CA2452323A1 - Transparent support for organic light emitting device - Google Patents

Transparent support for organic light emitting device Download PDF

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Publication number
CA2452323A1
CA2452323A1 CA002452323A CA2452323A CA2452323A1 CA 2452323 A1 CA2452323 A1 CA 2452323A1 CA 002452323 A CA002452323 A CA 002452323A CA 2452323 A CA2452323 A CA 2452323A CA 2452323 A1 CA2452323 A1 CA 2452323A1
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CA
Canada
Prior art keywords
coating
coating layers
substrate
water vapor
oxygen
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA002452323A
Other languages
French (fr)
Other versions
CA2452323C (en
Inventor
Grzegorz Czeremuskin
Mohamed Latreche
Michael Robert Wertheimer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing Xiaomi Mobile Software Co Ltd
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CA002352567A external-priority patent/CA2352567A1/en
Application filed by Individual filed Critical Individual
Priority to CA2452323A priority Critical patent/CA2452323C/en
Publication of CA2452323A1 publication Critical patent/CA2452323A1/en
Application granted granted Critical
Publication of CA2452323C publication Critical patent/CA2452323C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10Substrates, e.g. flexible substrates
    • H10K77/111Flexible substrates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/873Encapsulations
    • H10K59/8731Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/549Organic PV cells

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  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Laminated Bodies (AREA)

Abstract

An improved transparent support substrate in an organic light emitting diode (OLED) device comprises an organic polymer support film and a composite laye r on the support film which is disposed intermediate the support film and the diodes of the OLED; the composite layer has first and second discrete coatin g layers bonded together in opposed facing relationship; the layers are of material impermeable to oxygen and water vapor but contain inadvertent discontinuities which result in discontinuity-controlled permeation of oxyge n and water vapor.

Claims (26)

1. A transparent support substrate for an organic light emitting device comprising:
i) an organic polymer support film, and ii) a composite layer on said support film, said composite layer being adapted to be disposed between said support film and light emitting organic diodes of an organic light emitting device, said composite layer comprising first and second discrete coating layers bonded together in opposed facing relationship, each of said first and second coating layers being impermeable to oxygen and water vapor when formed as a continuous coating, each of said first and second coating layers having inadvertent discontinuities therein such that said coating layers exhibit discontinuity-controlled permeation of oxygen and water vapor therethrough, said first and second coating layers being bonded together with an adhesive layer such that said coating layers are spaced apart by a distance less than the dimensions of the inadvertent discontinuities in said coating layers, said inadvertent discontinuities being selected from:
a) submicrometer-size pinholes characteristic of coating layer deposition and micro-roughness of said polymer support film;
b) submicrometer to multimicrometer-size defects due to dust and microparticles; and c) cracks and scratches created in production, handling and converting of said substrate.
2. A substrate according to 1 wherein each of said discrete coating layers is a single coating.
3. A substrate according to claim 1. where at least one of said first and second discrete coating layers is composed of a plurality of discrete single coatings of different materials.
4. A substrate according to claim 1, 2 or 3, having a transparency greater than 65%, by ASTMD171746-97.
5. A, Substrate according to claim 4. wherein said transparency is greater than 85%.
6. A substrate according to claim 1, 2, 3, 4 or 5, wherein said transparent substrate comprises first and second organic polymer support films in opposed facing relationship with said composite layer sandwiched therebetween.
7. A substrate according to claim 1, 2, 3, 4, 5 or 6, wherein said composite layer has an oxygen transmission rate by ASTM F1927 and D3985 lower than 0.1 cm3/(m2day-atm).
8. A substrate according to claim 7, wherein said oxygen transmission rate is lower than 0.005 cm3/(m2day.atm).
9. A substrate according to any one of claims 1 to 8, wherein said composite layer has a water vapor transmission rate lower than 0.01 g/(m2day) by ASTM F1249.
10. A substrate according to any one of claims 1 to 9, wherein said transparent substrate has a thickness of 5 µm to 10 mm and said first and second coating layers each have a thickness of 100µm.
11. A substrate according to any one of claim 1 to 10, wherein said adhesive layer displays low permeability to oxygen and water vapor.
12. A substrate according to claim 11, wherein said inadvertent discontinuities in said first and second coatings occur randomly such that on a statistical probability basis discontinuities in said first coating layer are remote from, and in non-opposed relationship, with discoatinaities in said second coating layer.
13.In an organic light emitting device in which light emitting diodes are encased in a barrier envelope comprising a transparent substrate supporting said diodes and a barrier covering, said substrate and covering being impermeable to oxygen and water vapor, the improvement wherein at least one of said substrate and said covering comprises:
a transparent support substrate as defined its any one of claims 1 to 12.
14. A device according to claim 13 wherein both said substrate and said covering are formed from said film and said composite layer.
15. A device according to claim 13 wherein said substrate is formed of said film and said composite layer.
16. A device according to claim 13 wherein said covering is formed of said film and said composite layer.
17. In a method of manufacturing an organic light emitting device in which light emitting organic diodes are formed on a transparent substrate impermeable to oxygen and water vapor, the wherein the transparent substrate comprises:
i) an organic polymer support film, and ii) a composite layer on said support film and disposed intermediate said support film and said light emitting diodes, said composite layer comprising first and second discrete coating layers bonded together in opposed facing relationship, each of said first and second coating layers being impermeable to oxygen and water vapor when formed as a continuous coating, each of said first and second coating layers having inadvenent discontinuites therein such that said coating layers exhibit discontinuity-controlled permeation of oxygen and water vapor therethrough, said first and second coating layers being handed together with an adhesive layer such that said coating layers are spaced apart by a distance less than the dimensions of the inadvertent discontinuities in said coating layers, said inadvertent discontinuities being selected from:
a) submicrometer-size pinholes characteristic of coating layer deposition and micro-roughness of said polymer support film;
b) submicrometer to multimicrometer-size defects due to dust and microparticles; and c) cracks and scratches created in production, handling and converting of said substrate.
18. A method according to claim 17 wherein each of said discrete coating layers is a single coating.
19. A method according to claim 17 where at least one of said first and second discrete coating layers is composed of a plurality of discrete single coatings of different materials.
20. A method of producing a transparent support substrate for an organic light emitting device comprising:
a) coating a first transparent organic polymer film surface with a first coating layer;
b) coating a second transparent organic polymer film surface with a second coating layer;
c) bonding said coating layers together, with an adhesive layer, in opposed facing relationship to form a composite layer between said first and second polymer film surfaces, each of said first and second coating layers being impermeable to oxygen and water vapor when formed as a continuous coating; each of said first and second coating layers having inadvertent discontinuities therein such that said composite layer exhibits discontinuity-controlled permeation of oxygen and water vapor therethrough, said bonding with said adhesive layer being such that said first and second coating layers are spaced apart by a distance less than the dimensions of the inadvertent discontinuities in said coating layers, said inadvertent discontinuities being selected from:
i) submicrometer-size pinholes characteristic of coating layer deposition and micro-roughness of said polymer support film;
ii) submicrometer to multimicrometer-size defects due to dust and microparticles; and iii) cracks and scratches created in production, handling and converting of said substrate.
21. A method according to claim 20 wherein each of said discrete coating layers is a single coating.
22. A method according to claim 20 where at least one of said first and second discrete coating layers is composed of a plurality of discrete single coatings of different materials.
23. A method according to claim 21, wherein said transparent support substrate has an oxygen transmission rate by ASTM F1927 and D3985 lower than 0.005 cm3/(m2day-atm); and wherein said composite layer has a water vapor transmission rate lower than 0.01g/(m2day) by ASTM F1249.
24. A method according to claim 20 or 23, wherein said transparent substrate has a thickness of 5 µm to 10 mm and said first and second coating layers each have a thickness of 100 nm to 2µm; and wherein said adhesive layer is impermeable to oxygen and water vapor.
25. A method according to claim 20, wherein said first polymer film surface is defined in a first polymer film, and said first polymer film comprises first and second support films bonded in opposed facing relationship with a release adhesive layer, and step a) comprises coating a surface of said second support film with said first coating layer, and including a final step of:
d) separating said first support film from said second support film.
26. A method according to claim 20 wherein said firts polymer film surface functions as a temporary protective film on the side of support substrate on which diodes are to be placed and including a step of (d) separating said temporary protective film from said firts coating layer.
CA2452323A 2001-07-06 2002-05-14 Transparent support for organic light emitting device Expired - Fee Related CA2452323C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CA2452323A CA2452323C (en) 2001-07-06 2002-05-14 Transparent support for organic light emitting device

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CA2,352,567 2001-07-06
CA002352567A CA2352567A1 (en) 2001-07-06 2001-07-06 Translucent material displaying ultra-low transport of gases and vapors, and method for its production
PCT/CA2002/000707 WO2003005461A1 (en) 2001-07-06 2002-05-14 Transparent support for organic light emitting device
CA2452323A CA2452323C (en) 2001-07-06 2002-05-14 Transparent support for organic light emitting device

Publications (2)

Publication Number Publication Date
CA2452323A1 true CA2452323A1 (en) 2003-01-16
CA2452323C CA2452323C (en) 2011-07-26

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CA2452323A Expired - Fee Related CA2452323C (en) 2001-07-06 2002-05-14 Transparent support for organic light emitting device

Country Status (1)

Country Link
CA (1) CA2452323C (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113126441A (en) * 2021-03-29 2021-07-16 上海华力集成电路制造有限公司 Optimization method for improving photoetching defects caused by water adsorption of photoetching front-layer film

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113126441A (en) * 2021-03-29 2021-07-16 上海华力集成电路制造有限公司 Optimization method for improving photoetching defects caused by water adsorption of photoetching front-layer film
CN113126441B (en) * 2021-03-29 2024-06-07 上海华力集成电路制造有限公司 Optimization method for improving photoetching defect caused by water adsorption of photoetching front layer film

Also Published As

Publication number Publication date
CA2452323C (en) 2011-07-26

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