CA2936523A1 - Micro dispositif selectif de transfert vers un substrat recepteur - Google Patents
Micro dispositif selectif de transfert vers un substrat recepteur Download PDFInfo
- Publication number
- CA2936523A1 CA2936523A1 CA2936523A CA2936523A CA2936523A1 CA 2936523 A1 CA2936523 A1 CA 2936523A1 CA 2936523 A CA2936523 A CA 2936523A CA 2936523 A CA2936523 A CA 2936523A CA 2936523 A1 CA2936523 A1 CA 2936523A1
- Authority
- CA
- Canada
- Prior art keywords
- substrate
- force
- donor
- micro devices
- receiver
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 432
- 238000012546 transfer Methods 0.000 title claims description 84
- 238000000034 method Methods 0.000 claims abstract description 119
- 239000012528 membrane Substances 0.000 claims description 8
- 230000002829 reductive effect Effects 0.000 claims description 7
- 230000002441 reversible effect Effects 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 abstract description 38
- 230000001070 adhesive effect Effects 0.000 abstract description 38
- 239000010410 layer Substances 0.000 description 71
- 238000000594 atomic force spectroscopy Methods 0.000 description 49
- 230000008569 process Effects 0.000 description 21
- 239000011295 pitch Substances 0.000 description 20
- 238000010438 heat treatment Methods 0.000 description 19
- 238000012360 testing method Methods 0.000 description 17
- 230000003313 weakening effect Effects 0.000 description 15
- 239000012790 adhesive layer Substances 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 11
- 238000012545 processing Methods 0.000 description 10
- 239000000463 material Substances 0.000 description 9
- 230000003287 optical effect Effects 0.000 description 9
- 230000002950 deficient Effects 0.000 description 6
- 239000000945 filler Substances 0.000 description 6
- 238000001312 dry etching Methods 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 5
- 238000001039 wet etching Methods 0.000 description 5
- 238000013459 approach Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- 238000012805 post-processing Methods 0.000 description 4
- 238000000151 deposition Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000007373 indentation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000036961 partial effect Effects 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 230000008439 repair process Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000001846 repelling effect Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C99/00—Subject matter not provided for in other groups of this subclass
- B81C99/0005—Apparatus specially adapted for the manufacture or treatment of microstructural devices or systems, or methods for manufacturing the same
- B81C99/002—Apparatus for assembling MEMS, e.g. micromanipulators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0093—Wafer bonding; Removal of the growth substrate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Micromachines (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CA2936523A CA2936523A1 (fr) | 2016-07-19 | 2016-07-19 | Micro dispositif selectif de transfert vers un substrat recepteur |
US15/442,293 US20170215280A1 (en) | 2016-01-21 | 2017-02-24 | Selective transfer of micro devices |
US17/222,506 US20210243894A1 (en) | 2016-01-21 | 2021-04-05 | Selective transfer of micro devices |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CA2936523A CA2936523A1 (fr) | 2016-07-19 | 2016-07-19 | Micro dispositif selectif de transfert vers un substrat recepteur |
Publications (1)
Publication Number | Publication Date |
---|---|
CA2936523A1 true CA2936523A1 (fr) | 2018-01-19 |
Family
ID=60989348
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA2936523A Abandoned CA2936523A1 (fr) | 2016-01-21 | 2016-07-19 | Micro dispositif selectif de transfert vers un substrat recepteur |
Country Status (1)
Country | Link |
---|---|
CA (1) | CA2936523A1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022207083A1 (fr) * | 2021-03-30 | 2022-10-06 | Ev Group E. Thallner Gmbh | Procédé de séparation de structures d'un substrat |
-
2016
- 2016-07-19 CA CA2936523A patent/CA2936523A1/fr not_active Abandoned
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022207083A1 (fr) * | 2021-03-30 | 2022-10-06 | Ev Group E. Thallner Gmbh | Procédé de séparation de structures d'un substrat |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FZDE | Discontinued |
Effective date: 20190719 |
|
FZDE | Discontinued |
Effective date: 20190719 |