CA2922426C - Pressure sensor package with stress isolation features - Google Patents
Pressure sensor package with stress isolation features Download PDFInfo
- Publication number
- CA2922426C CA2922426C CA2922426A CA2922426A CA2922426C CA 2922426 C CA2922426 C CA 2922426C CA 2922426 A CA2922426 A CA 2922426A CA 2922426 A CA2922426 A CA 2922426A CA 2922426 C CA2922426 C CA 2922426C
- Authority
- CA
- Canada
- Prior art keywords
- sensor package
- mounting surface
- cylindrical body
- passage
- die
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000002955 isolation Methods 0.000 title description 21
- 230000004888 barrier function Effects 0.000 claims description 10
- 230000013011 mating Effects 0.000 claims description 8
- 239000012530 fluid Substances 0.000 claims description 5
- 238000006073 displacement reaction Methods 0.000 claims description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical group C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 10
- 238000009530 blood pressure measurement Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000007789 sealing Methods 0.000 description 5
- 238000004891 communication Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- 230000035515 penetration Effects 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000034373 developmental growth involved in morphogenesis Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005019 vapor deposition process Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0058—Packages or encapsulation for protecting against damages due to external chemical or mechanical influences, e.g. shocks or vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0045—Packages or encapsulation for reducing stress inside of the package structure
- B81B7/0048—Packages or encapsulation for reducing stress inside of the package structure between the MEMS die and the substrate
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/005—Measuring force or stress, in general by electrical means and not provided for in G01L1/06 - G01L1/22
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2207/00—Microstructural systems or auxiliary parts thereof
- B81B2207/01—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS
- B81B2207/015—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS the micromechanical device and the control or processing electronics being integrated on the same substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
- Pressure Sensors (AREA)
- Facsimile Heads (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/716,515 US9963341B2 (en) | 2015-05-19 | 2015-05-19 | Pressure sensor package with stress isolation features |
| US14/716,515 | 2015-05-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2922426A1 CA2922426A1 (en) | 2016-11-19 |
| CA2922426C true CA2922426C (en) | 2023-11-28 |
Family
ID=56120907
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA2922426A Active CA2922426C (en) | 2015-05-19 | 2016-03-02 | Pressure sensor package with stress isolation features |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9963341B2 (zh) |
| EP (1) | EP3095756B1 (zh) |
| CN (1) | CN106168513B (zh) |
| BR (1) | BR102016008076B1 (zh) |
| CA (1) | CA2922426C (zh) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10065853B2 (en) * | 2016-05-23 | 2018-09-04 | Rosemount Aerospace Inc. | Optimized epoxy die attach geometry for MEMS die |
| US10457547B2 (en) * | 2017-05-05 | 2019-10-29 | Dunan Microstaq, Inc. | Multi-layer, stress-isolation platform for a MEMS die |
| US11656138B2 (en) | 2020-06-19 | 2023-05-23 | Rosemount Inc. | Pressure sensor assembly |
| US11692895B2 (en) | 2021-03-30 | 2023-07-04 | Rosemount Aerospace Inc. | Differential pressure sensor |
| CN113579085B (zh) * | 2021-07-16 | 2023-03-31 | 杭州科岛微电子有限公司 | 扩散硅压力传感器的一种充油芯体封装结构制造方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58146827A (ja) * | 1982-02-25 | 1983-09-01 | Fuji Electric Co Ltd | 半導体式圧力センサ |
| CN1279338C (zh) * | 2004-11-19 | 2006-10-11 | 清华大学 | 共振隧穿微机械力传感器及其制造方法 |
| EP1837303A1 (en) | 2006-03-24 | 2007-09-26 | Infineon Technologies SensoNor AS | Integrated pedestal mount for mems structure |
| US7377177B1 (en) | 2007-04-13 | 2008-05-27 | Honeywell International Inc. | Pressure sensor method and apparatus |
| US7647835B2 (en) | 2007-09-19 | 2010-01-19 | Honeywell International Inc. | Pressure sensor stress isolation pedestal |
| US8322225B2 (en) | 2009-07-10 | 2012-12-04 | Honeywell International Inc. | Sensor package assembly having an unconstrained sense die |
| CN201974255U (zh) * | 2011-02-16 | 2011-09-14 | 蚌埠市立群电子有限公司 | 压力传感器用微晶玻璃密封基座 |
| US9010190B2 (en) | 2012-04-20 | 2015-04-21 | Rosemount Aerospace Inc. | Stress isolated MEMS structures and methods of manufacture |
| US8820170B2 (en) * | 2012-09-14 | 2014-09-02 | Sensata Technologies, Inc. | Pressure sensor |
| US9027410B2 (en) * | 2012-09-14 | 2015-05-12 | Sensata Technologies, Inc. | Hermetically glass sealed pressure sensor |
-
2015
- 2015-05-19 US US14/716,515 patent/US9963341B2/en active Active
-
2016
- 2016-03-01 CN CN201610115019.XA patent/CN106168513B/zh active Active
- 2016-03-02 CA CA2922426A patent/CA2922426C/en active Active
- 2016-04-12 BR BR102016008076-2A patent/BR102016008076B1/pt active IP Right Grant
- 2016-05-18 EP EP16170089.3A patent/EP3095756B1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN106168513B (zh) | 2019-12-20 |
| CA2922426A1 (en) | 2016-11-19 |
| BR102016008076A2 (pt) | 2016-11-22 |
| US9963341B2 (en) | 2018-05-08 |
| CN106168513A (zh) | 2016-11-30 |
| US20160340176A1 (en) | 2016-11-24 |
| EP3095756A1 (en) | 2016-11-23 |
| EP3095756B1 (en) | 2018-04-11 |
| BR102016008076B1 (pt) | 2023-04-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EEER | Examination request |
Effective date: 20200901 |
|
| EEER | Examination request |
Effective date: 20200901 |
|
| EEER | Examination request |
Effective date: 20200901 |
|
| EEER | Examination request |
Effective date: 20200901 |
|
| EEER | Examination request |
Effective date: 20200901 |
|
| EEER | Examination request |
Effective date: 20200901 |
|
| EEER | Examination request |
Effective date: 20200901 |
|
| EEER | Examination request |
Effective date: 20200901 |