer 229. In some embodiments, the second layer 231 extends from the second end 220 to a first location 246 intermediate the first end 218 and the second end 220. In some embodiments, the second layer 231 is non-transparent. In some embodiments, the second layer 231 is attached to the first layer 229 by an adhesive layer 233W In some embodiments, the adhesive layer 233 extends from the second end 220 to the first location 246.
In some embodiments, an adhesive 252 is attached to a surface 232 of the first layer 229.
In some embodiments, the adhesive 252 extends from the first end 218 to the first location 246.
In some embodiments, the adhesive 252 is juxtaposed with an end of the second layer 231 and an end of the adhesive layer 233. In some embodiments, a thickness Ti of the adhesive 252 is equal to a total thickness of the second layer 2M and the adhesive layer 233. In some embodiments, the thickness Ti of the adhesive 252 is greater than a total thickness T2 of the second layer 231 and the adhesive layer 233. In some embodiments, the adhesive layer 233 is transparent. In some embodiments, the adhesive layer 233 has a structure similar to that of the adhesive layer 26. In some embodiments, the adhesive layer 233 is selected from the group consisting of polyvinyl butyrate, acrylic, silicone, and polycarbonate adhesives. In some embodiments, the adhesive layer 233 is selected from the group consisting of thermosetting polyolefin, thermosetting polyolefin encapsulant material, thermosetting ethylene-vinyl acetate (EVA), EVA
encapsulants, thermoplastic olefin, thermoplastic polyolefin (TPO) and hybrids and combinations thereof. In some embodiments, the adhesive layer 233 includes a thermosetting polyolefin encapsulant material. In some embodiments, the adhesive layer 233 includes a thickness of 1 um to 900 um.
In some embodiments, the adhesive layer 233 includes a thickness in the same subranges as identified above with respect to the adhesive layer 26.
In some embodiments, a transparent portion 264 is formed by a portion of the frontsheet 216, a portion of the encapsulant 214, a portion of the first layer 229 of the backsheet 228, and the adhesive 252. In some embodiments, the transparent portion 264 extends from a first surface 219 to a second surface 221 of the photovoltaic module 210. In some embodiments, a creepage distance D1 extends from the first end 218 of the photovoltaic module 210 to the first end 260 of the at least one solar cell 212. In some embodiments, the creepage distance D1 is equal to a width WI of the adhesive 252.
In some embodiments, the adhesive 252 is silicone. In some embodiments, the adhesive 252 is a tape. In some embodiments, the adhesive 252 is VHB tape supplied by 3M. In some embodiments, the adhesive 252 is an acrylic adhesive. In some embodiments, the adhesive 252 is a urethane adhesive. In some embodiments, the adhesive 252 is an epoxy. In some embodiments, the adhesive 252 is butyl. In some embodiments, the adhesive 252 is a poly-vinyl acetate (PVA) adhesive.In some embodiments, the adhesive 252 is applied to the photovoltaic module 210 during the manufacture thereof In some embodiments, the adhesive 252 is applied to the photovoltaic module 210 during the installation of the photovoltaic module 210 on a roof deck. In some embodiments, the adhesive 252 optically couples the photovoltaic module 210 with another photovoltaic module. In some embodiments, the adhesive 252 mechanically couples the photovoltaic module 210 with another photovoltaic module overlayed by the photovoltaic module 210.
FIG. 8 shows a side schematic view of embodiments of a system of a plurality of photovoltaic modules 310a, 310b. In some embodiments, the photovoltaic modules 310a, 310b have a structure, function and arrangement similar to those of the photovoltaic modules 10a, 10b, with certain differences described below. In some embodiments, the photovoltaic module 310a includes an encapsulant 314 having a surface 315 and a backsheet 328 juxtaposed with the surface 315 of the encapsulant 314. In some embodiments, the backsheet 328 includes a first surface 330, a second surface 332 opposite the first surface 330, a first edge 338, and a second edge 340 opposite the first edge 338. In some embodiments, the backsheet 328 is transparent. In some embodiments, the backsheet 328 is non-transparent In some embodiments, the backsheet 328 includes a beveled portion 345. In some embodiments, the beveled portion 345 extends from the first edge 338 to a location 347 intermediate the first edge 338 and the second edge 340. In some embodiments, the beveled portion 345 has a width Wl. In some embodiments, the width W1 extends from the first edge 338 to the location 347. In some embodiments, the width W1 is equal to an overlap distance D2. In some embodiments, the width W1 is substantially equal to the overlap distance D2. In some embodiments, the width W1 is greater than the overlap distance D2. In some embodiments, the width W1 is less than the overlap distance D2.
In some embodiments, the beveled portion 345 is beveled at an angle A of 5 degrees to 30 degrees relative to a lower surface 315 of the encapsulant 314. In some embodiments, the angle A is 5 degrees to 25 degrees. In some embodiments, the angle A is 5 degrees to 20 degrees. In some embodiments, the angle A is 5 degrees to 15 degrees. In some embodiments, the angle A is 5 degrees to 10 degrees. In some embodiments, the angle A is 10 degrees to 30 degrees. In some embodiments, the angle A is 10 degrees to 25 degrees. In some embodiments, the angle A is 10 degrees to 20 degrees. In some embodiments, the angle A is 10 degrees to 15 degrees. In some embodiments, the angle A is 15 degrees to 30 degrees. In some embodiments, the angle A is 15 degrees to 25 degrees. In some embodiments, the angle A is 15 degrees to 20 degrees. In some embodiments, the angle A is 20 degrees to 30 degrees. In some embodiments, the angle A is 20 degrees to 25 degrees. In some embodiments, the angle A is 25 degrees to 30 degrees.
In some embodiments, the photovoltaic modules 310a, 310b are installed on a roof deck surface of a steep slope roof. As defined herein, a "steep slope roof' is any roof substrate that is disposed on a roof having a pitch of Y/X, where Y and X are in a ratio of 2:12 to 18:12, where Y
corresponds to the "rise" of the roof, and where X corresponds to the "run" of the roof In some embodiments, Y and X are in a ratio of 5:12 to 12:12. In some embodiments, Y
and X are in a ratio of 6:12 to 12:12. In some embodiments, Y and X are in a ratio of 7:12 to 12:12. In some embodiments, Y and X are in a ratio of 6:12 to 12:12. In some embodiments, Y
and X are in a ratio of 8:12 to 12:12. In some embodiments, Y and X are in a ratio of 6:12 to 12:12.
In some embodiments, Y and X are in a ratio of 9:12 to 12:12. In some embodiments, Y and X are in a ratio of 10:12 to 12:12. In some embodiments, Y and X are in a ratio of
11:12 to 12:12.
In some embodiments, Y and X are in a ratio of 4:12 to 11:12. In some embodiments, Y and X are in a ratio of 4:12 to 10:12. In some embodiments, Y and X are in a ratio of 4:12 to 9:12. In some embodiments, Y and X are in a ratio of 4:12 to 8:12. In some embodiments, Y and X are in a ratio of 4:12 to 7:12. In some embodiments, Y and X are in a ratio of 4:12 to 6:12. In some embodiments, Y and X are in a ratio of 4:12 to 5:12. In some embodiments, Y and X are in a ratio of 5:12 to 11:12. In some embodiments, Y and X are in a ratio of 6:12 to 10:12. In some embodiments, Y and X are in a ratio of 7:12 to 9:12. In some embodiments, Y
and X are in a ratio of 2:12. In some embodiments, Y and X are in a ratio of 3:12.
In some embodiments, light enters an area between an upper surface 319 of the photovoltaic module 310b and the beveled portion 345 of the photovoltaic module 310a. In some embodiments, the light reaches at least a portion 313 of at least one solar cell 312 of the photovoltaic module 310b.
Referring to FIG. 9, in some embodiments, the backsheet 328 includes a reflective portion 349. In some embodiment, the reflective portion 349 is located on the surface 332 of the backsheet 328. In some embodiments, the reflective portion 349 extends from the first edge 338 to a location 351 between the first edge 338 and the second edge 340. In some embodiment, the reflective portion 349 includes the beveled portion 345W In some embodiments, the reflective portion 349 has a width W2. In some embodiments, the width W2 extends from the first edge 338 to the location 3M. In some embodiments, the width W2 is equal to the overlap D3. In some embodiments, the width W2 is substantially equal to the overlap D3. In some embodiments, the width W2 is greater than the overlap D3. In some embodiments, the width W2 is less than the overlap D3.
In some embodiments, the reflective portion 349 includes a reflective color.
In some embodiments, the reflective color is white. In some embodiment, the reflective portion 349 is painted. In some embodiments, the reflective portion 349 includes a pigment.
In some embodiments, the color of the reflective portion 349 is printed. In some embodiments, reflected light intensity in the area Al overlapped by the reflective portion 349 will depend on the angle of solar incidence (i.e., a combination of roof pitch and solar elevation), and the width W2. In some embodiments, the more bounces the light has to go through to reach the solar cell 312, the lower the intensity. In some embodiments, the width W2 is less than 1 times a thickness T of the frontsheet M6. In some embodiments, the width W2 is less than 2 times the thickness T of the frontsheet 316. In some embodiments, the width W2 is less than 3 times a thickness T of the frontsheet 316.
While a number of embodiments of the present invention have been described, it is understood that these embodiments are illustrative only, and not restrictive, and that many modifications may become apparent to those of ordinary skill in the art.
Further still, the various steps may be carried out in any desired order (and any desired steps may be added and/or any desired steps may be eliminated).
In some embodiments, Y and X are in a ratio of 4:12 to 11:12. In some embodiments, Y and X are in a ratio of 4:12 to 10:12. In some embodiments, Y and X are in a ratio of 4:12 to 9:12. In some embodiments, Y and X are in a ratio of 4:12 to 8:12. In some embodiments, Y and X are in a ratio of 4:12 to 7:12. In some embodiments, Y and X are in a ratio of 4:12 to 6:12. In some embodiments, Y and X are in a ratio of 4:12 to 5:12. In some embodiments, Y and X are in a ratio of 5:12 to 11:12. In some embodiments, Y and X are in a ratio of 6:12 to 10:12. In some embodiments, Y and X are in a ratio of 7:12 to 9:12. In some embodiments, Y
and X are in a ratio of 2:12. In some embodiments, Y and X are in a ratio of 3:12.
In some embodiments, light enters an area between an upper surface 319 of the photovoltaic module 310b and the beveled portion 345 of the photovoltaic module 310a. In some embodiments, the light reaches at least a portion 313 of at least one solar cell 312 of the photovoltaic module 310b.
Referring to FIG. 9, in some embodiments, the backsheet 328 includes a reflective portion 349. In some embodiment, the reflective portion 349 is located on the surface 332 of the backsheet 328. In some embodiments, the reflective portion 349 extends from the first edge 338 to a location 351 between the first edge 338 and the second edge 340. In some embodiment, the reflective portion 349 includes the beveled portion 345W In some embodiments, the reflective portion 349 has a width W2. In some embodiments, the width W2 extends from the first edge 338 to the location 3M. In some embodiments, the width W2 is equal to the overlap D3. In some embodiments, the width W2 is substantially equal to the overlap D3. In some embodiments, the width W2 is greater than the overlap D3. In some embodiments, the width W2 is less than the overlap D3.
In some embodiments, the reflective portion 349 includes a reflective color.
In some embodiments, the reflective color is white. In some embodiment, the reflective portion 349 is painted. In some embodiments, the reflective portion 349 includes a pigment.
In some embodiments, the color of the reflective portion 349 is printed. In some embodiments, reflected light intensity in the area Al overlapped by the reflective portion 349 will depend on the angle of solar incidence (i.e., a combination of roof pitch and solar elevation), and the width W2. In some embodiments, the more bounces the light has to go through to reach the solar cell 312, the lower the intensity. In some embodiments, the width W2 is less than 1 times a thickness T of the frontsheet M6. In some embodiments, the width W2 is less than 2 times the thickness T of the frontsheet 316. In some embodiments, the width W2 is less than 3 times a thickness T of the frontsheet 316.
While a number of embodiments of the present invention have been described, it is understood that these embodiments are illustrative only, and not restrictive, and that many modifications may become apparent to those of ordinary skill in the art.
Further still, the various steps may be carried out in any desired order (and any desired steps may be added and/or any desired steps may be eliminated).
Claims (20)
1. A system, comprising:
a plurality of photovoltaic modules, each of the photovoltaic modules includes at least one solar cell;
an encapsulant encapsulating the at least one solar cell, wherein the encapsulant includes a first end, a second end opposite the first end, a first surface extending from the first end to the second end, and a second surface opposite the first surface and extending from the first end to the second end, wherein the encapsulant is transparent;
a frontsheet juxtaposed with the first surface of the encapsulant, wherein the frontsheet includes a first end and a second end opposite the first end of the frontsheet, wherein the frontsheet is transparent; and a backsheet juxtaposed with the second surface of the encapsulant, wherein the backsheet includes a first section, and a second section juxtaposed with the first section, wherein the first section is transparent, wherei n the second secti on i s n on -tran sparent, wherein the first end of the frontsheet, the first end of the encapsulant, and the first section of the backsheet form a transparent portion, wherein a first photovoltaic module of the plurality of photovoltaic modules overlays at least a portion of a second photovoltaic module of the plurality of photovoltaic modules, and wherein the transparent portion of the first photovoltaic module overlays at least a portion of the at least one solar cell of the second photovoltaic module.
a plurality of photovoltaic modules, each of the photovoltaic modules includes at least one solar cell;
an encapsulant encapsulating the at least one solar cell, wherein the encapsulant includes a first end, a second end opposite the first end, a first surface extending from the first end to the second end, and a second surface opposite the first surface and extending from the first end to the second end, wherein the encapsulant is transparent;
a frontsheet juxtaposed with the first surface of the encapsulant, wherein the frontsheet includes a first end and a second end opposite the first end of the frontsheet, wherein the frontsheet is transparent; and a backsheet juxtaposed with the second surface of the encapsulant, wherein the backsheet includes a first section, and a second section juxtaposed with the first section, wherein the first section is transparent, wherei n the second secti on i s n on -tran sparent, wherein the first end of the frontsheet, the first end of the encapsulant, and the first section of the backsheet form a transparent portion, wherein a first photovoltaic module of the plurality of photovoltaic modules overlays at least a portion of a second photovoltaic module of the plurality of photovoltaic modules, and wherein the transparent portion of the first photovoltaic module overlays at least a portion of the at least one solar cell of the second photovoltaic module.
2. The system of Claim 1, wherein each of the photovoltaic modules includes a first edge, and a second edge opposite the first edge, wherein the first section extends from the first edge to a first location intermediate the first edge and the second edge, and wherein the second section extends from the first location to the second edge.
3. The system of Claim 2, wherein the backsheet includes a first surface, a second surface opposite the first surface of the backsheet, a first side extending from the first edge to the second edge, and a second side opposite the first side and extending from the first edge to the second edge, wherein the first section extends from the first side to the second side and from the first surface to the second surface.
4. The system of Claim 3, wherein the second section extends from the first side to the second side and from the first surface of the backsheet to the second surface of the backsheet.
5. The system of Claim 2, wherein the first section includes a width measured from the first edge to the first location.
6. The system of Claim 5, wherein the width is 5 mm to 30 mm.
7. The system of Claim 1, wherein each of the plurality of photovoltaic modules includes an adhesive juxtaposed with the backsheet, and wherein the adhesive is transparent.
8. The system of Claim 7, wherein the adhesive is juxtaposed with the first section.
9. The system of Claim 7, wherein the adhesive is substantially aligned with the first section.
10. The system of Claim 7, wherein the adhesive optically couples the first photovoltaic module with the second photovoltaic module.
11. The system of Claim 5, wherein each of the photovoltaic modules includes a creepage distance extending from the first edge to a first end of the at least one solar cell.
12. The system of Claim 11, wherein the creepage distance is equal to the width of the first section of the backsheet.
13. The system of Claim 11, wherein the transparent portion of the first photovoltaic module overlays the at least one solar cell at an overlap distance.
14. The system of Claim 13, wherein the overlap distance is less than or equal to the creepage distance.
15. The system of Claim 11, wherein the first photovoltaic module overlaps the second photovoltaic module of a distance twice the creepage distance
16. The system of Claim 1, wherein the first section includes a first layer and the second section includes a second layer.
17. The system of Claim 16, wherein each of the photovoltaic modules includes a first edge, and a second edge opposite the first edge, wherein the first layer extends from the first edge to the second edge, and wherein the second layer extends from the second edge to a first location intermediate the first edge and the second edge.
18. A photovoltaic module, comprising:
at least one solar cell;
an encapsulant encapsulating the at least one solar cell, wherein the encapsulant includes a first end, a second end opposite the first end, a first surface extending from the first end to the second end, and a second surface opposite the first surface and extending from the first end to the second end, wherein the encapsulant is transparent;
a frontsheet juxtaposed with the first surface of the encapsulant, wherein the frontsheet includes a first end and a second end opposite the first end of the frontsheet, wherein the frontsheet is transparent; and a backsheet juxtaposed with the second surface of the encapsulant, wherein the backsheet includes a first section, and a second section juxtaposed with the first section, wherein the first section is transparent, wherein the second section is non-transparent, wherein the first end of the frontsheet, the first end of the encapsulant, and the first section of the backsheet form a transparent portion, wherein the transparent portion of the photovoltaic module is configured to overlay at least a portion of at least one solar cell of another photovoltaic module.
at least one solar cell;
an encapsulant encapsulating the at least one solar cell, wherein the encapsulant includes a first end, a second end opposite the first end, a first surface extending from the first end to the second end, and a second surface opposite the first surface and extending from the first end to the second end, wherein the encapsulant is transparent;
a frontsheet juxtaposed with the first surface of the encapsulant, wherein the frontsheet includes a first end and a second end opposite the first end of the frontsheet, wherein the frontsheet is transparent; and a backsheet juxtaposed with the second surface of the encapsulant, wherein the backsheet includes a first section, and a second section juxtaposed with the first section, wherein the first section is transparent, wherein the second section is non-transparent, wherein the first end of the frontsheet, the first end of the encapsulant, and the first section of the backsheet form a transparent portion, wherein the transparent portion of the photovoltaic module is configured to overlay at least a portion of at least one solar cell of another photovoltaic module.
19. A system, comprising:
a plurality of photovoltaic modules, each of the photovoltaic modules includes at least one solar cell;
an encapsulant encapsulating the at least one solar cell, wherein the encapsulant includes a first end, a second end opposite the first end, a first surface extending from the first end to the second end, and a second surface opposite the first surface and extending from the first end to the second end, wherein the encap sul ant is transparent;
a frontsheet juxtaposed with the first surface of the encapsulant, wherein the frontsheet includes a first end and a second end opposite the first end of the frontsheet, wherein the frontsheet is transparent; and a backsheet juxtaposed with the second surface of the encapsulant, wherein the backsheet includes a first section, wherein the first section includes a beveled portion, and wherein a first photovoltaic module of the plurality of photovoltaic modules overlays at least a portion of a second photovoltaic module of the plurality of photovoltaic modules, and wherein the beveled portion of the first photovoltaic module overlays at least a portion of the at least one solar cell of the second photovoltaic module.
a plurality of photovoltaic modules, each of the photovoltaic modules includes at least one solar cell;
an encapsulant encapsulating the at least one solar cell, wherein the encapsulant includes a first end, a second end opposite the first end, a first surface extending from the first end to the second end, and a second surface opposite the first surface and extending from the first end to the second end, wherein the encap sul ant is transparent;
a frontsheet juxtaposed with the first surface of the encapsulant, wherein the frontsheet includes a first end and a second end opposite the first end of the frontsheet, wherein the frontsheet is transparent; and a backsheet juxtaposed with the second surface of the encapsulant, wherein the backsheet includes a first section, wherein the first section includes a beveled portion, and wherein a first photovoltaic module of the plurality of photovoltaic modules overlays at least a portion of a second photovoltaic module of the plurality of photovoltaic modules, and wherein the beveled portion of the first photovoltaic module overlays at least a portion of the at least one solar cell of the second photovoltaic module.
20. The system of Claim 19, wherein the beveled portion includes a reflective portion.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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2022
- 2022-05-06 US US17/738,292 patent/US11527665B2/en active Active
- 2022-05-06 CA CA3212461A patent/CA3212461A1/en active Pending
- 2022-05-06 WO PCT/US2022/028038 patent/WO2022236029A1/en active Application Filing
- 2022-11-29 US US18/059,904 patent/US11869997B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US11527665B2 (en) | 2022-12-13 |
US20230092414A1 (en) | 2023-03-23 |
US11869997B2 (en) | 2024-01-09 |
US20220359776A1 (en) | 2022-11-10 |
WO2022236029A1 (en) | 2022-11-10 |
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