CA2680214A1 - Low lead copper alloy - Google Patents
Low lead copper alloy Download PDFInfo
- Publication number
- CA2680214A1 CA2680214A1 CA 2680214 CA2680214A CA2680214A1 CA 2680214 A1 CA2680214 A1 CA 2680214A1 CA 2680214 CA2680214 CA 2680214 CA 2680214 A CA2680214 A CA 2680214A CA 2680214 A1 CA2680214 A1 CA 2680214A1
- Authority
- CA
- Canada
- Prior art keywords
- copper alloy
- lead
- low
- lead copper
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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- Domestic Plumbing Installations (AREA)
- Conductive Materials (AREA)
Abstract
The present invention provides a low-lead copper alloy, comprising 0.05 to 0.3 wt% of lead, 0.3 to 0.8 wt% of aluminum, 0.01 to 3 wt% of bismuth, 1 to 4 wt% of silicon, 0.1 to 1 wt% of tin, and more than 93.6% of copper and zinc, wherein copper is in an amount ranging from 61 to 78 wt%. The low-lead copper alloy of the present invention has excellent toughness and processability, and can provide increased resistance in an environment with a high concentration of chlorine ions.
Claims (7)
1. A low-lead copper alloy, comprising:
0.05 to 0.3 wt% of lead;
0.3 to 0.8 wt% of aluminum;
0.01 to 0.3 wt% of bismuth;
1 to 4 wt% of silicon;
0.1 to 1 wt% of tin; and more than 93.6% of copper and zinc, wherein the copper is in an amount ranging from 61 to 78 wt%.
0.05 to 0.3 wt% of lead;
0.3 to 0.8 wt% of aluminum;
0.01 to 0.3 wt% of bismuth;
1 to 4 wt% of silicon;
0.1 to 1 wt% of tin; and more than 93.6% of copper and zinc, wherein the copper is in an amount ranging from 61 to 78 wt%.
2. The low-lead copper alloy of claim 1, wherein the lead is in an amount ranging from 0.15 to 0.25 wt%.
3. The low-lead copper alloy of claim 1, wherein the aluminum is in an amount ranging from 0.5 to 0.65 wt%.
4. The low-lead copper alloy of claim 1, wherein the bismuth is in an amount ranging from 0.1 to 0.2 wt%.
5. The low-lead copper alloy of claim 1, wherein the silicon is in an amount ranging from 2 to 3 wt%.
6. The low-lead copper alloy of claim 1, wherein the copper is in an amount ranging from 0.4 to 0.8 wt%.
7. The low-lead copper alloy of claim 1, wherein the copper is in an amount ranging from 62 to 74 wt%.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW098128163 | 2009-08-21 | ||
| TW098128163A TWI392752B (en) | 2009-08-21 | 2009-08-21 | Low-lead copper alloy |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2680214A1 true CA2680214A1 (en) | 2011-02-21 |
| CA2680214C CA2680214C (en) | 2012-04-24 |
Family
ID=43618918
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA 2680214 Expired - Fee Related CA2680214C (en) | 2009-08-21 | 2009-09-29 | Low lead copper alloy |
Country Status (2)
| Country | Link |
|---|---|
| CA (1) | CA2680214C (en) |
| TW (1) | TWI392752B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013065830A1 (en) | 2011-11-04 | 2013-05-10 | 三菱伸銅株式会社 | Hot-forged copper alloy article |
| TWI740299B (en) | 2019-06-25 | 2021-09-21 | 日商三菱綜合材料股份有限公司 | Free-cutting copper alloy and manufacturing method of free-cutting copper alloy |
| TWI751825B (en) * | 2019-12-11 | 2022-01-01 | 日商三菱綜合材料股份有限公司 | Free-cutting copper alloy and manufacturing method of free-cutting copper alloy |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI577931B (en) * | 2015-05-28 | 2017-04-11 | 建準電機工業股份有限公司 | Motor of ceiling fan with illuminating module |
-
2009
- 2009-08-21 TW TW098128163A patent/TWI392752B/en not_active IP Right Cessation
- 2009-09-29 CA CA 2680214 patent/CA2680214C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| TW201107501A (en) | 2011-03-01 |
| TWI392752B (en) | 2013-04-11 |
| CA2680214C (en) | 2012-04-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EEER | Examination request | ||
| MKLA | Lapsed |
Effective date: 20170929 |