CA2921737A1 - Integration de micro dispositif dans un substrat de systeme - Google Patents

Integration de micro dispositif dans un substrat de systeme Download PDF

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Publication number
CA2921737A1
CA2921737A1 CA2921737A CA2921737A CA2921737A1 CA 2921737 A1 CA2921737 A1 CA 2921737A1 CA 2921737 A CA2921737 A CA 2921737A CA 2921737 A CA2921737 A CA 2921737A CA 2921737 A1 CA2921737 A1 CA 2921737A1
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Canada
Prior art keywords
dielectric layer
layer
micro device
micro
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA2921737A
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English (en)
Inventor
Reza Rc Chaji
Ehsanallah Fathi
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Individual
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Individual
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Publication date
Application filed by Individual filed Critical Individual
Priority to CA2921737A priority Critical patent/CA2921737A1/fr
Priority to US15/442,293 priority patent/US20170215280A1/en
Publication of CA2921737A1 publication Critical patent/CA2921737A1/fr
Priority to US17/222,506 priority patent/US20210243894A1/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
CA2921737A 2016-01-21 2016-02-25 Integration de micro dispositif dans un substrat de systeme Abandoned CA2921737A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CA2921737A CA2921737A1 (fr) 2016-02-25 2016-02-25 Integration de micro dispositif dans un substrat de systeme
US15/442,293 US20170215280A1 (en) 2016-01-21 2017-02-24 Selective transfer of micro devices
US17/222,506 US20210243894A1 (en) 2016-01-21 2021-04-05 Selective transfer of micro devices

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Application Number Priority Date Filing Date Title
CA2921737A CA2921737A1 (fr) 2016-02-25 2016-02-25 Integration de micro dispositif dans un substrat de systeme

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022047587A1 (fr) * 2020-09-02 2022-03-10 Vuereal Inc. Liaison à basse température d'intégration de microdispositif dans un substrat de système

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022047587A1 (fr) * 2020-09-02 2022-03-10 Vuereal Inc. Liaison à basse température d'intégration de microdispositif dans un substrat de système

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