CA2065631C - Optic sensor designed to supply information representative of the state of a surface - Google Patents
Optic sensor designed to supply information representative of the state of a surface Download PDFInfo
- Publication number
- CA2065631C CA2065631C CA 2065631 CA2065631A CA2065631C CA 2065631 C CA2065631 C CA 2065631C CA 2065631 CA2065631 CA 2065631 CA 2065631 A CA2065631 A CA 2065631A CA 2065631 C CA2065631 C CA 2065631C
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- Prior art keywords
- optic
- microguides
- sensor according
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- 239000000758 substrate Substances 0.000 claims abstract description 18
- 239000000835 fiber Substances 0.000 claims description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- 239000002245 particle Substances 0.000 claims 1
- 230000005693 optoelectronics Effects 0.000 abstract 1
- 239000011521 glass Substances 0.000 description 5
- 238000001514 detection method Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000009434 installation Methods 0.000 description 3
- 238000003491 array Methods 0.000 description 2
- 239000011859 microparticle Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000002457 bidirectional effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000013480 data collection Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000005342 ion exchange Methods 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
- G01B11/303—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces using photoelectric detection means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/26—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
- G01D5/268—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light using optical fibres
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Optical Integrated Circuits (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Light Guides In General And Applications Therefor (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
Abstract
The opto-electronic device for supervision or examination of the surface of an object (1) comprises an optic head (3) with a bundle (7) of microguides achieved in a substrate (5), and terminating on a photodetector line array (15). The line array is connected to an electronic device (19,22,23,24) for processing and display of the light information transmitted by the optic head (3) and representative of the surface state of the object (1).
Description
~~~~J~~.~
OPTIC SENSOR DESIGNED TO SUPPLY INFORMATION REPRESENTATIVE OF
THE STATE OF A SURFACE
BACKGROUND OF THE INVENTION
The present invention relates to an optic sensor designed to supply information, either visual or not, representative of the state existing on at least a defined portion of the surface of an object.
To supervise the state of the surface of an object, for example to check the surface condition of a pipe manufactured and running continuously, it is at present necessary to position a sufficient number of optic cameras around the pipe to be able to cover the whole circular cross-section. A minimum of three optic cameras are required placed 120 degrees with respect to one another, but this number may be more than three if a very good definition is required, in which case high-precision cameras have to be used, comprising an extremely carefully designed and sophisticated lens system. Although state-of-the-art devices give satisfactory technical results, they have the drawbacks of being extremely heavy, complex, and therefore costly, and of often being excessively space-consuming.
The drawbacks exist for most devices, industrial or not, which make use of optic representation of the existing state at a set point of the surface of an object. For example, to align a large microelectronics mask with the layer it has to cover with very great precision, for manufacture of semi-conductor integrated circuits, four high-definition optic cameras can be used, which is naturally also very heavy in terms of both cost price and space requirements.
OPTIC SENSOR DESIGNED TO SUPPLY INFORMATION REPRESENTATIVE OF
THE STATE OF A SURFACE
BACKGROUND OF THE INVENTION
The present invention relates to an optic sensor designed to supply information, either visual or not, representative of the state existing on at least a defined portion of the surface of an object.
To supervise the state of the surface of an object, for example to check the surface condition of a pipe manufactured and running continuously, it is at present necessary to position a sufficient number of optic cameras around the pipe to be able to cover the whole circular cross-section. A minimum of three optic cameras are required placed 120 degrees with respect to one another, but this number may be more than three if a very good definition is required, in which case high-precision cameras have to be used, comprising an extremely carefully designed and sophisticated lens system. Although state-of-the-art devices give satisfactory technical results, they have the drawbacks of being extremely heavy, complex, and therefore costly, and of often being excessively space-consuming.
The drawbacks exist for most devices, industrial or not, which make use of optic representation of the existing state at a set point of the surface of an object. For example, to align a large microelectronics mask with the layer it has to cover with very great precision, for manufacture of semi-conductor integrated circuits, four high-definition optic cameras can be used, which is naturally also very heavy in terms of both cost price and space requirements.
SUMMARY OF THE INVENTION
The object of the present invention is to overcome these drawbacks. It is based for this. purpose on an optic sensor capable of supplying information representative of the state existing on at least a defined portion of the surface of an object, the sensor comprising at least one optic head comprising optic microguides achieved in a substrate, a substrate edge, which bears the departure points of the microguides, having a shape in correlation with the portion of object surface to be examined, whereas the arrival points of the microguides converge on a photodetector line array, the photodetector line array being connected to an electronic processing unit.
BRIEF DESCRIPTION OF THE DRAWINGS
The invention will be better understood and its advantages and other features will become more clearly apparent from the following description of several.non-restrictive examples of embodiment and use of the optic sensor, referring to the accompanying schematic drawings, in which Figure 1 is a schematic diagram of an optic supervision installation of the surface state of a continuously running tube, the installation using two optic sensors according to the invention;
Figure 2 shows an alternative embodiment of the sensor used for the installation in figure 1;
Figure 3 shows an application of the invention to alignment of plates, in particular masks for manufacture of semi-conductor integrated circuits;
Figure 4 likewise illustrates the application of the invention ~'~r3~~~
The object of the present invention is to overcome these drawbacks. It is based for this. purpose on an optic sensor capable of supplying information representative of the state existing on at least a defined portion of the surface of an object, the sensor comprising at least one optic head comprising optic microguides achieved in a substrate, a substrate edge, which bears the departure points of the microguides, having a shape in correlation with the portion of object surface to be examined, whereas the arrival points of the microguides converge on a photodetector line array, the photodetector line array being connected to an electronic processing unit.
BRIEF DESCRIPTION OF THE DRAWINGS
The invention will be better understood and its advantages and other features will become more clearly apparent from the following description of several.non-restrictive examples of embodiment and use of the optic sensor, referring to the accompanying schematic drawings, in which Figure 1 is a schematic diagram of an optic supervision installation of the surface state of a continuously running tube, the installation using two optic sensors according to the invention;
Figure 2 shows an alternative embodiment of the sensor used for the installation in figure 1;
Figure 3 shows an application of the invention to alignment of plates, in particular masks for manufacture of semi-conductor integrated circuits;
Figure 4 likewise illustrates the application of the invention ~'~r3~~~
to centering of a cylindrical part;
Figure 5 shows how the invention is applicable to optic examination of the surface state of a drilled hole, either cylindrical or not; and Figure 6 shows an application of the invention to supervision of manufacture of plates whose edge has a predetermined crooked shape.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
Referring to figure l, reference 1 designates a tube or pipe, seen in transverse section, which is manufactured continuously in a conventional manner and whose surface state is to be checked.
For this purpose two adjoined optic heads 2 and 3 are used, each made up of a substrate formed for example by a glass plate, respectively 4 and 5, on the surface of which a bundle of light microguides, respectively 6 and 7, is fitted. The microguides can be achieved by any suitable integrated optic technology, for example by ion exchange, by layers deposited on silicon, by doping on lithium niobate, or by diffusion. To give an indication, the thickness of the substrate may be about one millimeter.
Each of these bundles starts off from a semi-circular portion 8, 9 of a first edge 10, 11 of the corresponding substrate 4, 5, and ends on the opposite edge 12, 13 on a conventional photo-detector line array, respectively 14 and 15. Such a line array comprises a set of photodetectors electronically tested by scanning or by multiplexing. According to a preferred embodiment, CCD line arrays tested by electronic scanning are used.
~f~~~~~~5~_ By building up the microguide bundles 6, 7. each of the microguides terminates on at least one associated photodetector point of the corresponding line array, which can currently be achieved (with accuracy) by photolithography processes, each line array 14, 15 being fixed to the corresponding edge 12, 13 of the substrate 4, 5 which is associated with it.
The tube 1 being uniformally lighted by an external device (conventional, not shown), each microguide of the bundle 6, 7 transmits to the photodetector points of the line array 14, 15 which are associated with it a light intensity level which is representative of the reflectivity, and therefore of the surface state and shape of the small element of the tube 1 which is situated opposite the departure end (located on the above-mentioned semi-circular portion 8, 9) of this microguide.
Each line array 14 and 15 has associated with it in conventional manner an electrical connector, respectively 16 and 17, electrically connected to a printed circuit board 18, 19 performing scanning control, power supply, and data collection and shaping, the board and connector normally being supplied by the manufacturer.
The data is transmitted via bidirectional links 20 and 21 to a central processing unit 22, for example microprocessor-based, which may be connected to display means, formed for example by a screen 23 and/or alphanumeric readout 24.
The characteristics of a standard tube in good condition having been previously recorded in a memory of the microprocessor contained in the processing unit 22, any surface defect of the tube 1, which runs continuously through the circle 8, 9 formed by abutment of the two edges 10, 11 of the substrates 4 and 5, will be detected by the microguide(s) located opposite it and will be able, by comparison, to be displayed, at least as far as ~~~i~~~~~
position is concerned, on the display means 23 and/or 24.
In the embodiment which has just been described, the line array and its associated connector and board are quite close to the optic head and the object it'is checking. This may be inconvenient in some cases, and in this respect figure 2 shows an alternative embodiment wherein the photodetector line array is located farther away by means of a flat optic fiber connector.
As can be seen in figure 2, each optic head with microguides, such as head 5 in figure 1, is separated into two substrates 5' and 5", each bearing a bundle of microguides, respectively bundle 7' and bundle 7" each comprising the same number n of microguides.
These two substrates 5' and 5" are made up of n optic fibers placed between the departure edge 13' of substrate 5' and the departure edge 11" of substrate 5".
As can be seen in the drawing, the bundle 7' connects the n light-sensing points located on the semi-circle 9 to the departure ends of the n corresponding optic fibers 25, whereas the bundle 7" connects the n downstream ends of these n optic fibers 25 to the n photodetectors of line array 15.
The bundles ?' and 7" have a suitable shape enabling them to be connected to the connecting optic fibers 25. The diameter and spacing of the optic fibers is generally much greater than the distance between the microguides at their connection with the line array or on the detection section 9. The bundles 7' and 7"
therefore have a diverging shape in the direction of the connecting optic fibers 25. An optic result is finally obtained equivalent to that of the circuit according to figure 1, with an offset location of the electronic processing part formed by the photodetector line array and the associated printed circuit board.
Figure 3 shows an application of the invention to precise positioning of a plate 26, which may for example be an integrated circuit manufacturing mask, with respect to a fixed guide mark formed here by four crosses 27A to 27D.
To achieve this kind of alignment, four linear optic heads 28A
to 28D with microguides are used, all the microguides being identical, similar to those described above, and naturally each associated with a photodetector line array (not shown).
Each of the optic heads is positioned in a judiciously chosen, well-defined manner, for example as represented in the drawing, above the cross, respectively 27A to 27D, which corresponds to it. Each of these crosses therefore corresponds, on the optic head which is associated with it, to a well-determined graduation (and therefore to a microguide) of this optic head.
As each edge of the plate 26 also gives, when the plate is slid under the optic heads 28A to 28D, an optic indication which corresponds to the corresponding graduation of each head, it can easily be understood that the plate will be correctly centered when the distances between the graduations recorded by the line arrays 28A, 28C and respectively 28B, 28D are identical. A very precise alignment is thus obtained at low cost.
The same kind of device is applicable, as is shown in figure 4, to centering of the axis O of a cylindrical part 29, for example a tubular part, with respect to a set point C. Three linear optic heads 30A to 30C with microguides are then used, positioned as shown, for example 120 degrees from one another and all three directed towards the point C, at a distance therefrom appreciably equal to the radius R of the straight cross-section of the circular cylindrical part 29 (assumed to be seen from the end in the drawing). Centering will then be achieved when the graduations (each given by the circular edge of the part 29) of the three heads,30A to 30C are equal.
It should be noted that the device is of appreciable flexibility, since it is independent from the radius R of the part 29 to be centered : for a more or less large radius, the three optic heads 30A to 30C merely have to be moved closer or farther away.
Another application of the invention is represented in schematic farm in figure 5. This then involves inspecting the surface condition of a drilled hole 31, cylindrical or not, and closed or not. For this an optic head with microguides 32 is used, built on the same principle as before, but whose glass substrate 33 has an elongated flat shape, of smaller transverse dimensions than those of the hole 31. The departure terminations 34 of the microguides 35 are then regularly distributed over the two side edges 36, 37 of the elongated glass plate 33.
In order to illuminate the inside of the hole 31, one microguide 35 out of two can be supplied with lighting intensity for illumination, and is therefore not used for optic sensing (a system not represented in figure 5). It should naturally be noted that the alternate "lighting microguide - optic detection microguide" arrangement of the bundle can also be used in all the embodiments described hitherto. In a general manner, some of the microguides of the bundle can be assigned to lighting of the surface to be examined whereas the others are assigned to detection.
Finally, figure 6 shows the use of an optic sensing head, comprising an appreciably rectangular glass plate 38 with a bundle of microguides 39, for supervision of the predefined profile 41 of the edge of a part 40 manufactured in large or small series. In this case, the information transmitted by the microguides is compared to reference information, corresponding to the profile, stored in the central processing unit memory.
It should be noted that to execute certain embodiments according to the invention, the departure edge of the glass substrate which contains the departure microguide terminations, i.e. the sensing points of the optic head which forms part of the present invention, should be cut and polished. Advantageously, cutting can be achieved by a water jet charged with abrasive micro-particles, for example diamond microparticles . a clean, well-polished edge is thus obtained, which may notably be curved.
The invention is in no way limited to the particular embodiments which have just been described. Quite on the contrary, other alternative embodiments and forms of execution are envisageable, within the scope of similar or different applications. Micro-guides can, for example, be formed on the top and bottom faces of a sensing head substrate, the microguides of one of the faces being assigned to lighting the surface to be examined and the microguides of the other face being assigned to detection.
Figure 5 shows how the invention is applicable to optic examination of the surface state of a drilled hole, either cylindrical or not; and Figure 6 shows an application of the invention to supervision of manufacture of plates whose edge has a predetermined crooked shape.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
Referring to figure l, reference 1 designates a tube or pipe, seen in transverse section, which is manufactured continuously in a conventional manner and whose surface state is to be checked.
For this purpose two adjoined optic heads 2 and 3 are used, each made up of a substrate formed for example by a glass plate, respectively 4 and 5, on the surface of which a bundle of light microguides, respectively 6 and 7, is fitted. The microguides can be achieved by any suitable integrated optic technology, for example by ion exchange, by layers deposited on silicon, by doping on lithium niobate, or by diffusion. To give an indication, the thickness of the substrate may be about one millimeter.
Each of these bundles starts off from a semi-circular portion 8, 9 of a first edge 10, 11 of the corresponding substrate 4, 5, and ends on the opposite edge 12, 13 on a conventional photo-detector line array, respectively 14 and 15. Such a line array comprises a set of photodetectors electronically tested by scanning or by multiplexing. According to a preferred embodiment, CCD line arrays tested by electronic scanning are used.
~f~~~~~~5~_ By building up the microguide bundles 6, 7. each of the microguides terminates on at least one associated photodetector point of the corresponding line array, which can currently be achieved (with accuracy) by photolithography processes, each line array 14, 15 being fixed to the corresponding edge 12, 13 of the substrate 4, 5 which is associated with it.
The tube 1 being uniformally lighted by an external device (conventional, not shown), each microguide of the bundle 6, 7 transmits to the photodetector points of the line array 14, 15 which are associated with it a light intensity level which is representative of the reflectivity, and therefore of the surface state and shape of the small element of the tube 1 which is situated opposite the departure end (located on the above-mentioned semi-circular portion 8, 9) of this microguide.
Each line array 14 and 15 has associated with it in conventional manner an electrical connector, respectively 16 and 17, electrically connected to a printed circuit board 18, 19 performing scanning control, power supply, and data collection and shaping, the board and connector normally being supplied by the manufacturer.
The data is transmitted via bidirectional links 20 and 21 to a central processing unit 22, for example microprocessor-based, which may be connected to display means, formed for example by a screen 23 and/or alphanumeric readout 24.
The characteristics of a standard tube in good condition having been previously recorded in a memory of the microprocessor contained in the processing unit 22, any surface defect of the tube 1, which runs continuously through the circle 8, 9 formed by abutment of the two edges 10, 11 of the substrates 4 and 5, will be detected by the microguide(s) located opposite it and will be able, by comparison, to be displayed, at least as far as ~~~i~~~~~
position is concerned, on the display means 23 and/or 24.
In the embodiment which has just been described, the line array and its associated connector and board are quite close to the optic head and the object it'is checking. This may be inconvenient in some cases, and in this respect figure 2 shows an alternative embodiment wherein the photodetector line array is located farther away by means of a flat optic fiber connector.
As can be seen in figure 2, each optic head with microguides, such as head 5 in figure 1, is separated into two substrates 5' and 5", each bearing a bundle of microguides, respectively bundle 7' and bundle 7" each comprising the same number n of microguides.
These two substrates 5' and 5" are made up of n optic fibers placed between the departure edge 13' of substrate 5' and the departure edge 11" of substrate 5".
As can be seen in the drawing, the bundle 7' connects the n light-sensing points located on the semi-circle 9 to the departure ends of the n corresponding optic fibers 25, whereas the bundle 7" connects the n downstream ends of these n optic fibers 25 to the n photodetectors of line array 15.
The bundles ?' and 7" have a suitable shape enabling them to be connected to the connecting optic fibers 25. The diameter and spacing of the optic fibers is generally much greater than the distance between the microguides at their connection with the line array or on the detection section 9. The bundles 7' and 7"
therefore have a diverging shape in the direction of the connecting optic fibers 25. An optic result is finally obtained equivalent to that of the circuit according to figure 1, with an offset location of the electronic processing part formed by the photodetector line array and the associated printed circuit board.
Figure 3 shows an application of the invention to precise positioning of a plate 26, which may for example be an integrated circuit manufacturing mask, with respect to a fixed guide mark formed here by four crosses 27A to 27D.
To achieve this kind of alignment, four linear optic heads 28A
to 28D with microguides are used, all the microguides being identical, similar to those described above, and naturally each associated with a photodetector line array (not shown).
Each of the optic heads is positioned in a judiciously chosen, well-defined manner, for example as represented in the drawing, above the cross, respectively 27A to 27D, which corresponds to it. Each of these crosses therefore corresponds, on the optic head which is associated with it, to a well-determined graduation (and therefore to a microguide) of this optic head.
As each edge of the plate 26 also gives, when the plate is slid under the optic heads 28A to 28D, an optic indication which corresponds to the corresponding graduation of each head, it can easily be understood that the plate will be correctly centered when the distances between the graduations recorded by the line arrays 28A, 28C and respectively 28B, 28D are identical. A very precise alignment is thus obtained at low cost.
The same kind of device is applicable, as is shown in figure 4, to centering of the axis O of a cylindrical part 29, for example a tubular part, with respect to a set point C. Three linear optic heads 30A to 30C with microguides are then used, positioned as shown, for example 120 degrees from one another and all three directed towards the point C, at a distance therefrom appreciably equal to the radius R of the straight cross-section of the circular cylindrical part 29 (assumed to be seen from the end in the drawing). Centering will then be achieved when the graduations (each given by the circular edge of the part 29) of the three heads,30A to 30C are equal.
It should be noted that the device is of appreciable flexibility, since it is independent from the radius R of the part 29 to be centered : for a more or less large radius, the three optic heads 30A to 30C merely have to be moved closer or farther away.
Another application of the invention is represented in schematic farm in figure 5. This then involves inspecting the surface condition of a drilled hole 31, cylindrical or not, and closed or not. For this an optic head with microguides 32 is used, built on the same principle as before, but whose glass substrate 33 has an elongated flat shape, of smaller transverse dimensions than those of the hole 31. The departure terminations 34 of the microguides 35 are then regularly distributed over the two side edges 36, 37 of the elongated glass plate 33.
In order to illuminate the inside of the hole 31, one microguide 35 out of two can be supplied with lighting intensity for illumination, and is therefore not used for optic sensing (a system not represented in figure 5). It should naturally be noted that the alternate "lighting microguide - optic detection microguide" arrangement of the bundle can also be used in all the embodiments described hitherto. In a general manner, some of the microguides of the bundle can be assigned to lighting of the surface to be examined whereas the others are assigned to detection.
Finally, figure 6 shows the use of an optic sensing head, comprising an appreciably rectangular glass plate 38 with a bundle of microguides 39, for supervision of the predefined profile 41 of the edge of a part 40 manufactured in large or small series. In this case, the information transmitted by the microguides is compared to reference information, corresponding to the profile, stored in the central processing unit memory.
It should be noted that to execute certain embodiments according to the invention, the departure edge of the glass substrate which contains the departure microguide terminations, i.e. the sensing points of the optic head which forms part of the present invention, should be cut and polished. Advantageously, cutting can be achieved by a water jet charged with abrasive micro-particles, for example diamond microparticles . a clean, well-polished edge is thus obtained, which may notably be curved.
The invention is in no way limited to the particular embodiments which have just been described. Quite on the contrary, other alternative embodiments and forms of execution are envisageable, within the scope of similar or different applications. Micro-guides can, for example, be formed on the top and bottom faces of a sensing head substrate, the microguides of one of the faces being assigned to lighting the surface to be examined and the microguides of the other face being assigned to detection.
Claims (8)
1. An optic sensor designed to supply information representative of the state existing on at least a defined portion of the surface of an object (1,26,29,31,41), characterized in that it comprises at least one optic head comprising optic microguides (6,7,35,39) achieved in a substrate, a substrate edge (8,9), which bears the departure points of the microguides (6,7), having a shape in correlation with the portion of object surface (1) to be examined, whereas the arrival points of the micro-guides (6,7) converge on a photodetector line array (14,15), the photodetector line array being connected to an electronic processing unit (18 to 24).
2. The optic sensor according to claim 1, characterized in that the optic head with microguides is split into two parts (5',5") located away from one another and each comprising a bundle (7',7") of microguides, two bundles (7',7") of microguides being connected together by a corresponding number of optic fibers (25), and having a suitable shape to be able to achieve their abutment to the bundle of connecting optic fibers (25).
3. The sensor according to claim 1, applied to alignment of a plate (26) with respect to fixed guide marks (27A to 27D), characterized in that it comprises at least one optic head with microguides (28A to 28D), associated with each guide mark (27A
to 27D) and able to supply a first fixed indication relative to the position of the guide mark and another variable indication relative to the position of the corresponding edge of the plate (26).
to 27D) and able to supply a first fixed indication relative to the position of the guide mark and another variable indication relative to the position of the corresponding edge of the plate (26).
4. The sensor according to claim 1, applied to centering of a part (29), characterized in that it comprises several optic heads with microguides (30A to 30B) directed towards the required centering point (C), and placed in such a way as to be at the height of the edge of the part to be centered (29), so as to each provide an indication representative of its position with respect to the edge.
5. The sensor according to claim 1, applied to examination of the surface state of a drilled hole (31), characterized in that the optic head with microguides (32) has an elongated shape enabling it to be inserted in the drilled hole (31).
6. The sensor according to claim 1, characterized in that certain microguides of the optic head are connected to a light source so as to illuminate a portion of the surface to be examined.
7. The sensor according to claim 6, characterized in that one microguide out of two is connected to said light source.
8. The sensor according to claim 1, characterized in that the substrate of the optic head with microguides is at least partly cut by a water jet charged with abrasive particles.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR9105036A FR2675574B1 (en) | 1991-04-22 | 1991-04-22 | OPTICAL PICKUP DEVICE CAPABLE OF PROVIDING REPRESENTATIVE INFORMATION OF A SURFACE CONDITION. |
| FR9105036 | 1991-04-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2065631A1 CA2065631A1 (en) | 1992-10-23 |
| CA2065631C true CA2065631C (en) | 2002-08-13 |
Family
ID=9412191
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA 2065631 Expired - Lifetime CA2065631C (en) | 1991-04-22 | 1992-04-09 | Optic sensor designed to supply information representative of the state of a surface |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP0511122B1 (en) |
| JP (1) | JP3270104B2 (en) |
| CA (1) | CA2065631C (en) |
| DE (1) | DE69205483T2 (en) |
| FR (1) | FR2675574B1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4322173C1 (en) * | 1993-07-03 | 1994-08-04 | Fraunhofer Ges Forschung | Scanning system for scanning surface of cavity esp. bore using light beam |
| CN114113082B (en) * | 2021-11-10 | 2023-12-26 | 广西科技大学 | Raw silk electronic detection method based on machine vision |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AT270268B (en) * | 1966-08-17 | 1969-04-25 | Schneider Co Optische Werke | Fiber-optic analog-to-digital converter |
| JPS6121192Y2 (en) * | 1980-09-02 | 1986-06-25 | ||
| ATE72903T1 (en) * | 1985-12-05 | 1992-03-15 | Strauss Levi & Co | HIGH RESOLUTION OPTICAL FIBER ARRAY AND OBJECT POSITIONING SYSTEM. |
| DD252236A1 (en) * | 1986-09-01 | 1987-12-09 | Zeiss Jena Veb Carl | ARRANGEMENT FOR ROUGH TESTING ACCORDING TO THE SPREADING METHOD |
| US4958932A (en) * | 1988-08-18 | 1990-09-25 | Mcdonnell Douglas Corporation | Optical measuring apparatus |
-
1991
- 1991-04-22 FR FR9105036A patent/FR2675574B1/en not_active Expired - Fee Related
-
1992
- 1992-04-07 EP EP19920420108 patent/EP0511122B1/en not_active Expired - Lifetime
- 1992-04-07 DE DE1992605483 patent/DE69205483T2/en not_active Expired - Fee Related
- 1992-04-09 CA CA 2065631 patent/CA2065631C/en not_active Expired - Lifetime
- 1992-04-21 JP JP10114592A patent/JP3270104B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| FR2675574A1 (en) | 1992-10-23 |
| DE69205483T2 (en) | 1996-05-09 |
| CA2065631A1 (en) | 1992-10-23 |
| FR2675574B1 (en) | 1994-10-07 |
| EP0511122A1 (en) | 1992-10-28 |
| JP3270104B2 (en) | 2002-04-02 |
| EP0511122B1 (en) | 1995-10-18 |
| JPH05172551A (en) | 1993-07-09 |
| DE69205483D1 (en) | 1995-11-23 |
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| Date | Code | Title | Description |
|---|---|---|---|
| EEER | Examination request | ||
| MKEX | Expiry |