CA2658127A1 - Polishing pad having micro-grooves on the pad surface - Google Patents
Polishing pad having micro-grooves on the pad surface Download PDFInfo
- Publication number
- CA2658127A1 CA2658127A1 CA002658127A CA2658127A CA2658127A1 CA 2658127 A1 CA2658127 A1 CA 2658127A1 CA 002658127 A CA002658127 A CA 002658127A CA 2658127 A CA2658127 A CA 2658127A CA 2658127 A1 CA2658127 A1 CA 2658127A1
- Authority
- CA
- Canada
- Prior art keywords
- pad
- grooves
- insoluble
- micro
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 71
- 239000000835 fiber Substances 0.000 claims abstract description 72
- 238000000034 method Methods 0.000 claims abstract description 22
- 238000007517 polishing process Methods 0.000 claims abstract description 6
- 239000002002 slurry Substances 0.000 claims description 28
- 238000002844 melting Methods 0.000 claims description 19
- 230000008018 melting Effects 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 13
- 239000000126 substance Substances 0.000 claims description 12
- 239000004744 fabric Substances 0.000 claims description 11
- 239000000203 mixture Substances 0.000 claims description 11
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 239000011230 binding agent Substances 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 4
- 229920000642 polymer Polymers 0.000 claims description 4
- 239000002952 polymeric resin Substances 0.000 claims description 3
- 229920003002 synthetic resin Polymers 0.000 claims description 3
- 239000003054 catalyst Substances 0.000 claims description 2
- 230000003993 interaction Effects 0.000 claims description 2
- 239000006174 pH buffer Substances 0.000 claims description 2
- 239000004094 surface-active agent Substances 0.000 claims description 2
- 238000000137 annealing Methods 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 239000004745 nonwoven fabric Substances 0.000 description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 11
- 229910003460 diamond Inorganic materials 0.000 description 7
- 239000010432 diamond Substances 0.000 description 7
- 230000003750 conditioning effect Effects 0.000 description 6
- 238000003491 array Methods 0.000 description 4
- 238000004090 dissolution Methods 0.000 description 4
- -1 i.e. Substances 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 230000001172 regenerating effect Effects 0.000 description 3
- 229920001730 Moisture cure polyurethane Polymers 0.000 description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 238000007373 indentation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 1
- 229920000858 Cyclodextrin Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 238000006136 alcoholysis reaction Methods 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005234 chemical deposition Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 150000004676 glycans Chemical class 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000017 hydrogel Substances 0.000 description 1
- 239000011344 liquid material Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 238000009828 non-uniform distribution Methods 0.000 description 1
- 238000005289 physical deposition Methods 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001282 polysaccharide Polymers 0.000 description 1
- 239000005017 polysaccharide Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000002964 rayon Substances 0.000 description 1
- 239000004627 regenerated cellulose Substances 0.000 description 1
- 230000008929 regeneration Effects 0.000 description 1
- 238000011069 regeneration method Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- HFHDHCJBZVLPGP-UHFFFAOYSA-N schardinger α-dextrin Chemical compound O1C(C(C2O)O)C(CO)OC2OC(C(C2O)O)C(CO)OC2OC(C(C2O)O)C(CO)OC2OC(C(O)C2O)C(CO)OC2OC(C(C2O)O)C(CO)OC2OC2C(O)C(O)C1OC2CO HFHDHCJBZVLPGP-UHFFFAOYSA-N 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US83159506P | 2006-07-19 | 2006-07-19 | |
| US60/831,595 | 2006-07-19 | ||
| PCT/US2007/073921 WO2008011535A2 (en) | 2006-07-19 | 2007-07-19 | Polishing pad having micro-grooves on the pad surface |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2658127A1 true CA2658127A1 (en) | 2008-01-24 |
Family
ID=38957633
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002658127A Abandoned CA2658127A1 (en) | 2006-07-19 | 2007-07-19 | Polishing pad having micro-grooves on the pad surface |
Country Status (9)
| Country | Link |
|---|---|
| US (3) | US8137166B2 (https=) |
| EP (1) | EP2040878A4 (https=) |
| JP (1) | JP5460316B2 (https=) |
| KR (1) | KR101409377B1 (https=) |
| CN (1) | CN101511533B (https=) |
| CA (1) | CA2658127A1 (https=) |
| MY (1) | MY151014A (https=) |
| TW (1) | TWI409136B (https=) |
| WO (1) | WO2008011535A2 (https=) |
Families Citing this family (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9180570B2 (en) | 2008-03-14 | 2015-11-10 | Nexplanar Corporation | Grooved CMP pad |
| US8377351B2 (en) * | 2008-04-01 | 2013-02-19 | Innopad, Inc. | Polishing pad with controlled void formation |
| KR101592435B1 (ko) * | 2008-04-11 | 2016-02-05 | 에프엔에스테크 주식회사 | 공동 네트웍을 갖는 화학적 기계적 평탄화 패드 |
| TWI409137B (zh) * | 2008-06-19 | 2013-09-21 | Bestac Advanced Material Co Ltd | 研磨墊及其微型結構形成方法 |
| US9276747B2 (en) * | 2008-08-04 | 2016-03-01 | Technology Policy Associates, Llc | Remote profile security system |
| JP5543494B2 (ja) * | 2009-01-27 | 2014-07-09 | イノパッド，インコーポレイテッド | パターン化された構造ドメインを含む化学機械平坦化パッド |
| CN102317036B (zh) | 2009-02-12 | 2014-12-17 | 音诺帕德股份有限公司 | Cmp垫中的三维网状结构 |
| USD678745S1 (en) * | 2011-07-07 | 2013-03-26 | Phuong Van Nguyen | Spinning insert polishing pad |
| US20130205679A1 (en) * | 2012-02-14 | 2013-08-15 | Innopad, Inc. | Method of manufacturing a chemical mechanical planarization pad |
| US9308620B2 (en) | 2013-09-18 | 2016-04-12 | Texas Instruments Incorporated | Permeated grooving in CMP polishing pads |
| SG11201608134YA (en) | 2014-04-03 | 2016-10-28 | 3M Innovative Properties Co | Polishing pads and systems and methods of making and using the same |
| US9873180B2 (en) | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
| US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
| US9776361B2 (en) | 2014-10-17 | 2017-10-03 | Applied Materials, Inc. | Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles |
| US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
| SG11201703114QA (en) | 2014-10-17 | 2017-06-29 | Applied Materials Inc | Cmp pad construction with composite material properties using additive manufacturing processes |
| US9643294B2 (en) * | 2015-07-14 | 2017-05-09 | K&D Pads LLC | Buffing pad and methods of making and using the same |
| WO2017066077A1 (en) * | 2015-10-16 | 2017-04-20 | Applied Materials, Inc. | Method and apparatus for forming advanced polishing pads using an additive manufacturing process |
| KR20230169424A (ko) | 2015-10-30 | 2023-12-15 | 어플라이드 머티어리얼스, 인코포레이티드 | 원하는 제타 전위를 가진 연마 제품을 형성하는 장치 및 방법 |
| US10593574B2 (en) | 2015-11-06 | 2020-03-17 | Applied Materials, Inc. | Techniques for combining CMP process tracking data with 3D printed CMP consumables |
| US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
| JP6829037B2 (ja) * | 2016-09-30 | 2021-02-10 | 富士紡ホールディングス株式会社 | 研磨パッド及びその製造方法 |
| US11471999B2 (en) | 2017-07-26 | 2022-10-18 | Applied Materials, Inc. | Integrated abrasive polishing pads and manufacturing methods |
| WO2019032286A1 (en) | 2017-08-07 | 2019-02-14 | Applied Materials, Inc. | ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME |
| US12048980B2 (en) * | 2017-08-25 | 2024-07-30 | 3M Innovative Properties Company | Surface projection polishing pad |
| JP6980509B2 (ja) * | 2017-12-12 | 2021-12-15 | 富士紡ホールディングス株式会社 | 研磨パッド及び研磨加工物の製造方法 |
| KR20210042171A (ko) | 2018-09-04 | 2021-04-16 | 어플라이드 머티어리얼스, 인코포레이티드 | 진보한 폴리싱 패드들을 위한 제형들 |
| WO2020255744A1 (ja) | 2019-06-19 | 2020-12-24 | 株式会社クラレ | 研磨パッド、研磨パッドの製造方法及び研磨方法 |
| CN111515872B (zh) * | 2020-04-10 | 2022-01-11 | 广东大市智能装备有限公司 | 一种中空金刚石的粉末冶金一体成型方法 |
| CN112809550B (zh) * | 2020-12-31 | 2022-04-22 | 湖北鼎汇微电子材料有限公司 | 一种抛光垫 |
| US11878389B2 (en) | 2021-02-10 | 2024-01-23 | Applied Materials, Inc. | Structures formed using an additive manufacturing process for regenerating surface texture in situ |
| US11951590B2 (en) | 2021-06-14 | 2024-04-09 | Applied Materials, Inc. | Polishing pads with interconnected pores |
| USD1004393S1 (en) * | 2021-11-09 | 2023-11-14 | Ehwa Diamond Industrial Co., Ltd. | Grinding pad |
| CN117103107A (zh) * | 2022-05-16 | 2023-11-24 | 成都高真科技有限公司 | 还原料浆用抛光装置 |
| USD1000928S1 (en) * | 2022-06-03 | 2023-10-10 | Beng Youl Cho | Polishing pad |
| CN114918824B (zh) * | 2022-06-29 | 2024-08-20 | 万华化学集团电子材料有限公司 | 一种具有径向微沟槽的抛光垫 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2668016B2 (ja) * | 1988-09-21 | 1997-10-27 | スピードファム株式会社 | ポリッシングパッド及びその製造方法 |
| US5533923A (en) * | 1995-04-10 | 1996-07-09 | Applied Materials, Inc. | Chemical-mechanical polishing pad providing polishing unformity |
| US6337280B1 (en) * | 1998-05-11 | 2002-01-08 | Kabushiki Kaisha Toshiba | Polishing cloth and method of manufacturing semiconductor device using the same |
| US6656018B1 (en) * | 1999-04-13 | 2003-12-02 | Freudenberg Nonwovens Limited Partnership | Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles |
| US6953388B2 (en) * | 1999-12-22 | 2005-10-11 | Toray Industries, Inc. | Polishing pad, and method and apparatus for polishing |
| US6964604B2 (en) * | 2000-06-23 | 2005-11-15 | International Business Machines Corporation | Fiber embedded polishing pad |
| US6383066B1 (en) * | 2000-06-23 | 2002-05-07 | International Business Machines Corporation | Multilayered polishing pad, method for fabricating, and use thereof |
| US6712681B1 (en) | 2000-06-23 | 2004-03-30 | International Business Machines Corporation | Polishing pads with polymer filled fibrous web, and methods for fabricating and using same |
| WO2002100593A2 (en) * | 2000-11-20 | 2002-12-19 | Freudenberg Nonwovens, L.P. | Polishing pads with polymer filled fibrous web, and methods for fabricating and using same |
| JPWO2003058698A1 (ja) * | 2001-12-28 | 2005-05-19 | 旭化成エレクトロニクス株式会社 | 研磨パッド、その製法及び研磨方法 |
| US6852020B2 (en) * | 2003-01-22 | 2005-02-08 | Raytech Innovative Solutions, Inc. | Polishing pad for use in chemical—mechanical planarization of semiconductor wafers and method of making same |
| US20030207661A1 (en) * | 2002-05-01 | 2003-11-06 | Alexander Tregub | Annealing of CMP polishing pads |
| US20040014413A1 (en) * | 2002-06-03 | 2004-01-22 | Jsr Corporation | Polishing pad and multi-layer polishing pad |
| JP2004071985A (ja) * | 2002-08-08 | 2004-03-04 | Jsr Corp | 半導体ウェハ用研磨パッドの加工方法及び半導体ウェハ用研磨パッド |
| TWI228768B (en) * | 2002-08-08 | 2005-03-01 | Jsr Corp | Processing method of polishing pad for semiconductor wafer and polishing pad for semiconductor wafer |
| JP4039214B2 (ja) * | 2002-11-05 | 2008-01-30 | Ｊｓｒ株式会社 | 研磨パッド |
| TW592894B (en) * | 2002-11-19 | 2004-06-21 | Iv Technologies Co Ltd | Method of fabricating a polishing pad |
| US20040224622A1 (en) * | 2003-04-15 | 2004-11-11 | Jsr Corporation | Polishing pad and production method thereof |
| US20040224611A1 (en) | 2003-04-22 | 2004-11-11 | Jsr Corporation | Polishing pad and method of polishing a semiconductor wafer |
| US7086932B2 (en) * | 2004-05-11 | 2006-08-08 | Freudenberg Nonwovens | Polishing pad |
| JP2008000831A (ja) * | 2006-06-20 | 2008-01-10 | Saitama Univ | 研磨パッドの製造方法 |
| FR2933004B1 (fr) | 2008-06-27 | 2010-08-20 | Inst Francais Du Petrole | Solution absorbante contenant un inhibiteur de degradation derive du thiadiazole et methode pour limiter la degradation d'une solution absorbante |
-
2007
- 2007-07-18 TW TW096126187A patent/TWI409136B/zh active
- 2007-07-19 CN CN2007800324668A patent/CN101511533B/zh active Active
- 2007-07-19 KR KR1020097003292A patent/KR101409377B1/ko active Active
- 2007-07-19 JP JP2009521007A patent/JP5460316B2/ja active Active
- 2007-07-19 US US11/780,373 patent/US8137166B2/en active Active
- 2007-07-19 WO PCT/US2007/073921 patent/WO2008011535A2/en not_active Ceased
- 2007-07-19 MY MYPI20090236 patent/MY151014A/en unknown
- 2007-07-19 CA CA002658127A patent/CA2658127A1/en not_active Abandoned
- 2007-07-19 EP EP07813129A patent/EP2040878A4/en not_active Withdrawn
-
2012
- 2012-03-16 US US13/422,165 patent/US8900036B2/en active Active
-
2014
- 2014-11-04 US US14/532,232 patent/US9375822B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN101511533B (zh) | 2012-10-10 |
| US20120178348A1 (en) | 2012-07-12 |
| US8900036B2 (en) | 2014-12-02 |
| MY151014A (en) | 2014-03-31 |
| WO2008011535A2 (en) | 2008-01-24 |
| EP2040878A2 (en) | 2009-04-01 |
| TWI409136B (zh) | 2013-09-21 |
| US20150056894A1 (en) | 2015-02-26 |
| JP2009543709A (ja) | 2009-12-10 |
| US8137166B2 (en) | 2012-03-20 |
| WO2008011535A3 (en) | 2008-10-02 |
| EP2040878A4 (en) | 2012-09-12 |
| KR20090031629A (ko) | 2009-03-26 |
| US20080085661A1 (en) | 2008-04-10 |
| JP5460316B2 (ja) | 2014-04-02 |
| KR101409377B1 (ko) | 2014-06-20 |
| US9375822B2 (en) | 2016-06-28 |
| TW200810878A (en) | 2008-03-01 |
| CN101511533A (zh) | 2009-08-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9375822B2 (en) | Polishing pad having micro-grooves on the pad surface | |
| JP3920829B2 (ja) | 埋め込まれた液状マイクロエレメントを含有する研磨パッドおよびその製造方法 | |
| JP4959901B2 (ja) | 化学機械平坦化用溝付き研磨パッド | |
| US8684794B2 (en) | Chemical mechanical planarization pad with void network | |
| US6736709B1 (en) | Grooved polishing pads for chemical mechanical planarization | |
| KR100571448B1 (ko) | 유리한 미세 조직을 갖는 연마 패드 | |
| US8257142B2 (en) | Chemical mechanical polishing method | |
| CN101417411B (zh) | 改进的化学机械抛光垫及其制造和使用方法 | |
| US6612917B2 (en) | Abrasive article suitable for modifying a semiconductor wafer | |
| US8357027B2 (en) | Polishing pad and method of manufacture | |
| JPH08511210A (ja) | 研磨パッドおよびその使用方法 | |
| TWI565560B (zh) | 使化學機械平坦化墊形成溝槽之方法 | |
| EP2382651A1 (en) | Chemical-mechanical planarization pad including patterned structural domains | |
| TWI516340B (zh) | 用於化學機械平坦化之拋光墊及／或其他拋光方法 | |
| CN101990483B (zh) | 具有经控制的孔隙形态的抛光垫 | |
| KR20090018010A (ko) | 화학적 기계적 연마 방법 | |
| CN113977453B (zh) | 提高抛光平坦度的化学机械抛光垫及其应用 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EEER | Examination request | ||
| FZDE | Discontinued |
Effective date: 20140721 |