CA2104487A1 - Hermetic protection for integrated circuits - Google Patents

Hermetic protection for integrated circuits

Info

Publication number
CA2104487A1
CA2104487A1 CA002104487A CA2104487A CA2104487A1 CA 2104487 A1 CA2104487 A1 CA 2104487A1 CA 002104487 A CA002104487 A CA 002104487A CA 2104487 A CA2104487 A CA 2104487A CA 2104487 A1 CA2104487 A1 CA 2104487A1
Authority
CA
Canada
Prior art keywords
silicon
ceramic
integrated circuit
coatings
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA002104487A
Other languages
English (en)
French (fr)
Inventor
Robert Charles Camilletti
Grish Chandra
Mark Jon Loboda
Keith Winton Michael
David Alan Sierawski
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Silicones Corp
Original Assignee
Dow Corning Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Corp filed Critical Dow Corning Corp
Publication of CA2104487A1 publication Critical patent/CA2104487A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H10W74/43—
    • H10W74/01—
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • H10W72/019—
    • H10W74/476—
    • H10W72/075—
    • H10W72/07536—
    • H10W72/07537—
    • H10W72/923—
    • H10W72/952—
    • H10W72/983—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Formation Of Insulating Films (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
CA002104487A 1992-08-28 1993-08-20 Hermetic protection for integrated circuits Abandoned CA2104487A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US93647592A 1992-08-28 1992-08-28
US07/936,475 1992-08-28

Publications (1)

Publication Number Publication Date
CA2104487A1 true CA2104487A1 (en) 1994-03-01

Family

ID=25468695

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002104487A Abandoned CA2104487A1 (en) 1992-08-28 1993-08-20 Hermetic protection for integrated circuits

Country Status (6)

Country Link
EP (1) EP0590780B1 (enExample)
JP (1) JPH06177185A (enExample)
KR (1) KR100287487B1 (enExample)
CA (1) CA2104487A1 (enExample)
DE (1) DE69311774T2 (enExample)
TW (1) TW232094B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10399256B1 (en) 2018-04-17 2019-09-03 Goodrich Corporation Sealed circuit card assembly

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4427309C2 (de) * 1994-08-02 1999-12-02 Ibm Herstellung eines Trägerelementmoduls zum Einbau in Chipkarten oder andere Datenträgerkarten
DE19548046C2 (de) * 1995-12-21 1998-01-15 Siemens Matsushita Components Verfahren zur Herstellung von für eine Flip-Chip-Montage geeigneten Kontakten von elektrischen Bauelementen
US5935638A (en) * 1998-08-06 1999-08-10 Dow Corning Corporation Silicon dioxide containing coating
WO2008122292A1 (en) * 2007-04-04 2008-10-16 Ecole Polytechnique Federale De Lausanne (Epfl) Diffusion-barrier coating for protection of moisture and oxygen sensitive devices

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63213347A (ja) * 1987-02-27 1988-09-06 Mitsubishi Electric Corp 半導体装置
US4849296A (en) * 1987-12-28 1989-07-18 Dow Corning Corporation Multilayer ceramic coatings from metal oxides and hydrogen silsesquioxane resin ceramified in ammonia
US4888226A (en) * 1988-08-08 1989-12-19 American Telephone And Telegraph Company Silicone gel electronic device encapsulant
CA2027031A1 (en) * 1989-10-18 1991-04-19 Loren A. Haluska Hermetic substrate coatings in an inert gas atmosphere
US5136364A (en) * 1991-06-12 1992-08-04 National Semiconductor Corporation Semiconductor die sealing

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10399256B1 (en) 2018-04-17 2019-09-03 Goodrich Corporation Sealed circuit card assembly
US10737410B2 (en) 2018-04-17 2020-08-11 Goodrich Corporation Sealed circuit card assembly

Also Published As

Publication number Publication date
KR940004761A (ko) 1994-03-15
EP0590780B1 (en) 1997-06-25
DE69311774D1 (de) 1997-07-31
TW232094B (enExample) 1994-10-11
KR100287487B1 (ko) 2001-04-16
EP0590780A1 (en) 1994-04-06
DE69311774T2 (de) 1998-01-08
JPH06177185A (ja) 1994-06-24

Similar Documents

Publication Publication Date Title
US5481135A (en) Hermetic protection for integrated circuits
US5563102A (en) Method of sealing integrated circuits
US5380567A (en) Hermetic coatings by heating hydrogen silsesquinoxane resin in an inert atmosphere
EP0461782B1 (en) Conversion of silica precursors to silica at low temperatures
US4849296A (en) Multilayer ceramic coatings from metal oxides and hydrogen silsesquioxane resin ceramified in ammonia
CA1332680C (en) Ceramic coatings from the pyrolysis in ammonia of mixtures of silicate esters and other metal oxide precursors
EP0270231B1 (en) Platinum or rhodium catalyzed multilayer ceramic coatings from hydrogen silsequioxane resin and metal oxides
US5825078A (en) Hermetic protection for integrated circuits
US4753855A (en) Multilayer ceramic coatings from metal oxides for protection of electronic devices
US5710203A (en) Electronic coating compositions
US4808653A (en) Coating composition containing hydrogen silsesquioxane resin and other metal oxide precursors
EP0274274A2 (en) Multilayer ceramic coatings from silicate esters and metal oxides
CA2007726A1 (en) Low temperature process for the formation of ceramic coatings
EP0590780B1 (en) Method for producing an integrated circuit with hermetic protection based on a ceramic layer
CA2104484A1 (en) Hermetic protection for integrated circuits
EP0661742B1 (en) Method of passivating an integrated circuit
EP0588577A2 (en) Hermetically sealed integrated circuits
CA2100277A1 (en) Sealing porous electronic substrates

Legal Events

Date Code Title Description
FZDE Discontinued