CA2287772A1 - Housing for high-density subscriber line modules - Google Patents
Housing for high-density subscriber line modules Download PDFInfo
- Publication number
- CA2287772A1 CA2287772A1 CA 2287772 CA2287772A CA2287772A1 CA 2287772 A1 CA2287772 A1 CA 2287772A1 CA 2287772 CA2287772 CA 2287772 CA 2287772 A CA2287772 A CA 2287772A CA 2287772 A1 CA2287772 A1 CA 2287772A1
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- CA
- Canada
- Prior art keywords
- repeater
- subscriber line
- density
- repeater case
- modules
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Abstract
A repeater case for high-density subscriber lines includes a repeater base, a repeater case housing formed of a fiberglass composite forming a sealed enclosure with the repeater base, and a module frame. The module frame, having a plurality of through-extending module slots formed by a plurality of interior walls, is integrally molded into the repeater case housing. Each through-extending slot is configured to receive a grooveless high-density subscriber line module. The interior walls of the module frame are coated with a thermally conductive electro-magnetic interference coating, allowing the interior walls of the module frame to make thermally conductive contact with the respective high-density subscriber line modules when the modules are installed into the frame. The cooling of the high-density subscription line modules is enhanced in this manner.
Description
HOUSING FOR HIGH-DENSITY
SUBSCRIBER LINE MODULES
S
Background of the Invention The present invention relates to improvements in high-density subscriber line repeater cases. Repeater cases have been known for years, and the technology was well developed for T1 communication lines. Extensive specifications for 818-/819-type repeater cases have been promulgated by AT&T describing the type of cases involved.
These cases are designed to hold sensitive telecommunications equipment in relatively unfavorable environments. In particular, they are designed for installation in manholes or on telephone poles exposed to the weather. Accordingly, in order to protect the contents, the housings of the cases provide environmental protection and seal the contents from attack by environmental elements such as water and the like.
Recently, the repeater cases that were originally designed to hold T1 line cards have been used to hold high-density subscriber line modules. The high-density subscriber line modules are somewhat larger than Tl modules, resulting in only every other one of the slots provided in the Tl case being used for the high-density subscriber line ("HDSL") modules.
The HDSL modules work well in the T1 repeater cases, except that it has been found that the modules prematurely fail due to excessive heat buildup.
Premature failure adds considerably to the cost in having to replace the modules: both from the replacement cost of the modules themselves and the labor required to gain access into the casing. Furthermore, the reliability of the HDSL modules reduces dramatically with increases in heat buildup. Accordingly, there is a need in the art for a solution to the heat buildup problem in HDSL cases.
The inventor has previously addressed this problem in an invention described in U.S. Patent application Serial No. 08/909,242 filed August 1 l, 1997, the entire disclosure which is incorporated herein by reference. However, there have remained problems of installation of certain configurations of HDSL modules.
Summary of the Invention The present invention fulfills this need in the art by providing a repeater case for HDSL subscriber lines including a repeater base, a repeater case housing Forming a sealed enclosure with the repeater base, and a module frame in tile repeater case housing. The module frame has a plurality of through-extending module slots formed by a plurality of interior walls, and each module slot configured to receive a grooveless high-density subscriber line module. The interior walls are configured to make thermally conductive contact with the respective HDSL modules when the modules are installed into the frame. The HDSL modules are cooled through the thermal conductivity with the interior walls of the module frame, as well as by the convection of cooling air.
In the preferred embodiment, the module frame is comprised of a fiberglass composite integrally molded into the repeater case housing, which is also made of a fiberglass composite. The module frame may be separable from the repeater case housing and be preferably formed of a material having the thermal conduction properties of a metal.
An electromagnetic interference (EMI) coating may be applied to the interior walls of the module frame enhancing the thermal conductivity of the contact between the HDSL module and the module frame. Alternatively, another thermally conductive contact could be enhanced through the application of a thermally conductive coating 35393159.doc 2 applied to the interior walls of the module frame. Furthermore, the HDSL
module is typically without a groove on its sides.
The invention also provides a method for dissipating thermal energy from the HDSL modules, including opening a repeater case, installing a high-density subscription 5 line module without side grooves into a slot defined by certain of interior walls of a module frame that is integrally molded into the repeater case such that the high-density subscription line module makes thermally conductive contact with certain of interior walls of the module frame, and closing the repeater case.
10 Brief Description of the Drawings The invention will be better understood after a reading of the Detailed Description of the Preferred Embodiment and a review of the drawings in which:
FIGURE 1 is a horizontal sectional view of a repeater case housing according to a preferred embodiment of the invention;
15 FIGURE 2 is a side perspective view of a high-density subscriber line repeater case according to a preferred embodiment of the invention;
FIGURE 3 is a sectional view of the case in Figure 2;
FIGURE 4 is a sectional view of the case of Figure 2, taken along lines III-III and looking in the direction of the arrows; and 20 FIGURE 5 is a sectional view like the view of Figure 1 for another embodiment of the invention.
Detailed Description of the Preferred Embodiment Figure 1 shows a repeater case which has been modified to accommodate certain 25 designs of HDSL modules. To do so, the T1 repeater housings have been adapted to allow the insertion of HDSL modules that have grooves.
35393159.doc In my prior application, Serial No. 08/909,242 referred to above, I disclosed a modification to printed circuit boards that support connectors to receive HDSL
modules.
The modules useable with that invention fit into a conventionally-modified repeater case, configured to receive the modules that have grooves in their sides. Examples of these 5 modules are the HDU 439 Hi Gain Doubler manufactured by Pairgain and the HDSL Repeater made by ADC.
However, modules identified as HDSL Range Extender, model No. 1244044L1 made by Adtran, are configured differently. They do not have grooves in their sides, and do not fit into the repeater case as configured for the Pairgain and ADC
modules.
10 Referring to Figure 2, a repeater case 10 adapted from a T1 repeater case of AT&T styles 818-819 is shown. Conventional details of those cases are known to those of ordinary skill in the art and will not, for brevity, be expounded upon. The repeater housing 10 includes a molded repeater base 12 and a repeater case housing 14 having cover portions 16 and 18. The base 12 and housing 14 are made of a fiberglass 15 composite. The cover portions 16 and 18 are held to the housing 14 with torque bolts 20. The volume inside the cover portions 16 and 18 is generally empty to serve as a heat dissipating plenum. Between the base 12 and housing 14, and housing 14 and covers 16 and 18 are gaskets 30 and 32, not visible in Figure 2, but seen in Figure 3.
The base 12, repeater case housing 14 and its covers 16 and 18 together forth a sealed 20 enclosure that can contain a pressurized atmosphere. The pressurized atmosphere can be admitted through conventional valve arrangements in the base 12, such as pressure relief valve 26 and air bypass valve 24. The base 12 is provided with mounting brackets 28 to permit mounting of the casing 10 in a desired location, typically in a manhole or on a pole, but any suitable mounting may suffice. A stub cable 22 provides a cable inlet 25 into the base 12 for telecommunication lines.
35393159.doc 4 The repeater case need not be configured like .AT&T repeater cases, but can be provided in a number of shapes and sizes suitable to protect the pertinent number of HDSL cards to be contained. For example, the case can be configured to hold 12 cards as seen in Figure 1, or reduced in size to hold 6 cards, with a configuration as shown in 5 Figure 5. Other variations are also encompassed by the invention.
Referring to Figure 3, the stub cable 22 can be seen as dividing into a plurality of individual conductors 23. The conductors 23 pass through an opening in a Plexiglas acrylic plastic barrier 34 and are hard wired to the bottoms of PC boards 36.
At the top of the PC boards 36 are mounted electrical connectors 38 suitable for receiving HDSL
10 modules 40. The PC boards 36 are mounted to the inside of housing 14 and thus support the connectors 38 and modules 40. The HDSL modules 40 are vertically inserted into the slots 50 defined by the walls 60 of the module frame 35 in the point of view of Figure 3. Other orientations may also be used. As can be seen, each of the modules 40 contacts one of the walls 52, but not others. The heat from the modules can 15 thus be dissipated by conduction to the wall 52 and convection through the air passing over the modules and the walls.
Referring to Figure 4, the locations of the HDSL modules 40 in slots 50 within the housing can be seen. The slots 50 in the module frame 35 have been widened and reconfigured to provide for the easy insertion of a grooveless HDSL module 40 into the 20 slots 50, while maintaining thermally conductive contact between the grooveless HDSL
modules 40 and the interior walls 60 of the module frame 35. Preferably, the module frame 35 is integrally molded into the repeater case 10. However, it can also be provided as a separate item, perhaps of a metal like aluminum. As can be seen, the walls 60 are made thicker than the other walls 62 inside the case, to increase their heat 25 capacity and thermal conductivity.
35393159.doc 5 When inserted into a conventional T1 casing, the HDSL modules 40 experience premature failure due to overheating of the module. The inventor has found that cooling to substantially decrease the temperature of the HDSL module 40, thereby reducing the premature failure rate, may be obtained through the enhancement of the 5 thermally conductive contact between the grooveless HDSL modules 40 and the interior walls 60 of the module frame 35. This thermally conductive contact is enhanced by an EMI coating on the surface of the interior walls 60 of the module frame 35, and onto the module frame itself 35. Alternatively, any suitable thermally conductive coating may be used to increase the conductivity of the thermal contact between the grooveless 10 HDSL module 40 and the interior walls 60 of the module frame 35. The module frame 60 may be made of any suitable material, but preferably has the thermal conductive properties of a metal. In addition, the separation of the PC board into smaller pieces and the provision of holes in the barrier sheet 34 adds to the cooling effect, as noted above.
The modified case in the present invention is specifically configured to receive 15 and maintain thermal and electrical connection with HDSL modules, providing commercial savings in both initial fabrication and on-site repairs.
Those of ordinary skill in the art will appreciate that the invention can be carried out in other forms differing from as specifically outlined herein yet still fall within the scope of the invention, and the claims are to be read as covering such embodiments.
35393159.doc 6
SUBSCRIBER LINE MODULES
S
Background of the Invention The present invention relates to improvements in high-density subscriber line repeater cases. Repeater cases have been known for years, and the technology was well developed for T1 communication lines. Extensive specifications for 818-/819-type repeater cases have been promulgated by AT&T describing the type of cases involved.
These cases are designed to hold sensitive telecommunications equipment in relatively unfavorable environments. In particular, they are designed for installation in manholes or on telephone poles exposed to the weather. Accordingly, in order to protect the contents, the housings of the cases provide environmental protection and seal the contents from attack by environmental elements such as water and the like.
Recently, the repeater cases that were originally designed to hold T1 line cards have been used to hold high-density subscriber line modules. The high-density subscriber line modules are somewhat larger than Tl modules, resulting in only every other one of the slots provided in the Tl case being used for the high-density subscriber line ("HDSL") modules.
The HDSL modules work well in the T1 repeater cases, except that it has been found that the modules prematurely fail due to excessive heat buildup.
Premature failure adds considerably to the cost in having to replace the modules: both from the replacement cost of the modules themselves and the labor required to gain access into the casing. Furthermore, the reliability of the HDSL modules reduces dramatically with increases in heat buildup. Accordingly, there is a need in the art for a solution to the heat buildup problem in HDSL cases.
The inventor has previously addressed this problem in an invention described in U.S. Patent application Serial No. 08/909,242 filed August 1 l, 1997, the entire disclosure which is incorporated herein by reference. However, there have remained problems of installation of certain configurations of HDSL modules.
Summary of the Invention The present invention fulfills this need in the art by providing a repeater case for HDSL subscriber lines including a repeater base, a repeater case housing Forming a sealed enclosure with the repeater base, and a module frame in tile repeater case housing. The module frame has a plurality of through-extending module slots formed by a plurality of interior walls, and each module slot configured to receive a grooveless high-density subscriber line module. The interior walls are configured to make thermally conductive contact with the respective HDSL modules when the modules are installed into the frame. The HDSL modules are cooled through the thermal conductivity with the interior walls of the module frame, as well as by the convection of cooling air.
In the preferred embodiment, the module frame is comprised of a fiberglass composite integrally molded into the repeater case housing, which is also made of a fiberglass composite. The module frame may be separable from the repeater case housing and be preferably formed of a material having the thermal conduction properties of a metal.
An electromagnetic interference (EMI) coating may be applied to the interior walls of the module frame enhancing the thermal conductivity of the contact between the HDSL module and the module frame. Alternatively, another thermally conductive contact could be enhanced through the application of a thermally conductive coating 35393159.doc 2 applied to the interior walls of the module frame. Furthermore, the HDSL
module is typically without a groove on its sides.
The invention also provides a method for dissipating thermal energy from the HDSL modules, including opening a repeater case, installing a high-density subscription 5 line module without side grooves into a slot defined by certain of interior walls of a module frame that is integrally molded into the repeater case such that the high-density subscription line module makes thermally conductive contact with certain of interior walls of the module frame, and closing the repeater case.
10 Brief Description of the Drawings The invention will be better understood after a reading of the Detailed Description of the Preferred Embodiment and a review of the drawings in which:
FIGURE 1 is a horizontal sectional view of a repeater case housing according to a preferred embodiment of the invention;
15 FIGURE 2 is a side perspective view of a high-density subscriber line repeater case according to a preferred embodiment of the invention;
FIGURE 3 is a sectional view of the case in Figure 2;
FIGURE 4 is a sectional view of the case of Figure 2, taken along lines III-III and looking in the direction of the arrows; and 20 FIGURE 5 is a sectional view like the view of Figure 1 for another embodiment of the invention.
Detailed Description of the Preferred Embodiment Figure 1 shows a repeater case which has been modified to accommodate certain 25 designs of HDSL modules. To do so, the T1 repeater housings have been adapted to allow the insertion of HDSL modules that have grooves.
35393159.doc In my prior application, Serial No. 08/909,242 referred to above, I disclosed a modification to printed circuit boards that support connectors to receive HDSL
modules.
The modules useable with that invention fit into a conventionally-modified repeater case, configured to receive the modules that have grooves in their sides. Examples of these 5 modules are the HDU 439 Hi Gain Doubler manufactured by Pairgain and the HDSL Repeater made by ADC.
However, modules identified as HDSL Range Extender, model No. 1244044L1 made by Adtran, are configured differently. They do not have grooves in their sides, and do not fit into the repeater case as configured for the Pairgain and ADC
modules.
10 Referring to Figure 2, a repeater case 10 adapted from a T1 repeater case of AT&T styles 818-819 is shown. Conventional details of those cases are known to those of ordinary skill in the art and will not, for brevity, be expounded upon. The repeater housing 10 includes a molded repeater base 12 and a repeater case housing 14 having cover portions 16 and 18. The base 12 and housing 14 are made of a fiberglass 15 composite. The cover portions 16 and 18 are held to the housing 14 with torque bolts 20. The volume inside the cover portions 16 and 18 is generally empty to serve as a heat dissipating plenum. Between the base 12 and housing 14, and housing 14 and covers 16 and 18 are gaskets 30 and 32, not visible in Figure 2, but seen in Figure 3.
The base 12, repeater case housing 14 and its covers 16 and 18 together forth a sealed 20 enclosure that can contain a pressurized atmosphere. The pressurized atmosphere can be admitted through conventional valve arrangements in the base 12, such as pressure relief valve 26 and air bypass valve 24. The base 12 is provided with mounting brackets 28 to permit mounting of the casing 10 in a desired location, typically in a manhole or on a pole, but any suitable mounting may suffice. A stub cable 22 provides a cable inlet 25 into the base 12 for telecommunication lines.
35393159.doc 4 The repeater case need not be configured like .AT&T repeater cases, but can be provided in a number of shapes and sizes suitable to protect the pertinent number of HDSL cards to be contained. For example, the case can be configured to hold 12 cards as seen in Figure 1, or reduced in size to hold 6 cards, with a configuration as shown in 5 Figure 5. Other variations are also encompassed by the invention.
Referring to Figure 3, the stub cable 22 can be seen as dividing into a plurality of individual conductors 23. The conductors 23 pass through an opening in a Plexiglas acrylic plastic barrier 34 and are hard wired to the bottoms of PC boards 36.
At the top of the PC boards 36 are mounted electrical connectors 38 suitable for receiving HDSL
10 modules 40. The PC boards 36 are mounted to the inside of housing 14 and thus support the connectors 38 and modules 40. The HDSL modules 40 are vertically inserted into the slots 50 defined by the walls 60 of the module frame 35 in the point of view of Figure 3. Other orientations may also be used. As can be seen, each of the modules 40 contacts one of the walls 52, but not others. The heat from the modules can 15 thus be dissipated by conduction to the wall 52 and convection through the air passing over the modules and the walls.
Referring to Figure 4, the locations of the HDSL modules 40 in slots 50 within the housing can be seen. The slots 50 in the module frame 35 have been widened and reconfigured to provide for the easy insertion of a grooveless HDSL module 40 into the 20 slots 50, while maintaining thermally conductive contact between the grooveless HDSL
modules 40 and the interior walls 60 of the module frame 35. Preferably, the module frame 35 is integrally molded into the repeater case 10. However, it can also be provided as a separate item, perhaps of a metal like aluminum. As can be seen, the walls 60 are made thicker than the other walls 62 inside the case, to increase their heat 25 capacity and thermal conductivity.
35393159.doc 5 When inserted into a conventional T1 casing, the HDSL modules 40 experience premature failure due to overheating of the module. The inventor has found that cooling to substantially decrease the temperature of the HDSL module 40, thereby reducing the premature failure rate, may be obtained through the enhancement of the 5 thermally conductive contact between the grooveless HDSL modules 40 and the interior walls 60 of the module frame 35. This thermally conductive contact is enhanced by an EMI coating on the surface of the interior walls 60 of the module frame 35, and onto the module frame itself 35. Alternatively, any suitable thermally conductive coating may be used to increase the conductivity of the thermal contact between the grooveless 10 HDSL module 40 and the interior walls 60 of the module frame 35. The module frame 60 may be made of any suitable material, but preferably has the thermal conductive properties of a metal. In addition, the separation of the PC board into smaller pieces and the provision of holes in the barrier sheet 34 adds to the cooling effect, as noted above.
The modified case in the present invention is specifically configured to receive 15 and maintain thermal and electrical connection with HDSL modules, providing commercial savings in both initial fabrication and on-site repairs.
Those of ordinary skill in the art will appreciate that the invention can be carried out in other forms differing from as specifically outlined herein yet still fall within the scope of the invention, and the claims are to be read as covering such embodiments.
35393159.doc 6
Claims (19)
1. A repeater case for high-density subscriber lines comprising:
a repeater case housing forming a sealed enclosure, and a module frame in said repeater case housing, said module frame having a plurality of interior walls defining a plurality of through-extending module slots, each said slot configured to receive a high-density subscriber line module that does not have grooves on its sides, ones of said interior walls configured to make thermally conductive contact with the respective ones of high-density subscriber line modules when the modules are installed into said frame, wherein the high-density subscriber line modules are cooled through the thermal conductivity with said thermally conductive contact with certain of said interior walls of said module frame.
a repeater case housing forming a sealed enclosure, and a module frame in said repeater case housing, said module frame having a plurality of interior walls defining a plurality of through-extending module slots, each said slot configured to receive a high-density subscriber line module that does not have grooves on its sides, ones of said interior walls configured to make thermally conductive contact with the respective ones of high-density subscriber line modules when the modules are installed into said frame, wherein the high-density subscriber line modules are cooled through the thermal conductivity with said thermally conductive contact with certain of said interior walls of said module frame.
2. A repeater case as claimed in claim 1 wherein said repeater case housing has the thermal conductivity properties of a metal.
3. A repeater case as claimed in claim 2 wherein said repeater case housing is fiberglass.
4. A repeater case as claimed in claim 1 wherein said repeater case housing has interior surfaces and an electromagnetic interference (EMI) coating applied to selected interior surfaces.
5. A repeater case as claimed in claim 1 wherein said module frame is integrally molded into said repeater case.
6. A repeater case as claimed in claim 5 wherein said module frame has the thermal conductivity properties of a metal.
7. A repeater case as claimed in claim 6 wherein said module frame is fiberglass.
8. A repeater case as claimed in claim 1 wherein said thermally conductive contact is enhanced through the application of a thermally conductive coating applied to the interior walls of said module frame.
9. A repeater case as claimed in claim 8 wherein said thermally conductive coating is an electromagnetic interference (EMI) coating.
10. A repeater case as claimed in claim 1 wherein the walls are configured to make contact with the modules are thicker than others of the interior walls.
11. A repeater case as claimed in claim 1 wherein the walls are configured to define six slots.
12. A repeater case as claimed in claim 1 wherein the walls are configured to define twelve slots
13. A repeater case for high-density subscriber lines comprising:
a repeater base, a repeater case housing, said repeater case housing forming a sealed enclosure with said repeater base and being made of a fiberglass composite having an electromagnetic coating applied to its internal surfaces, and a module frame in said repeater case, said module frame being integrally molded into the repeater case and having a plurality of through-extending module slots formed by a plurality of interior walls having an electromagnetic coating applied to said walls and each said slot configured to receive a grooveless high-density subscriber line module, ones of said interior walls configured to make thermally conductive contact with the respective ones of high-density subscriber line modules when the modules are installed into said frame, wherein the high-density modules are cooled at least in part through the thermal conductivity with said thermally conductive contact with said walls.
a repeater base, a repeater case housing, said repeater case housing forming a sealed enclosure with said repeater base and being made of a fiberglass composite having an electromagnetic coating applied to its internal surfaces, and a module frame in said repeater case, said module frame being integrally molded into the repeater case and having a plurality of through-extending module slots formed by a plurality of interior walls having an electromagnetic coating applied to said walls and each said slot configured to receive a grooveless high-density subscriber line module, ones of said interior walls configured to make thermally conductive contact with the respective ones of high-density subscriber line modules when the modules are installed into said frame, wherein the high-density modules are cooled at least in part through the thermal conductivity with said thermally conductive contact with said walls.
14. A repeater case for high-density subscriber lines comprising a repeater base, a repeater case housing, said repeater case housing forming a sealed enclosure with said repeater base and being made of a fiberglass composite having an electromagnetic coating applied to its internal surfaces, a module frame, said module frame being made of a fiberglass composite and integrally molded into the repeater case, and having a plurality of through-extending module slots formed by a plurality of interior walls having an electromagnetic coating , each said slot configured to receive a high-density subscriber line module that does not have grooves on its sides, and a plurality of high-density subscriber line modules that do not have grooves on their sides, each said grooveless high-density subscriber line module making thermally conductive contact with one of said interior walls, wherein the grooveless high-density subscriber line modules are cooled at least in part by thermally conductive contact with said walls.
15. A repeater case for high-density subscriber lines comprising:
a repeater case housing forming a sealed enclosure for an atmosphere, said repeater case housing including:
an inlet valve to allow pressurization of the atmosphere within the repeater case, a removable cover, a sealing gasket to sealingly receive said cover, a module frame having a plurality of interior walls defining a plurality of through-extending module slots, each said slot configured to receive a high-density subscriber line module that does not have grooves on its sides with ones of said interior walls configured to make thermally conductive contact with the respective ones of high-density subscriber line modules when the modules are installed into said frame, a plurality of printed circuit boards mounted to certain of said slots with atmosphere flow gaps between adjacent printed circuit boards, said printed circuit boards being adapted to receive respective high-density subscriber line modules, a cable inlet, each of said plurality of printed circuit boards being provided with a connection to said cable inlet and a connector to electrically receive one of said high-density subscriber line modules, an electrically insulating barrier between said cable inlet and said printed circuit boards, said barrier having a plurality of openings to permit cooling atmosphere to pass from said repeater base toward said modules whereby cooling atmosphere may pass over the high-density subscriber line modules through said barrier and said gaps between said printed circuit boards to cool said high density subscriber line modules and the high-density subscriber line modules are cooled through the thermal conductivity with said thermally conductive contact with certain of said interior walls of said module frame.
a repeater case housing forming a sealed enclosure for an atmosphere, said repeater case housing including:
an inlet valve to allow pressurization of the atmosphere within the repeater case, a removable cover, a sealing gasket to sealingly receive said cover, a module frame having a plurality of interior walls defining a plurality of through-extending module slots, each said slot configured to receive a high-density subscriber line module that does not have grooves on its sides with ones of said interior walls configured to make thermally conductive contact with the respective ones of high-density subscriber line modules when the modules are installed into said frame, a plurality of printed circuit boards mounted to certain of said slots with atmosphere flow gaps between adjacent printed circuit boards, said printed circuit boards being adapted to receive respective high-density subscriber line modules, a cable inlet, each of said plurality of printed circuit boards being provided with a connection to said cable inlet and a connector to electrically receive one of said high-density subscriber line modules, an electrically insulating barrier between said cable inlet and said printed circuit boards, said barrier having a plurality of openings to permit cooling atmosphere to pass from said repeater base toward said modules whereby cooling atmosphere may pass over the high-density subscriber line modules through said barrier and said gaps between said printed circuit boards to cool said high density subscriber line modules and the high-density subscriber line modules are cooled through the thermal conductivity with said thermally conductive contact with certain of said interior walls of said module frame.
16. A method of dissipating thermal energy from the high-density subscriber line modules, comprising:
opening a repeater case, installing a high-density subscription line module into a slot module defined by certain of interior walls of a module frame in the repeater case such that the high-density subscription line module makes thermally conductive contact with certain of interior walls of the module frame, closing the repeater case, operating the high density subscriber lines and thereby generating heat at the high density subscriber line modules, and conducting heat from the high density subscriber line modules to the walls in contact therewith.
opening a repeater case, installing a high-density subscription line module into a slot module defined by certain of interior walls of a module frame in the repeater case such that the high-density subscription line module makes thermally conductive contact with certain of interior walls of the module frame, closing the repeater case, operating the high density subscriber lines and thereby generating heat at the high density subscriber line modules, and conducting heat from the high density subscriber line modules to the walls in contact therewith.
17. The method of claim 15 wherein the installing step includes installing six high density subscriber lines.
18. The method of claim 15 wherein the installing step includes installing twelve high density subscriber lines.
19. A repeater case for high-density subscriber lines comprising:
a repeater case housing defining an enclosure for high density subscriber line modules and having six high-density subscriber line module slots and six connectors mounted in said slots with atmosphere flow gaps between adjacent connectors, said connectors being adapted to receive respective high-density subscriber line modules, so that cooling atmosphere may pass over the high-density subscriber line modules through the gaps.
a repeater case housing defining an enclosure for high density subscriber line modules and having six high-density subscriber line module slots and six connectors mounted in said slots with atmosphere flow gaps between adjacent connectors, said connectors being adapted to receive respective high-density subscriber line modules, so that cooling atmosphere may pass over the high-density subscriber line modules through the gaps.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US18657298A | 1998-11-05 | 1998-11-05 | |
| US09/186,572 | 1998-11-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2287772A1 true CA2287772A1 (en) | 2000-05-05 |
Family
ID=31714175
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA 2287772 Abandoned CA2287772A1 (en) | 1998-11-05 | 1999-10-29 | Housing for high-density subscriber line modules |
Country Status (1)
| Country | Link |
|---|---|
| CA (1) | CA2287772A1 (en) |
-
1999
- 1999-10-29 CA CA 2287772 patent/CA2287772A1/en not_active Abandoned
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| Date | Code | Title | Description |
|---|---|---|---|
| FZDE | Dead |