CA2893584C - Method for forming thin film conductors on a substrate - Google Patents

Method for forming thin film conductors on a substrate Download PDF

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Publication number
CA2893584C
CA2893584C CA2893584A CA2893584A CA2893584C CA 2893584 C CA2893584 C CA 2893584C CA 2893584 A CA2893584 A CA 2893584A CA 2893584 A CA2893584 A CA 2893584A CA 2893584 C CA2893584 C CA 2893584C
Authority
CA
Canada
Prior art keywords
thin film
precursor material
substrate
film precursor
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CA2893584A
Other languages
English (en)
French (fr)
Other versions
CA2893584A1 (en
Inventor
Andrew E. Edd
Charles C. Munson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NCC Nano LLC
Original Assignee
NCC Nano LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NCC Nano LLC filed Critical NCC Nano LLC
Publication of CA2893584A1 publication Critical patent/CA2893584A1/en
Application granted granted Critical
Publication of CA2893584C publication Critical patent/CA2893584C/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283After-treatment of the printed patterns, e.g. sintering or curing methods
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0386Paper sheets
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0393Flexible materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0104Properties and characteristics in general
    • H05K2201/0116Porous, e.g. foam
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0104Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15Position of the PCB during processing
    • H05K2203/1545Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/102Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Electric Cables (AREA)
CA2893584A 2012-12-03 2012-12-03 Method for forming thin film conductors on a substrate Active CA2893584C (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2012/067607 WO2014088546A1 (en) 2012-12-03 2012-12-03 Method for forming thin film conductors on a substrate

Publications (2)

Publication Number Publication Date
CA2893584A1 CA2893584A1 (en) 2014-06-12
CA2893584C true CA2893584C (en) 2019-05-21

Family

ID=50883816

Family Applications (1)

Application Number Title Priority Date Filing Date
CA2893584A Active CA2893584C (en) 2012-12-03 2012-12-03 Method for forming thin film conductors on a substrate

Country Status (4)

Country Link
EP (1) EP2926367A4 (ja)
JP (1) JP6202763B2 (ja)
CA (1) CA2893584C (ja)
WO (1) WO2014088546A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6313474B2 (ja) * 2015-01-06 2018-04-18 株式会社フジクラ 導体層の製造方法及び配線基板
JP2016171051A (ja) * 2015-03-16 2016-09-23 Dowaエレクトロニクス株式会社 導電膜およびその製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5311027A (en) * 1993-02-26 1994-05-10 Raychem Corporation Apparatus and method for uniformly irradiating a strand
US6257133B1 (en) * 1999-03-15 2001-07-10 International Paper Method and apparatus for controlling cross directional nip dynamics
JP2001064547A (ja) * 1999-09-01 2001-03-13 Toyo Ink Mfg Co Ltd 活性エネルギー線硬化型導電性ペースト、それを用いた導体回路および非接触id
US20040185388A1 (en) * 2003-01-29 2004-09-23 Hiroyuki Hirai Printed circuit board, method for producing same, and ink therefor
JP4858057B2 (ja) * 2006-09-29 2012-01-18 大日本印刷株式会社 導電性基板の製造方法
US10231344B2 (en) * 2007-05-18 2019-03-12 Applied Nanotech Holdings, Inc. Metallic ink
DE102007051930A1 (de) * 2007-10-29 2009-04-30 Leonhard Kurz Gmbh & Co. Kg Verfahren zur Herstellung einer Leiterbahnstruktur
US9564629B2 (en) * 2008-01-02 2017-02-07 Nanotek Instruments, Inc. Hybrid nano-filament anode compositions for lithium ion batteries
US7960027B2 (en) * 2008-01-28 2011-06-14 Honeywell International Inc. Transparent conductors and methods for fabricating transparent conductors
JP5339089B2 (ja) * 2008-02-13 2013-11-13 住友金属鉱山株式会社 フレキシブル透明導電フィルムとフレキシブル機能性素子およびこれ等の製造方法
US20100231672A1 (en) * 2009-03-12 2010-09-16 Margaret Joyce Method of improving the electrical conductivity of a conductive ink trace pattern and system therefor
WO2010123733A1 (en) * 2009-04-21 2010-10-28 Molex Incorporated Three dimensional antenna
US8741105B2 (en) * 2009-09-01 2014-06-03 Awi Licensing Company Cellulosic product forming process and wet formed cellulosic product
US9179545B2 (en) * 2009-10-27 2015-11-03 Panasonic Intellectual Property Management Co., Ltd. Base material with a conductor pattern,and a method of forming a base material with a conductor pattern
US8907258B2 (en) * 2010-04-08 2014-12-09 Ncc Nano, Llc Apparatus for providing transient thermal profile processing on a moving substrate

Also Published As

Publication number Publication date
WO2014088546A1 (en) 2014-06-12
EP2926367A1 (en) 2015-10-07
EP2926367A4 (en) 2016-07-27
CA2893584A1 (en) 2014-06-12
JP6202763B2 (ja) 2017-09-27
JP2016501431A (ja) 2016-01-18

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Effective date: 20170607