CA2192903A1 - Shielding mechanism for circuit substrate - Google Patents
Shielding mechanism for circuit substrateInfo
- Publication number
- CA2192903A1 CA2192903A1 CA002192903A CA2192903A CA2192903A1 CA 2192903 A1 CA2192903 A1 CA 2192903A1 CA 002192903 A CA002192903 A CA 002192903A CA 2192903 A CA2192903 A CA 2192903A CA 2192903 A1 CA2192903 A1 CA 2192903A1
- Authority
- CA
- Canada
- Prior art keywords
- casing body
- print substrate
- earth pattern
- cover
- shielding mechanism
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
- H01L2924/1616—Cavity shape
Abstract
A casing body contains a print substrate. A circuit block is surrounded by an earth pattern on the surface of the print substrate. A shield space is formed within the casing body by contacting a shield wall formed on the cover with the earth pattern when the opening of the casing body is closed by the cover. When closing the cover, a guide mechanism positions the shield wall with respect to the earth pattern which is fixed to the casing body. The shield wall is therefore reliably contacted with the earth pattern.
Description
2 1 ~2~3 SHIELDING MECHANISM FOR CIRCUIT SUBSTRATE
BACKGROUND OF THE INVENTION
FIELD OF THE INVENTION:
The present invention relates to a shielding mechanism for forming a shield space for a circuit block on a print substrate of a radio communication device for a satellite communication system, a car phone system, a mobile phone system, or the like.
In particular, the mechanism comprises a print substrate contained in a casing body for directing its surface, on which a circuit block is surrounded by an earth pattern, toward to an opening of the casing body. The shield space is formed for the circuit block within the casing body by contacting a shield wall formed on the cover with the earth pattern when the opening of the casing body is closed with the cover.
DESCRIPTION OF THE PRIOR ART:
The recent tendency to reduce the size of radio communication devices causes a problem of interference between transmit and receive circuits. A transmit circuit sends information, including speech or data, while a receive circuit receives such information. In particular, when transmit and receive circuits are formed on the same print substrate, interference between - ~ 1 92903 these circuits results in significant deterioration of device performance.
Japanese Patent Laid-Open Publication No. Hei 5-129789 discloses a conventional method for forming a shield space for an electronic circuit block within a casing body. An earth pattern is disposed around the electronic circuit block mounted on the surface of a print substrate. A shield wall formed on a metallic cover of the casing body is brought into contact with the earth pattern when attaching the cover to the casing body.
Respective electronic circuit blocks are shielded from one another with the shield space.
SUMMARY OF THE INVENTION
The present invention aims to provide a shielding mechanism for a circuit substrate for reliably forming a shield space with a simple structure.
According to the present invention, there is provided a shielding mechanism for a circuit substrate comprising: a casing body having an opening; a print substrate contained within the casing body for directing its surface, on which a circuit block is surrounded by an earth pattern, toward the opening; a cover attached to the casing body so as to contact a shield wall with the earth pattern when the cover closes the opening, said shield wall and earth pattern being adapted to form a shield space for 21 929~3 the circuit block within the casing body; and guiding means provided between the casing body and the cover so as to position the shield wall with respect to the earth pattern on the print substrate fixed to the casing body when the opening is closed with the cover.
With the above arrangement, since the shield wall is reliably positioned with respect to the earth pattern by the guiding means, the shield wall can reliably be contacted with the earth pattern, so that leakage from the shield space can be suppressed.
The shielding mechanism may further comprise positioning means provided between the casing body and the print substrate for positioning the print substrate with respect to the casing body. The mechanism enables the reliable positioning of the print substrate with respect to the casing body, so that positioning by the guiding means can be improved.
The print substrate may be formed as a multi-layer substrate incorporating an earth layer, which prevents interference between the front and rear surfaces of the print substrate.
The shielding mechanism may further comprise a secondary earth pattern formed on a rear surface of the print substrate for electrically leading to the earth pattern through a through-hole formed in the print substrate. The secondary earth pattern is contacted by a secondary shield wall formed on the casing body when fixing the print substrate to the casing body. The circuit - 2 1 ~2~3 blocks on the front and rear surfaces of the print substrate is protected from interference.
BRIEF DESCRIPTION OF THE DRAWINGS
The above and other objects, features and advantages will be further apparent from the following description of the preferred embodiment taken in conjunction with the accompanying drawings, wherein:
Fig. 1 illustrates the entire structure of an electronic device employing a shielding mechanism for a circuit substrate according to a first embodiment of the present invention;
Fig. 2 is a perspective view illustrating an entire structure of a cover;
Fig. 3 is a sectional view along the line 3-3 in Fig. 1;
Fig. 4 illustrates the entire structure of an electronic device employing a shielding mechanism for a circuit substrate according to a second embodiment of the invention;
Fig. 5 illustrates an entire structure of an electronic device employing a shielding mechanism for a circuit substrate according to a third embodiment of the invention;
Fig. 6 is a sectional view along the line 6-6 in Fig. 5;
Fig. 7 is a sectional view corresponding to Figs. 3 and 6, illustrating an electronic device employing a shielding mechanism for a circuit substrate according to a fourth embodiment of the ~1~2~o3 invention; and Fig. 8 is a sectional view corresponding to Figs. 3 and 6, illustrating an electronic device employing a modification of the shielding mechanism according to the fourth embodiment.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
Fig. 1 illustrates an electronic device 10 employing a shielding mechanism for a circuit substrate according to a first embodiment of the invention. The electronic device 10 comprises a metallic casing body 12 having an opening 11, and a metallic cover 13 to be attached to the casing body 12 to thereby close the opening 11 of the casing body 12. The casing body 12 and the cover 13 together form a space containing a print substrate 14.
A plurality of circuit blocks such as a transmit circuit block 15 and a receive circuit block 16 in a radio communication device are mounted on the front surface of the print substrate 14, which serves as a circuit surface. The respective circuit blocks 15, 16 are surrounded by an earth pattern 17 formed on the print substrate 14, so that the blocks 15, 16 are isolated from one another by the earth pattern 17. A secondary earth pattern 18 (see Fig. 3) is formed on the rear surface, serving as a solder surface, of the print substrate 14 corresponding to the shape of the earth pattern 17 on the front surface. The earth pattern 17 and secondary earth pattern 18 are electrically 2 1 ~2~03 connected with each other at equal intervals via through-holes.
The print substrate 14 is fixed to the bottom of the casing body 12 with a plurality of screws 20. A support wall 21, serving as a secondary shield wall, is formed on the bottom of the casing body 12 corresponding to the shape of the secondary earth pattern 18. The support wall 21 is integrated in the casing body 12 by molding process such as die-casting. When the print substrate 14 is fixed to the casing body 12, the top surface of the support wall 21 contacts the secondary earth pattern 18. A conductive rubber 22 (see Fig. 3) at the top surface of the support wall 21 enables a reliable and continuous contact between the secondary earth pattern 18 and the support wall 21.
Fig. 2 illustrates a shield wall 22 for contacting the tip thereof with the earth pattern 17 when the cover 13 covers the opening 11 of the casing body 12. The shield wall 22 is integrated in the cover 13 by molding process such as die-casting.
Referring again to Fig. 1, guiding means is provided between the casing body 12 and the cover 13 for guiding the cover 13 with respect to the casing body 12. The guiding means comprises a pair of slots 23 formed on opposite side surfaces of the casing body 12, and a pair of guide projections 24 formed on the cover 13 for advancing into the slots 23. Guiding of the guide 21~291~
.
projections 24 by the slots 23 when closing the cover 13 enables the positioning of the shield wall 22 on the front surface of the print substrate 14 with respect to the earth pattern 17, which is fixed to the casing body 12. The positioning causes the top surface of the shield wall 22 to reliably contact with the earth pattern 17. A reliable and continuous contact can be ensured between the earth pattern 17 and the shield wall 22 by a conductive rubber 25 mounted on the tip of the shield pattern 22 (see Fig. 3).
The operation of the first embodiment will next be described.
The print substrate 14 is fixed to the bottom of the casing body 12 with screws as shown in Fig. 1. The position of the print substrate 14 with respect to the casing body 12 can be observed through the through-holes 19 provided at equal intervals on the earth pattern 17.
The cover 13 is subsequently attached to the casing body 12 by inserting the guide projections 24 into the slots 23. The opening 11 of the casing body 12 is closed with the cover 13.
Closing of the cover 13 causes the guiding means to position the earth pattern 17 and the top surface of the shield wall 22. The conductive rubber 25 at the top surface of the shield wall 22 prevents any gaps between the earth pattern 17 and the top surface of the shield wall 22. The earth pattern 17 and the shield wall 22 cooperate to form shield spaces for the respective 2 il 92903 circuit blocks within the casing body 12. Interfereable wave 26 irradiated from the transmit circuit block 15 is locked in the shield space and not transmitted toward the receive circuit 16.
The press force generated by the contact of the shield wall 22 is received by the support wall 21. The print substrate 14 is held between the support wall 21 and the shield wall 22, so that sealing ability of the shield space can be maintained even when vibration is applied to the electronic device 10. At the rear of the print substrate 14, the top surface of the support wall 21 contacts the secondary earth pattern 18 through the conductive rubber 22 so as to form a shield space.
Interefereable wave 27 irradiated from the transmit circuit block 15 on the solder side is thus locked within the shield space and not transmitted toward the receive circuit block 16.
Fig. 4 illustrates an electronic device 30 employing a shielding mechanism according to a second embodiment of the invention. In the second embodiment, a positioning means is provided between the casing body 12 and the print substrate 14 for positioning the print substrate 14 with respect to the casing body 12. Note that the same reference characters are attached to elements with the same function as of the first embodiment.
For example, the second embodiment employs a positioning means comprising a positioning aperture 31 formed in the print substrate 14, and a positioning projection 32 formed on the 2 ~ d 3 .
bottom of the casing body 12. When the print substrate 14 is fixed to the casing body 12, the insertion of the positioning projections 32 into the positioning apertures 31 enables fine positioning of the print substrate 14 with respect to the casing body 12, so that a reliable contact can be established between the support wall 21 and the secondary earth pattern 18. In addition, since the casing body 12 serves to improve the positioning between the cover 13 and the print substrate 14 so that accuracy can be further improved in positioning between the earth pattern 17 and the support wall 21 by the guiding means.
Figs. 5 and 6 illustrate an electronic device 40 employing a shielding mechanism according to a third embodiment of the invention. In the third embodiment, the cover 13 is placed into the casing body 12 along the guide recess 41 formed on the inner surface of the casing body 12 in parallel with the print substrate 14. The guide recess 41 and the edge of the cover 13 together constitute the aforementioned guiding means in lieu of the slot 23 and guide projection 24. The vertical level of the guide recess 41 serves to control contact force of the shield wall 22. Note that the same reference characters are attached to elements with the same function as of the first and second embodiments.
Fig. 7 illustrates an electronic device 50 employing a shielding mechanism according to a fourth embodiment of the ~192q~3 -invention. In the fourth embodiment, the print substrate 14 is constructed into a multi-layer substrate incorporating an earth layer 51 formed therein. Specifically, an earth pattern is formed in an intermediate layer or an earth layer 51 of the multi-layer print substrate 14. The earth pattern is electrically connected to the earth patterns 17, 18 on the front and rear surfaces of the print substrate 14, respectively, via the through-holes 19. This arrangement enables interference to be suppressed between the front and rear surfaces of the print substrate 14. The earth layer 51 may be constituted in more than two layers structure as shown in Fig. 8. Note that the same reference characters are attached to elements with the same function as of the first, second, and third embodiments.
BACKGROUND OF THE INVENTION
FIELD OF THE INVENTION:
The present invention relates to a shielding mechanism for forming a shield space for a circuit block on a print substrate of a radio communication device for a satellite communication system, a car phone system, a mobile phone system, or the like.
In particular, the mechanism comprises a print substrate contained in a casing body for directing its surface, on which a circuit block is surrounded by an earth pattern, toward to an opening of the casing body. The shield space is formed for the circuit block within the casing body by contacting a shield wall formed on the cover with the earth pattern when the opening of the casing body is closed with the cover.
DESCRIPTION OF THE PRIOR ART:
The recent tendency to reduce the size of radio communication devices causes a problem of interference between transmit and receive circuits. A transmit circuit sends information, including speech or data, while a receive circuit receives such information. In particular, when transmit and receive circuits are formed on the same print substrate, interference between - ~ 1 92903 these circuits results in significant deterioration of device performance.
Japanese Patent Laid-Open Publication No. Hei 5-129789 discloses a conventional method for forming a shield space for an electronic circuit block within a casing body. An earth pattern is disposed around the electronic circuit block mounted on the surface of a print substrate. A shield wall formed on a metallic cover of the casing body is brought into contact with the earth pattern when attaching the cover to the casing body.
Respective electronic circuit blocks are shielded from one another with the shield space.
SUMMARY OF THE INVENTION
The present invention aims to provide a shielding mechanism for a circuit substrate for reliably forming a shield space with a simple structure.
According to the present invention, there is provided a shielding mechanism for a circuit substrate comprising: a casing body having an opening; a print substrate contained within the casing body for directing its surface, on which a circuit block is surrounded by an earth pattern, toward the opening; a cover attached to the casing body so as to contact a shield wall with the earth pattern when the cover closes the opening, said shield wall and earth pattern being adapted to form a shield space for 21 929~3 the circuit block within the casing body; and guiding means provided between the casing body and the cover so as to position the shield wall with respect to the earth pattern on the print substrate fixed to the casing body when the opening is closed with the cover.
With the above arrangement, since the shield wall is reliably positioned with respect to the earth pattern by the guiding means, the shield wall can reliably be contacted with the earth pattern, so that leakage from the shield space can be suppressed.
The shielding mechanism may further comprise positioning means provided between the casing body and the print substrate for positioning the print substrate with respect to the casing body. The mechanism enables the reliable positioning of the print substrate with respect to the casing body, so that positioning by the guiding means can be improved.
The print substrate may be formed as a multi-layer substrate incorporating an earth layer, which prevents interference between the front and rear surfaces of the print substrate.
The shielding mechanism may further comprise a secondary earth pattern formed on a rear surface of the print substrate for electrically leading to the earth pattern through a through-hole formed in the print substrate. The secondary earth pattern is contacted by a secondary shield wall formed on the casing body when fixing the print substrate to the casing body. The circuit - 2 1 ~2~3 blocks on the front and rear surfaces of the print substrate is protected from interference.
BRIEF DESCRIPTION OF THE DRAWINGS
The above and other objects, features and advantages will be further apparent from the following description of the preferred embodiment taken in conjunction with the accompanying drawings, wherein:
Fig. 1 illustrates the entire structure of an electronic device employing a shielding mechanism for a circuit substrate according to a first embodiment of the present invention;
Fig. 2 is a perspective view illustrating an entire structure of a cover;
Fig. 3 is a sectional view along the line 3-3 in Fig. 1;
Fig. 4 illustrates the entire structure of an electronic device employing a shielding mechanism for a circuit substrate according to a second embodiment of the invention;
Fig. 5 illustrates an entire structure of an electronic device employing a shielding mechanism for a circuit substrate according to a third embodiment of the invention;
Fig. 6 is a sectional view along the line 6-6 in Fig. 5;
Fig. 7 is a sectional view corresponding to Figs. 3 and 6, illustrating an electronic device employing a shielding mechanism for a circuit substrate according to a fourth embodiment of the ~1~2~o3 invention; and Fig. 8 is a sectional view corresponding to Figs. 3 and 6, illustrating an electronic device employing a modification of the shielding mechanism according to the fourth embodiment.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
Fig. 1 illustrates an electronic device 10 employing a shielding mechanism for a circuit substrate according to a first embodiment of the invention. The electronic device 10 comprises a metallic casing body 12 having an opening 11, and a metallic cover 13 to be attached to the casing body 12 to thereby close the opening 11 of the casing body 12. The casing body 12 and the cover 13 together form a space containing a print substrate 14.
A plurality of circuit blocks such as a transmit circuit block 15 and a receive circuit block 16 in a radio communication device are mounted on the front surface of the print substrate 14, which serves as a circuit surface. The respective circuit blocks 15, 16 are surrounded by an earth pattern 17 formed on the print substrate 14, so that the blocks 15, 16 are isolated from one another by the earth pattern 17. A secondary earth pattern 18 (see Fig. 3) is formed on the rear surface, serving as a solder surface, of the print substrate 14 corresponding to the shape of the earth pattern 17 on the front surface. The earth pattern 17 and secondary earth pattern 18 are electrically 2 1 ~2~03 connected with each other at equal intervals via through-holes.
The print substrate 14 is fixed to the bottom of the casing body 12 with a plurality of screws 20. A support wall 21, serving as a secondary shield wall, is formed on the bottom of the casing body 12 corresponding to the shape of the secondary earth pattern 18. The support wall 21 is integrated in the casing body 12 by molding process such as die-casting. When the print substrate 14 is fixed to the casing body 12, the top surface of the support wall 21 contacts the secondary earth pattern 18. A conductive rubber 22 (see Fig. 3) at the top surface of the support wall 21 enables a reliable and continuous contact between the secondary earth pattern 18 and the support wall 21.
Fig. 2 illustrates a shield wall 22 for contacting the tip thereof with the earth pattern 17 when the cover 13 covers the opening 11 of the casing body 12. The shield wall 22 is integrated in the cover 13 by molding process such as die-casting.
Referring again to Fig. 1, guiding means is provided between the casing body 12 and the cover 13 for guiding the cover 13 with respect to the casing body 12. The guiding means comprises a pair of slots 23 formed on opposite side surfaces of the casing body 12, and a pair of guide projections 24 formed on the cover 13 for advancing into the slots 23. Guiding of the guide 21~291~
.
projections 24 by the slots 23 when closing the cover 13 enables the positioning of the shield wall 22 on the front surface of the print substrate 14 with respect to the earth pattern 17, which is fixed to the casing body 12. The positioning causes the top surface of the shield wall 22 to reliably contact with the earth pattern 17. A reliable and continuous contact can be ensured between the earth pattern 17 and the shield wall 22 by a conductive rubber 25 mounted on the tip of the shield pattern 22 (see Fig. 3).
The operation of the first embodiment will next be described.
The print substrate 14 is fixed to the bottom of the casing body 12 with screws as shown in Fig. 1. The position of the print substrate 14 with respect to the casing body 12 can be observed through the through-holes 19 provided at equal intervals on the earth pattern 17.
The cover 13 is subsequently attached to the casing body 12 by inserting the guide projections 24 into the slots 23. The opening 11 of the casing body 12 is closed with the cover 13.
Closing of the cover 13 causes the guiding means to position the earth pattern 17 and the top surface of the shield wall 22. The conductive rubber 25 at the top surface of the shield wall 22 prevents any gaps between the earth pattern 17 and the top surface of the shield wall 22. The earth pattern 17 and the shield wall 22 cooperate to form shield spaces for the respective 2 il 92903 circuit blocks within the casing body 12. Interfereable wave 26 irradiated from the transmit circuit block 15 is locked in the shield space and not transmitted toward the receive circuit 16.
The press force generated by the contact of the shield wall 22 is received by the support wall 21. The print substrate 14 is held between the support wall 21 and the shield wall 22, so that sealing ability of the shield space can be maintained even when vibration is applied to the electronic device 10. At the rear of the print substrate 14, the top surface of the support wall 21 contacts the secondary earth pattern 18 through the conductive rubber 22 so as to form a shield space.
Interefereable wave 27 irradiated from the transmit circuit block 15 on the solder side is thus locked within the shield space and not transmitted toward the receive circuit block 16.
Fig. 4 illustrates an electronic device 30 employing a shielding mechanism according to a second embodiment of the invention. In the second embodiment, a positioning means is provided between the casing body 12 and the print substrate 14 for positioning the print substrate 14 with respect to the casing body 12. Note that the same reference characters are attached to elements with the same function as of the first embodiment.
For example, the second embodiment employs a positioning means comprising a positioning aperture 31 formed in the print substrate 14, and a positioning projection 32 formed on the 2 ~ d 3 .
bottom of the casing body 12. When the print substrate 14 is fixed to the casing body 12, the insertion of the positioning projections 32 into the positioning apertures 31 enables fine positioning of the print substrate 14 with respect to the casing body 12, so that a reliable contact can be established between the support wall 21 and the secondary earth pattern 18. In addition, since the casing body 12 serves to improve the positioning between the cover 13 and the print substrate 14 so that accuracy can be further improved in positioning between the earth pattern 17 and the support wall 21 by the guiding means.
Figs. 5 and 6 illustrate an electronic device 40 employing a shielding mechanism according to a third embodiment of the invention. In the third embodiment, the cover 13 is placed into the casing body 12 along the guide recess 41 formed on the inner surface of the casing body 12 in parallel with the print substrate 14. The guide recess 41 and the edge of the cover 13 together constitute the aforementioned guiding means in lieu of the slot 23 and guide projection 24. The vertical level of the guide recess 41 serves to control contact force of the shield wall 22. Note that the same reference characters are attached to elements with the same function as of the first and second embodiments.
Fig. 7 illustrates an electronic device 50 employing a shielding mechanism according to a fourth embodiment of the ~192q~3 -invention. In the fourth embodiment, the print substrate 14 is constructed into a multi-layer substrate incorporating an earth layer 51 formed therein. Specifically, an earth pattern is formed in an intermediate layer or an earth layer 51 of the multi-layer print substrate 14. The earth pattern is electrically connected to the earth patterns 17, 18 on the front and rear surfaces of the print substrate 14, respectively, via the through-holes 19. This arrangement enables interference to be suppressed between the front and rear surfaces of the print substrate 14. The earth layer 51 may be constituted in more than two layers structure as shown in Fig. 8. Note that the same reference characters are attached to elements with the same function as of the first, second, and third embodiments.
Claims (4)
1. A shielding mechanism for a circuit substrate, comprising:
a casing body having an opening;
a print substrate contained within the casing body for directing its surface, on which a circuit block is surrounded by an earth pattern, toward the opening;
a cover attached to the casing body so as to contact a shield wall with the earth pattern when the cover closes the opening, said shield wall and earth pattern being adapted to form a shield space for the circuit block within the casing body; and guiding means provided between the casing body and the cover so as to position the shield wall with respect to the earth pattern on the print substrate fixed to the casing body when the opening is closed with the cover.
a casing body having an opening;
a print substrate contained within the casing body for directing its surface, on which a circuit block is surrounded by an earth pattern, toward the opening;
a cover attached to the casing body so as to contact a shield wall with the earth pattern when the cover closes the opening, said shield wall and earth pattern being adapted to form a shield space for the circuit block within the casing body; and guiding means provided between the casing body and the cover so as to position the shield wall with respect to the earth pattern on the print substrate fixed to the casing body when the opening is closed with the cover.
2. The shielding mechanism defined in claim 1, further comprising positioning means provided between the casing body and the print substrate for positioning the print substrate with respect to the casing body.
3. The shielding mechanism defined in claim 1, wherein the print substrate is formed as a multi-layer substrate incorporating an earth layer.
4. The shielding mechanism defined in claim 1, further comprising a secondary earth pattern formed on a rear surface of the print substrate for electrically leading to the earth pattern through a through-hole formed in the print substrate, wherein the secondary earth pattern is contacted by a secondary shield wall formed on the casing body when fixing the print substrate to the casing body.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12001996A JPH09307260A (en) | 1996-05-15 | 1996-05-15 | Shielding mechanism between circuit blocks |
| JPHEI8-120019 | 1996-05-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2192903A1 true CA2192903A1 (en) | 1997-11-16 |
Family
ID=14775901
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002192903A Abandoned CA2192903A1 (en) | 1996-05-15 | 1996-12-13 | Shielding mechanism for circuit substrate |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPH09307260A (en) |
| CA (1) | CA2192903A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7564699B2 (en) | 2004-09-17 | 2009-07-21 | Ntt Docomo, Inc. | Planar circuit housing |
| US10966356B2 (en) | 2016-03-16 | 2021-03-30 | Sony Interactive Entertainment Inc. | Electronic apparatus |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4070689B2 (en) * | 2003-08-20 | 2008-04-02 | シャープ株式会社 | Wireless communication unit |
| JP4608383B2 (en) * | 2005-07-29 | 2011-01-12 | Ｔｄｋ株式会社 | Power supply, housing and pedestal |
| JP6699774B2 (en) * | 2019-03-11 | 2020-05-27 | 株式会社村田製作所 | How to protect protected items |
-
1996
- 1996-05-15 JP JP12001996A patent/JPH09307260A/en active Pending
- 1996-12-13 CA CA002192903A patent/CA2192903A1/en not_active Abandoned
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7564699B2 (en) | 2004-09-17 | 2009-07-21 | Ntt Docomo, Inc. | Planar circuit housing |
| US10966356B2 (en) | 2016-03-16 | 2021-03-30 | Sony Interactive Entertainment Inc. | Electronic apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH09307260A (en) | 1997-11-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EEER | Examination request | ||
| FZDE | Dead |