CA2207337A1 - A cmos integrated radon detector - Google Patents

A cmos integrated radon detector

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Publication number
CA2207337A1
CA2207337A1 CA 2207337 CA2207337A CA2207337A1 CA 2207337 A1 CA2207337 A1 CA 2207337A1 CA 2207337 CA2207337 CA 2207337 CA 2207337 A CA2207337 A CA 2207337A CA 2207337 A1 CA2207337 A1 CA 2207337A1
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Canada
Prior art keywords
electrically connected
channel mosfet
radon
pulse signal
channel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA 2207337
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French (fr)
Inventor
N. Garry Tarr
Abdullah Ahmed
David J. Walkey
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Individual
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Individual
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Priority to CA 2207337 priority Critical patent/CA2207337A1/en
Publication of CA2207337A1 publication Critical patent/CA2207337A1/en
Abandoned legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14643Photodiode arrays; MOS imagers
    • H01L27/14658X-ray, gamma-ray or corpuscular radiation imagers
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01TMEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T1/00Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
    • G01T1/16Measuring radiation intensity
    • G01T1/17Circuit arrangements not adapted to a particular type of detector
    • G01T1/178Circuit arrangements not adapted to a particular type of detector for measuring specific activity in the presence of other radioactive substances, e.g. natural, in the air or in liquids such as rain water

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Toxicology (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Molecular Biology (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Measurement Of Radiation (AREA)

Description

- A CMOS Integrated Radon Detector This invention relates to an integrated radon detector, and in particular to a low cost single chip CMOS integrated radon detector manufacturable using typical commercial CMOS technologies for use in continuous real-time monitoring of radon.

There has been a growing interest in developing simple, low-cost monitoring techniques for radon (222Rn) gas which is known to play a significant role in induction of lung cancer in humans. It has been estimated on the basis of a fairly extensive national survey, that there are approximately 5 to 6 million homes in the U.S. for which the average indoor radon concentration exceeds the Environmental Protection Agency's (EPA) recommended guideline of 4 pCi/L.

Prior work has been performed in developing radon detectors with discrete circuit components. Although considerable work has been done to improve accuracy in the measurement of alpha particles produced in the decay of radon and its (1~1lghtP~r products using special electro-static collectors, as developed by Bigu et al, and described in Rev. Sci.
Instrum, vol 56, no. 1, pp 146-153, Jan 1985, no one has attempted to use integrated circuit techniques to reduce the cost of the electronics. Typical prior art detectors for real-time continuous radon monitoring cost several hundred dollars. Cost prohibits use of these instruments by consumers for continuous monitoring of radon in their dwellings. One type of prior art radon detector makes use of a generic memory integrated circuit, as discussed in United States Patent No. 4,983,843 dated January 8, 1991, granted to I. Thomson for a "Radon Detector". This detector uses a commercial generic memory integrated circuit not optimized for radon detection, thereby reducing the efficiency of detecting alpha particles from the decay of radon and/or progeny.

The disclosed radon detector provides considerable improvement in measurement efficiency due to significant reduction in noise by replacing discrete circuit components of prior art detectors with an array of cells comprising simple integrated sensory elements with respective amplifiers on one single chip optimized for detecting alpha particles. The integrated design on one single chip manufacturable in a typical commercial CMOS
process also provides significant reduction in cost. An application of this inventive radon detector is to use the electro-static cell disclosed by Bigu to enclose the inventive single chip radon detector for continuous real-time measurement of indoor radon. It is therefore expected, that an accurate and low cost continuous real-time indoor radon monitoring system, affordable by consumers, could be developed using the disclosed single chip radon detector with the radon trapping chamber demonstrated by Bigu.

In this invention a new means of sensing alpha particles produced in the decay of radon and its progeny by using the well to substrate depletion capacitance of a reverse-biased pn junction is established. This junction provides minimnm capacitance per unit area in a CMOS process, thereby allowing a large sense area to be used while still providing a measurable potential change produced by the 1 60fC of charge generated by a single alpha particle of 5.49 Mev of energy incident on a pnjunction from radon decay.

Another aspect of this invention is the design of an on-chip amplification scheme to provide a direct reading output pulse for each alpha strike. By providing on-chip amplification of the potential change induced, significant reduction in noise and stray capacitance is achieved, thereby significantly minimi7ing any loss in the induced voltage.

To achieve appreciable count rates, a large array of cells each consisting of a sense capacitor with an amplifier is integrated on a single chip. The cells are sequentially accessed to precharge (reverse-bias) each sense capacitor to a known potential, then leave the capacitor to 'float' electrically for an alpha strike and subsequently read to count the strike. The floating period is identified as a collection cycle which is considerably longer than the read and precharge cycle. This single chip is intended to be placed in an enclosure as described by Bigu in which only radon gas is trapped in a well defined sensitive volume formed by a semi-permeable membrane sleeve around a cylindrical chamber which prevents radon ~ lghter products and unwanted airborne particles from entry. The trapped radon is expected to undergo decay producing positively charged claughter products. A
grounded Mylar sheet just above the exposed chip surface will enhance the deposition of the positively charged ~l~ughter products. This scheme elimin~t~-s the measured data dependency on local and distant alpha particles as most of the incident alphas originate from the cl~-lghter products deposited on the Mylar sheet. This trapping system for radon also provides a well defined sensitive volume to which the measured data can be referred for counting statistics.

In the improved design of radon detector disclosed here, improvement in accuracy and significant reduction in noise and cost is achieved by using an array of integrated cells comprising well to substrate depletion capacitance of reverse biased pn junctions with high gain, low input capacitance CMOS inverter amplifiers and access CiL~;Uilly on one single chip enclosed in an apparatus as described by Bigu. The disclosed design of the detector is realizable in typical commercial conventional CMOS technologies. The detector can therefore be produced at low cost in large quantities. Prior art detectors are seriously deficient in this regard.

The invention, as disclosed and exemplified by a preferred embodiment, is described with reference to the drawings in which:

Figure 1 shows the enclosure (electrostatic collector) to trap radon gas.

Figure 2 shows a cross-section of the disclosed sense capacitor Cs.

Figure 3 shows a schematic of sense capacitor, Cs, and amplifier with amplifier static transfer characteristic curve.

Figure 4 shows a complete repeatable detector circuit cell Figure 5 shows the block diagram of the complete chip Figure 6 shows layout of an array of cells with the complete decoding ~ uilly.

Figure 7 shows the timing diagram for the radon detector.

Figure 8 shows plots for the generated output due to an alpha strike on a test cell.

According to one aspect of the present invention, a cylindrical chamber formed by metal wire-screen 1 is used to enclose the complete single radon detector chip 4 as shown in Figure 1. The surface of the chip is covered with thin alllmni7e-1 Mylar sheet 3. The chamber wire-screen is covered with a membrane 2. The screen, membrane and the radon detecting chip are sealed around the edges to elimin:~te air leaks and form a well-de~ned sensitive volume for sampling purposes. The operation principle of the collector is based on the fact that the membrane filters out the decay products of radon and other airborne particulates including water vapor and traps only radon (222Rn) gas which diffuses into the volume. As long as radon concentration in the ambient air outside the chamber is constant, in equilibrium the radon concentration in the chamber will become equal to that in the ambient. A dc voltage of ~300V is applied to the wire-screen and the alumnized Mylar sheet is grounded. The filtered radon gas inside the volume undergoes radioactive decay producing ~ nghtPr products in a positively charged state. Since the Mylar sheet is negative with respect to the wire-screen of the chamber, the (l~llghter products are deposited on the Mylar sheet encapsulating the chip. Maintaining a negative potential on the Mylar sheet with respect to the wire-screen greatly enhances the deposition of the ~l~llghter products while the enclosure provides a well defined volume to which the measured data may be referred to estimate the radon concentration. This scheme elimin~tes the measured data dependency on local and distant alpha particles as most of the incident alphas originate from the ~ ght~r products deposited on the Mylar sheet located just above the chip surface. This minimi7es any loss in the energy of the impinging alphas which are known to travel a range of only 2-5 cm in air.
According to another aspect of the invention, a sense capacitor Cs 5 formed by the well to substrate depletion capacitance of a reverse-biased well-to-substrate pn junction, shown in Figure 2, is used to sense the alphas produced in the decay of radon. The sense capacitor can be formed using either the n-well or p-well in standard CMOS processes. Collected charge delivered by incident alpha particles on a sense capacitor formed in an n-well will lower the potential across the junction by an amount ~Vin, whereas the converse is true for a p-well capacitor. No preference exists in either choice. For the purpose of illustration a sense capacitor formed in an n-well CMOS process is discussed here.

Figure 3 shows yet another aspect of the invention depicting the schematic of the amplifier and its inventive application in radon detection. The amplifier is formed using a CMOS digital inverter formed by two complementary devices, transistors MPl and MNI, operated in saturation. The dimensions of both the transistors are ratioed to lower the quiescent point as shown in the static transfer characteristic. The transistor dimensions are further optimized to provide m~ximum gain with minimum input capacitance to avoid any undue loss in ~Vin. The amplifier choice also provides maximum area coverage for C s compared to that of the rem~ining circuitry, an important factor to achieve compact Iayout.
To prepare the cell in Figure 3 for operation as a detector, the n-well of Cs is connected to the input 6 of the CMOS inverter amplifier, a high impedance point, which serves to amplify the induced ~Vin. Operation begins by precharging the n-well to a positive potential relative to the substrate. During the precharge cycle the PMOS transistor MP2 is turned on by taking the gate voltage ~ 7 to 0 volts, the inverter is forced to the condition Vin = VOut and the sense capacitor is precharged to the same potential. The dummy transistor MP3 with its source and drain shorted to the signal line 6 is used to apply an opposing clock feedthrough to that generated by MP2. To minimi7e the clock feedthrough of the circuit, the size of transistor MP2 is chosen with twice the minimllm geometry (minimum transistor dimensions allowed by the technology design rules) such that the corresponding channel area of MP3 is half that of MP2. After precharge, a collection interval begins during which the n-well is allowed to "float" electrically and Cs is expected to hold its charge until the next precharge cycle. The collection cycle must be short enough such that Cs does not discharge significantly due to junction leakage. The collection interval starts when MP2 is turned off and MP3 turns on. Any alpha particle strike on the sense capacitor during this collection time will cause a potential change at the input node and thus upset the Vin = VOut condition. If the precharge point is chosen on the edge of the high gain region of the inverter, as shown in Figure 3, the relatively small change, ~Vin, in Vin, produced by an alpha strike, will lead to a large change, ~VOut, in VOut, which can be detected as a change in logic level using an ~.~fiately designed buffer. The next precharge cycle will charge the sense capacitor back to the Vin = VOut point if an alpha strike has occurred.
According to yet another aspect of the invention, transistor MP4 is used to lower the power consumption. The need for lowering the consumption arises due to the fact that the devices MPl and MNl are both operating under saturation and power is consumed during both the precharge and collection cycles. Therefore, MP4 is turned on only during the read and precharge cycles which are ~ 2% of the complete clock cycle. This scheme significantly reduces power consumption to levels such that when an array of cells depicted in Figure 4 is used in the design of single chip radon detector, the total average power can be sustained by using a conventional alkaline battery source that would last for a few months. In addition, the above scheme also significantly reduces the possibility of noise coupling from power supply lines.
According to other aspects of the invention, the choice of this amplifier also allows the design to be implemented in a p-well process by simply dimensioning the transistors MPI
and MNl such that the transfer characteristic is shifted towards VDD SO that a small increase in Vin caused by an alpha strike produces a large swing at the output in an opposite direction. The overall amplifier design provides high gain, low power consumption, low noise, and maximum area coverage by Cs compared to that of the rem~inin~ circuitry. The output from the amplifier buffered to a display reflects the count of alpha strikes from which indoor radon concentration may be estimated accurately. This is yet another improvement to the prior art detectors in that no additional complicated circuitry is required to interpret the results.
The recommended guideline set by the EPA for indoor radon concentration is 4pCi/L
of air. At 4pCi/L of radon concentration, the expected count rate for alpha particles from radon and its progeny in a volume of 20 cm3 reaching a detector surface is 20 counts per hour. In an embodiment of this invention using the electrostatic collector 1, the sense surface below the Mylar sheet 2 is made with an area of 1 cm2. The main constraint on the maximum size of the sense capacitor is the fact that the charge generated by an alpha strike must be comparable to that in the capacitor. Therefore, a well to substrate depletion capacitance of ~0.4pF is considered to be a good choice. In another embodiment of this invention, C~; is implemented in a square geometry of 100~m x 100,um in a conventional CMOS process to give a value of 0.4pF. In order to obtain a sense area of lcm x lcm a total of 10,000 cells are required. There~ore, an array of 10,000 inventive repeatable cell illustrated in Figure 4, has to be placed in rows and columns in order to obtain an e~fecti~e sense area of ~ lcm x lcm. Considering, 128 rows x 128 columns will require 16384 repeatable cells. Two 7-128 decoding blocks will be required to decode the rows and columns, as shown in Figure 5. Similarly, two 7-bit counters 12 and 13 are required which will divide the PRE signal 11 to be multiplexed by the row and column decoding blocks, 14 and 15. Outputs from the 7-bit counter 12 which is clocked using the PRE signal 11, are fed into the row decoder block 14. The carry signal 16 of the counter 12 is used to clock the 7-bit counter 13 whose outputs are fed into the column decoder block 15. This scheme provides suitable multiplexing of the PRE signal 11 such that one column at a time is accessed. The repetitive cells illustrated in Figure 4 will be butted together such that each row will share same RSi signal line 10 and each column will share the same CSi line 9. The outputs 17 of all the cells are wired ORed.
From another aspect of this invention, it was found that the maximum time after which the sense capacitor discharges due to leakage giving a false output is 80msec. Therefore, if PRE signal 11 of 411sec period is used all the 16384 cells will be accessed in 65.5 msec.
Half the period of PRE will be used for read (active-high) and the rem~inin~ half for precharge (active-low). The RS 10 and CS 9 (both active-high) from the row and column decoder outputs will be further decoded by the clock generating circuitry on each cell to produce a ADDR 8 active-low signal that will select and power up the respective cell when accessed. The output is valid only during the 2 ,usec when the ADDR signal 8 is low. The clock generating circuity of a cell will also produce the ~ signal 7 to precharge the cell to the Vin = Vout point-The trapped radon gas after under going decay inside the collector of Figure 1 willproduce alpha emitting cl~llghter products that will be deposited on the Mylar sheet 3. Each incident alpha particle will produce a change in the voltage only in the sense capacitor of the cell at which it strikes. When the targeted capacitor is addressed it will have already upset the Vin =VOUt point of the amplifier and a corresponding large output voltage change is produced that is valid during the first 2~sec of the PRE pulse, the read cycle. In the next 2,usec of the PRE pulse, the capacitor is again precharged to Vin -VOUt. The output 18 carried through a properly designed buffer will provide direct count rate. This count rate can be directly referred to the sensitive volume of 20 cm3 and a direct and accurate estimate of indoor radon concentration can be made assuming equilibrium between radon and the decay products.
In another embodiment of this invention, a single integrated circuit with 16 cells arranged in 4 rows and 4 columns with the required on-chip clock generation and decoding circuilly was designed and fabricated through the (~n~ n Microelectronics Corporation (CMC) in 1.5 ,um CMOS process of MITEL Corporation, and later tested. A layout of this embodiment is shown in Figure 6. The test results confirmed the functionality of the circuit as expected.
The above embodiments of the invention also provide detector immllnity to change in temperature and other process parameters since calibration is made to the Vin =VOut point and not to an absolute value. The final size of the radon detecting chip is expected to be approximately 1.5 cm x 1.5 cm with one clock supplied possibly by a crystal oscillator.
This simple, inexpensive and yet accurate radon detector is expected to be affordable for continuous monitoring of indoor radon in the price range of present smoke detectors.

Claims (5)

1. A monolithic silicon integrated circuit for detection of alpha particles produced in the decay of radon and/or radon progeny fabricated in an n-well Complementary Metal-Oxide-Semiconductor (CMOS) technology in which n-channel transistors are formed in a p-type substrate and p-channel transistors are formed in n-well regions diffused or implanted into said substrate, comprising:

a CMOS inverter consisting of an n-channel MOSFET and a p-channel MOSFET, the gates of said transistors being electrically connected together to form the input of the inverter and the drains of said transistors being electrically connected together to form the output of the inverter;
a region of n-well connected to the input of the inverter as a means to collect alpha particles;

a second p-channel MOSFET whose source region is electrically connected to the output of said inverter, and whose drain region is electrically connected to the input of said inverter, and whose gate is electrically connected to a digital pulse signal;

a third p-channel MOSFET with channel area approximately half that of the second p-channel MOSFET, the source and drain of said third p-channel MOSFET being electrically connected to the input of the CMOS inverter, and the gate being connected to a second digital pulse signal;

a fourth p-channel MOSFET whose source is electrically connected to the power supply, and whose drain region is electrically connected to the source of the p-channel transistor of said CMOS inverter, and whose gate is electrically connected to the gate of said third p-channel transistor;
2. A means of operating the integrated circuit of claim 1 for the detection of alpha particles produced in the decay of radon and/or radon progeny, said means of operation to use a single repetitive digital pulse signal, alternating between logic low and logic high levels to generate and apply at a different instance in time:

a second digital pulse signal to the gate of the second p-channel MOSFET of claim 1, the period of said second digital pulse signal being equal to that of said repetitive digital pulse signal.;

a third digital pulse signal to the gates of the third and fourth p-channel MOSFETs, for which the time duration for logic low level is equal to one complete time period of the signal applied to the second p-channel MOSFET of claim 1, such that in the first half of the time duration the output from circuit of claim 1 is read and detection of an alpha particle is inferred if the output goes from logic low to logic high level, and in the second half the circuit of claim 1 is reset.
3. A monolithic silicon integrated circuit for detection of alpha particles produced in the decay of radon and/or radon progeny fabricated in a p-well CMOS technology in which p-channel transistors are formed in a n-type substrate and n-channel transistors are formed in p-well regions diffused or implanted into said substrate, comprising:

a CMOS inverter consisting of an n-channel MOSFET and a p-channel MOSFET, the gates of said transistors being electrically connected together to form the input of the inverter and the drains of said transistors being electrically connected together to form the output of the inverter;

a region of p-well connected to the input of the CMOS inverter to serve as a collection area for alpha particles;

a second p-channel MOSFET whose source region is electrically connected to the output of said inverter, and whose drain region is electrically connected to the input of said inverter, and whose gate is electrically connected to a digital pulse signal;

a third p-channel MOSFET with channel area approximately half that of the second p-channel MOSFET, the source and drain of said third p-channel MOSFET being electrically connected to the input of the CMOS inverter, and the gate being connected to the inverse of the pulse signal applied to the second p-channel MOSFET;

a fourth n-channel MOSFET whose source is electrically connected to ground, and whose drain region is electrically connected to the source of the n-channel transistor of the CMOS inverter, and whose gate is electrically connected to a second digital pulse signal;
4. A means of operating the integrated circuit of claim 1 for the detection of alpha particles produced in the decay of radon and/or radon progeny, said means of operation to use a single repetitive digital pulse signal, alternating between logic low and logic high levels, to:
generate and apply a second digital pulse signal to the gate of the second p-channel MOSFET of claim 3 at a different instance in time, and whose time period is equal to that of said repetitive digital pulse signal;
perform digital inversion of the second pulse and apply the resultant inverted pulse to the gate of the third p-channel MOSFET of claim 3;

generate and apply a fourth digital pulse signal to the gate of the fourth p-channel MOSFETs at a different instance in time, and whose time duration for logic high level is equal to one complete time period of the signal applied to the gate of the second p-channel MOSFET of claim 3, such that in the first half of the time duration the output from circuit of claim 1 is read and detection of an alpha particle is inferred if the output goes from logic high to logic low level, and in the second half the circuit of claim 1 is reset.
5. A monolithic silicon integrated circuit containing:

a multiplicity of the circuits of claim 1 or 3 providing a sensitive area capable of detecting radon present in typical environmental concentrations;

a means to perform frequency division of one single digital pulse input signal to produce, at fixed time intervals, a second digital pulse signal valid for a time duration equal to one complete time period of the input signal;

a means to perform time division multiplexing of the second signal to provide access to each circuit of the multiplicity of circuits claimed herein, until every circuit is accessed;

a means to transfer the output from the CMOS inverter of claim 1 or 3 in each circuit of the multiplicity of circuits claimed herein to count the alpha particle strikes and consequently infer the radon concentration.
CA 2207337 1997-06-23 1997-06-23 A cmos integrated radon detector Abandoned CA2207337A1 (en)

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CA 2207337 CA2207337A1 (en) 1997-06-23 1997-06-23 A cmos integrated radon detector

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CA 2207337 CA2207337A1 (en) 1997-06-23 1997-06-23 A cmos integrated radon detector

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CA2207337A1 true CA2207337A1 (en) 1998-12-23

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113625327A (en) * 2021-07-27 2021-11-09 衡阳师范学院 Device and method for measuring Rn-222 by adopting CMOS image sensor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113625327A (en) * 2021-07-27 2021-11-09 衡阳师范学院 Device and method for measuring Rn-222 by adopting CMOS image sensor

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