CA2093407A1 - Method for fabricating a ceramic multi-layer substrate - Google Patents

Method for fabricating a ceramic multi-layer substrate

Info

Publication number
CA2093407A1
CA2093407A1 CA2093407A CA2093407A CA2093407A1 CA 2093407 A1 CA2093407 A1 CA 2093407A1 CA 2093407 A CA2093407 A CA 2093407A CA 2093407 A CA2093407 A CA 2093407A CA 2093407 A1 CA2093407 A1 CA 2093407A1
Authority
CA
Canada
Prior art keywords
ceramic
films
greensheet
forming
fabricating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA2093407A
Other languages
French (fr)
Other versions
CA2093407C (en
Inventor
Jun Inasaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP8381292A external-priority patent/JP2560947B2/en
Priority claimed from JP4084328A external-priority patent/JP2797827B2/en
Application filed by NEC Corp filed Critical NEC Corp
Publication of CA2093407A1 publication Critical patent/CA2093407A1/en
Application granted granted Critical
Publication of CA2093407C publication Critical patent/CA2093407C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4061—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

A method for fabricating a ceramic multi-layer substrate by a greensheet process includes a step of bonding an organic resin film on a ceramic greensheet cast on a carrier film;
a step of forming a through-hole on said ceramic greensheet in a state in which this ceramic greensheet retains one or both of said films and filling conductive paste in said through-hole by using one of said films as a mask; a step of removing one of said films. placing said ceramic green-sheet on a stack of ceramic greensheets forming a base.
forming a laminate assembly by applying pressure thereto, and removing the other of said films remaining in said assembly. It is possible to suppress the occurrence of deformation in dimensions of greensheets when they are processed and of displacement or misalignment when they are laminated.
CA002093407A 1992-04-06 1993-04-05 Method for fabricating a ceramic multi-layer substrate Expired - Fee Related CA2093407C (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP83812/1992 1992-04-06
JP8381292A JP2560947B2 (en) 1992-04-06 1992-04-06 Method for manufacturing ceramic multilayer wiring board
JP84328/1992 1992-04-07
JP4084328A JP2797827B2 (en) 1992-04-07 1992-04-07 Manufacturing method of ceramic multilayer wiring board

Publications (2)

Publication Number Publication Date
CA2093407A1 true CA2093407A1 (en) 1993-10-07
CA2093407C CA2093407C (en) 1997-12-09

Family

ID=26424858

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002093407A Expired - Fee Related CA2093407C (en) 1992-04-06 1993-04-05 Method for fabricating a ceramic multi-layer substrate

Country Status (4)

Country Link
US (1) US5271150A (en)
EP (1) EP0565033B1 (en)
CA (1) CA2093407C (en)
DE (1) DE69300506T2 (en)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5470412A (en) * 1992-07-30 1995-11-28 Sumitomo Metal Ceramics Inc. Process for producing a circuit substrate
JP2581436B2 (en) * 1993-12-29 1997-02-12 日本電気株式会社 Manufacturing method of ceramic multilayer wiring board
US5480503A (en) * 1993-12-30 1996-01-02 International Business Machines Corporation Process for producing circuitized layers and multilayer ceramic sub-laminates and composites thereof
US5759331A (en) * 1994-07-15 1998-06-02 Paul J. Dostart Method of ensuring conductivity in the manufacturing of a multi-layer ceramic component containing interlayer conductive-filled via holes
US5637177A (en) * 1994-12-07 1997-06-10 Van Os Enterprises Laminating apparatus having a reciprocating press roller
JPH08181443A (en) * 1994-12-21 1996-07-12 Murata Mfg Co Ltd Ceramic multilayer board and manufacture thereof
US5779833A (en) * 1995-08-04 1998-07-14 Case Western Reserve University Method for constructing three dimensional bodies from laminations
US5847929A (en) * 1996-06-28 1998-12-08 International Business Machines Corporation Attaching heat sinks directly to flip chips and ceramic chip carriers
US5822856A (en) * 1996-06-28 1998-10-20 International Business Machines Corporation Manufacturing circuit board assemblies having filled vias
US5948200A (en) 1996-07-26 1999-09-07 Taiyo Yuden Co., Ltd. Method of manufacturing laminated ceramic electronic parts
JP3451868B2 (en) * 1997-01-17 2003-09-29 株式会社デンソー Manufacturing method of ceramic laminated substrate
US6045714A (en) * 1998-04-01 2000-04-04 International Business Machines Corporation Method for forming flat surface vias in integrated circuit substrates
US6079100A (en) * 1998-05-12 2000-06-27 International Business Machines Corporation Method of making a printed circuit board having filled holes and fill member for use therewith
US6009620A (en) * 1998-07-15 2000-01-04 International Business Machines Corporation Method of making a printed circuit board having filled holes
US6592696B1 (en) 1998-10-09 2003-07-15 Motorola, Inc. Method for fabricating a multilayered structure and the structures formed by the method
US6572830B1 (en) 1998-10-09 2003-06-03 Motorola, Inc. Integrated multilayered microfludic devices and methods for making the same
US6711813B1 (en) * 1999-11-05 2004-03-30 Interuniversitair Microelektronica Centrum Method for fabricating a thin film build-up structure on a sequentially laminated printed circuit board base
US6352014B1 (en) 1999-12-15 2002-03-05 International Business Machines Corporation Method for making punches using multi-layer ceramic technology
US6970362B1 (en) * 2000-07-31 2005-11-29 Intel Corporation Electronic assemblies and systems comprising interposer with embedded capacitors
US6775150B1 (en) * 2000-08-30 2004-08-10 Intel Corporation Electronic assembly comprising ceramic/organic hybrid substrate with embedded capacitors and methods of manufacture
JP3449350B2 (en) * 2000-11-09 2003-09-22 株式会社村田製作所 Manufacturing method of multilayer ceramic electronic component and multilayer ceramic electronic component
US6562169B2 (en) * 2001-01-17 2003-05-13 International Business Machines Corporation Multi-level web structure in use for thin sheet processing
US6465084B1 (en) * 2001-04-12 2002-10-15 International Business Machines Corporation Method and structure for producing Z-axis interconnection assembly of printed wiring board elements
JP2005096390A (en) * 2003-05-29 2005-04-14 Ngk Spark Plug Co Ltd Wiring board, its production method, carrier sheet for forming green sheet used in it
US6955737B2 (en) * 2003-06-30 2005-10-18 International Business Machines Corporation Supported greensheet structure and method in MLC processing

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3795047A (en) * 1972-06-15 1974-03-05 Ibm Electrical interconnect structuring for laminate assemblies and fabricating methods therefor
US4754371A (en) * 1984-04-27 1988-06-28 Nec Corporation Large scale integrated circuit package
FR2567684B1 (en) * 1984-07-10 1988-11-04 Nec Corp MODULE HAVING A MULTILAYER CERAMIC SUBSTRATE AND A MULTILAYER CIRCUIT ON THE SUBSTRATE AND METHOD FOR THE PRODUCTION THEREOF
JPS63181400A (en) * 1987-01-22 1988-07-26 松下電器産業株式会社 Ceramic multilayer substrate
JPH01310592A (en) * 1988-06-08 1989-12-14 Murata Mfg Co Ltd Circuit substrate
EP0456243B1 (en) * 1990-05-09 1995-08-16 Matsushita Electric Industrial Co., Ltd. Composite sheet and a process for producing ceramic circuit board using same
JP2874329B2 (en) * 1990-11-05 1999-03-24 日本電気株式会社 Method for manufacturing multilayer printed wiring board
JPH04296086A (en) * 1991-01-18 1992-10-20 Du Pont Japan Ltd Green sheet for ceramic multilayered substrate and manufacture thereof and manufacture of ceramic multilayered substrate using this green sheet

Also Published As

Publication number Publication date
DE69300506D1 (en) 1995-10-26
US5271150A (en) 1993-12-21
DE69300506T2 (en) 1996-04-04
EP0565033B1 (en) 1995-09-20
EP0565033A1 (en) 1993-10-13
CA2093407C (en) 1997-12-09

Similar Documents

Publication Publication Date Title
CA2093407A1 (en) Method for fabricating a ceramic multi-layer substrate
EP0114211B1 (en) Multi-layer flexible film module
EP1033749B1 (en) Method and producing ceramic multilayer substrate
US5407511A (en) Process for forming a sintered conductor circuit board
EP0300186B1 (en) Process for producing a multilayer ceramic substrate
CA2073211A1 (en) Method of manufacturing a rigid-flex printed wiring board
JPS57193092A (en) Transfer foil and method of transferring with same
GB2207288A (en) A method of producing a hybrid multi-layered circuit substrate
CA2320064A1 (en) Method of making microwave, multifunction modules using fluoropolymer composite substrates
EP0282625A3 (en) Method for producing rigid-type multilayer printed wiring board
KR100521941B1 (en) Method of manufacturing a multi-layered ceramic substrate
EP0384072A3 (en) Composite including an inorganic image and method of transferring such an image
CA2169547A1 (en) Multiple Layer Printed Circuit Boards and Method of Manufacture
WO2005010930A3 (en) Method for forming high resolution electronic circuits
US4802945A (en) Via filling of green ceramic tape
US6743316B2 (en) Multilayered ceramic substrate and production method therefor
JP2581436B2 (en) Manufacturing method of ceramic multilayer wiring board
CA2338670A1 (en) Resin/copper/metal laminate and method of producing same
EP0404177A3 (en) Transfer sheet for making printed-wiring board by injection molding and method for producing same
EP0144684B1 (en) Forming patterns in metallic or ceramic substrates
EP0267807A3 (en) Improved photosensitive laminate
KR20020075305A (en) Method for producing multilayer ceramic substrate
JP3351043B2 (en) Method for manufacturing multilayer ceramic substrate
EP0938107A3 (en) Method for manufacturing electronic parts and apparatus for manufacturing thin films
EP0402811A3 (en) Method of manufacturing printed circuit boards

Legal Events

Date Code Title Description
EEER Examination request
MKLA Lapsed