CA2052034A1 - Us transducer for air and gas flow measurement and a method for the manufacture thereof - Google Patents
Us transducer for air and gas flow measurement and a method for the manufacture thereofInfo
- Publication number
- CA2052034A1 CA2052034A1 CA 2052034 CA2052034A CA2052034A1 CA 2052034 A1 CA2052034 A1 CA 2052034A1 CA 2052034 CA2052034 CA 2052034 CA 2052034 A CA2052034 A CA 2052034A CA 2052034 A1 CA2052034 A1 CA 2052034A1
- Authority
- CA
- Canada
- Prior art keywords
- adapter
- core
- transducer
- mold
- damping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000000034 method Methods 0.000 title claims description 21
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 238000005259 measurement Methods 0.000 title abstract description 5
- 238000013016 damping Methods 0.000 claims abstract description 39
- 239000000463 material Substances 0.000 claims abstract description 32
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 14
- 238000005476 soldering Methods 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000003825 pressing Methods 0.000 claims 1
- 238000005266 casting Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000011324 bead Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
- G01F1/66—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by measuring frequency, phase shift or propagation time of electromagnetic or other waves, e.g. using ultrasonic flowmeters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0644—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element
- B06B1/0662—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface
- B06B1/0681—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface and a damping structure
- B06B1/0685—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface and a damping structure on the back only of piezoelectric elements
-
- G—PHYSICS
- G10—MUSICAL INSTRUMENTS; ACOUSTICS
- G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
- G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
- G10K11/02—Mechanical acoustic impedances; Impedance matching, e.g. by horns; Acoustic resonators
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Electromagnetism (AREA)
- Fluid Mechanics (AREA)
- General Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Multimedia (AREA)
- Mechanical Engineering (AREA)
- Measuring Volume Flow (AREA)
- Transducers For Ultrasonic Waves (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
ABSTRACT OF THE DISCLOSURE
A US transducer for air and gas flow measurement has a cast transducer core formed of a castable damping material which is placed into a core mold. The transducer core is formed of a piezoceramic wafer whose thickness is partially exposed at one side of a damping member, and is composed of the damping member in which the piezoceramic wafer is partially enclosed with leads that can be guided toward the outside. The transducer core is enveloped with a castable adapter material in a bipartite mold for the formation of an adapter and assembly member.
A US transducer for air and gas flow measurement has a cast transducer core formed of a castable damping material which is placed into a core mold. The transducer core is formed of a piezoceramic wafer whose thickness is partially exposed at one side of a damping member, and is composed of the damping member in which the piezoceramic wafer is partially enclosed with leads that can be guided toward the outside. The transducer core is enveloped with a castable adapter material in a bipartite mold for the formation of an adapter and assembly member.
Description
20~2~3~
BACKGROUND OF THE INVENTION
The present invention is directed to a US transducer, particularly for air and gas flow measurement, and is also directed to a method for the manufacture thereof.
Methods for the manufacture of such US transducers that have been hitherto disclosed are cost-intensive and time-consuming in view of the number of manufacturing steps and/or the expense of manufacturing equipment.
In view of the constantly increasing need for cost-beneficial US transducers, there is the desire to create a method for the manufacture of such US transducers which makes fewer demands both of the time expenditure as well as of the apparatus expense for the manufacturing process, and thus offers the possibility of manufacturing cost-beneficial US transducers.
~UMMARY OF T~E INVENTION
An object of the invention is to specify a method for manufacturing a US transducer for sound emission and for sound reception, for example for air and gas flow measurement, with which US transducers of the type initially cited can be reliably manufactured with low time expenditure and/or apparatus expense.
For achieving this object, a method for manufacturing a US
transducer for air and gas flow measurement is proposed which is inventively characterized in that steps are provided for casting a transducer core composed of a castable damping material in a core mold or shape. The transducer core is composed of a piezoceramic wafer which has its thickness partially exposed at one side of a damping member and is composed of the dampingl member. The piezoceramic wafer is partially connected with leads which can be conducted toward the outside. The transducer core is enveloped 2a~2~3~
with a castable adapter material in a bipartite f~rm for the formation of an adapter and assembly member.
BRIEF DESCRIPTION OF TNE_DRAWING~
Figures lA, lB, and lC schematically show the steps required for the manufacture of a transducer core;
Figure 2 shows a schematic sectional view from which a step for enveloping the transducer core manufactured according to Figure 1 with a castable adapter material A in a bipartite mold proceeds;
Figure 3 shows a schematic illustration of a procedure for enveloping the transducer core manufactured according to Figure 1 with an evaluatable adapter material according to a second exemplary embodiment;
Figure 4 shows a schematic sectional view of a transducer core having a pot of adapter material surrounding it, whereby anti-twist terminal pins are provided which are conducted radially out of the transducer core from a piezoceramic wafer;
Figure 5 shows a schematic sectional view of a transducer core which is provided with a pot of adapter material, whereby connector plugs for the piezoceramic wafer of the transducer which are aligned parallel to the rotational axis of the structure are provided in the transducer core;
Figure 6 shows a schematic sectional view with a corresponding bottom view of an exemplary embodiment of a transducer core having a channel for the anti-twist protection thereof;
Figure 7 shows a further exemplary embodiment of the transducer core manufactured in accordance with Ithe invention, whereby a rubber ring for holding the transducer core is introduced into a channel;
20~2~3~
Figure 8 shows another exemplary embodiment of an inventively manufactured transducer core, whereby a bead 10 for decoupling structure-borne noise having an edge enlargement 11 for holding the damping member connected thereto is designed at a collar of the damping member; and Figure 9 schematically shows the various manufacturing steps of the invention for manufacturing a US transducer and sho~s a schematic, sectional view of the overall structure of a US
transducer manufactured with these steps which can be utilized as a gas counter.
DE8CRIPTION OF THE PREFERRED EMBODIMEN~8 As already stated, Figure 1 schematically shows the steps required for the inventive manufacture of a transducer core. For casting a transducer core, the piezoceramic wafer 1 provided with leads (not shown) that can be conducted toward the outside is placed into a core mold Fl for the formation of the transducer core 1/2. This core mold Fl has a recess F11 intended for the acceptance of the piezoceramic wafer 1. Damping material D is subsequently cast into the core mold F1. The core mold F1 is designed such that the damping member 2 is designed with a collar 2a at its side facing away from the piezoceramic wafer 1~ The finished transducer core 1/2 removed from the core mold F1 has its collar 2a introduced into a recess F2a of a first shaped part F2 of a mold F2/F3 for the formation of an adapter and assembly member 3, see Figure 2. A second shaped part F3 of the mold F2/F3 is introduced into the first shaped part F2 for forming an adapter and assembly member 3 such that the collar 2a of the ~ransducer core 1/2 is at least partially enclosed by, first, the first shaped part F2 and, second, by the second shaped part F3. Subsequently, an adapter material A is injected into the mold F2/F3 formed by the 20~2~3~
first shaped part F2 and by the second shaped part F3 for the formation of the adapter and assembly member 3. This is undertaken in order to design the adapter and assembly member 3 so that it completely surrounds the transducer core 1/2, except for an exposed part of the collar 2a.
A further, preferred method conforming to an exemplary embodiment of the invention provides that the piezoceramic wafer 1 provided with leads (not shown) that can be conducted toward the outside is placed into the core mold F1 for the formation of the transducer core 1/2, this core mold Fl comprising a recess F11 intended for the acceptance of the piezoceramic wafer 1.
Subsequently, damping material D is cast into the core mold Fl.
The core mold F1 is designed such that the damping member 2 has a collar 2a at its side facing away from the piezoceramic wafer 1.
The finished transducer core 1/2 removed from the core mold F1 has its collar 2a introduced into a recess F2a of a first shaped part F2 of a mold F2/F3 for the formation of the adapter and assembly member 3. For the formation of the adapter and assembly member 3, a second shaped part F3 of the mold F2/F3 having an upwardly directed opening F3a which accepts the transducer core is partially filled with adapter material. Subsequently, the first shaped part F2 together with the transducer core 1/2 directed down toward the opening F3a of the second shaped part F3 is pressed into the opening F3a of the second shaped part F3 until the two shaped parts F2/F3 enter into engagement with one another. Thus, the adapter material contained in the second shaped part F3 is displaced and ascends around the entering transducer core 1/2 to form the adapter and assembly member 3 (see Figure 3).
The aforementioned leads la, lb are preferably connected by soft soldering to terminal pins 5a, 5b. These terminal pins 5a, 5b are enclosed in the damping member 3 such that they preferably .' 2 0 ~ 2 ~ 3 !~
radially project toward the outside from the collar 2a in an anti-twist fashion (see Figure ~).
According to another embodiment of the invention, the leads la, lb, which are preferably connected by soft soldering to terminal plug pins 6a, 6b are held at a connector plug socket 6 where they can be connected to. The connector plug socket is enclosed in the damping member 2 when the damping member 2 is cast such that the terminal plug pins 6a, 6b are aligned parallel to the rotational axis of the transducer core 1/2 and are integrated in the damping member 2 projecting from the side thereof facing away from the piezoceramic wafer 1. The collar 2 is preferably designed with a channel 7 for anti-twist protection (see Figures 5 and 6).
According to another embodiment of the invention, a step can be provided for designing the adapter and assembly member 3 with an annular channel 8 for the acceptance of a rubber ring 9 for holding the adapter and assembly member 3 ~Figure 7).
The adapter and assembly member 3 can be designed as a hollow cylinder closed at its ends; however, it can also be expedient for assembly reasons that the end closing the hollow cylinder is designed in the shape of a truncated cone.
It can be advantageously provided according to another embodiment of the invention that the collar 2a is designed with a ridge 10 for decoupling structure-borne noise and i8 provided with an edge enlargement 11 for holding the damping member 2.
Although various minor changes and modifications might be proposed by those skilled in the art, it will be understood that we wish to include within the claims of the patent warranted hereon all such changes and modifications as reasonably come within our contribution to the art.
BACKGROUND OF THE INVENTION
The present invention is directed to a US transducer, particularly for air and gas flow measurement, and is also directed to a method for the manufacture thereof.
Methods for the manufacture of such US transducers that have been hitherto disclosed are cost-intensive and time-consuming in view of the number of manufacturing steps and/or the expense of manufacturing equipment.
In view of the constantly increasing need for cost-beneficial US transducers, there is the desire to create a method for the manufacture of such US transducers which makes fewer demands both of the time expenditure as well as of the apparatus expense for the manufacturing process, and thus offers the possibility of manufacturing cost-beneficial US transducers.
~UMMARY OF T~E INVENTION
An object of the invention is to specify a method for manufacturing a US transducer for sound emission and for sound reception, for example for air and gas flow measurement, with which US transducers of the type initially cited can be reliably manufactured with low time expenditure and/or apparatus expense.
For achieving this object, a method for manufacturing a US
transducer for air and gas flow measurement is proposed which is inventively characterized in that steps are provided for casting a transducer core composed of a castable damping material in a core mold or shape. The transducer core is composed of a piezoceramic wafer which has its thickness partially exposed at one side of a damping member and is composed of the dampingl member. The piezoceramic wafer is partially connected with leads which can be conducted toward the outside. The transducer core is enveloped 2a~2~3~
with a castable adapter material in a bipartite f~rm for the formation of an adapter and assembly member.
BRIEF DESCRIPTION OF TNE_DRAWING~
Figures lA, lB, and lC schematically show the steps required for the manufacture of a transducer core;
Figure 2 shows a schematic sectional view from which a step for enveloping the transducer core manufactured according to Figure 1 with a castable adapter material A in a bipartite mold proceeds;
Figure 3 shows a schematic illustration of a procedure for enveloping the transducer core manufactured according to Figure 1 with an evaluatable adapter material according to a second exemplary embodiment;
Figure 4 shows a schematic sectional view of a transducer core having a pot of adapter material surrounding it, whereby anti-twist terminal pins are provided which are conducted radially out of the transducer core from a piezoceramic wafer;
Figure 5 shows a schematic sectional view of a transducer core which is provided with a pot of adapter material, whereby connector plugs for the piezoceramic wafer of the transducer which are aligned parallel to the rotational axis of the structure are provided in the transducer core;
Figure 6 shows a schematic sectional view with a corresponding bottom view of an exemplary embodiment of a transducer core having a channel for the anti-twist protection thereof;
Figure 7 shows a further exemplary embodiment of the transducer core manufactured in accordance with Ithe invention, whereby a rubber ring for holding the transducer core is introduced into a channel;
20~2~3~
Figure 8 shows another exemplary embodiment of an inventively manufactured transducer core, whereby a bead 10 for decoupling structure-borne noise having an edge enlargement 11 for holding the damping member connected thereto is designed at a collar of the damping member; and Figure 9 schematically shows the various manufacturing steps of the invention for manufacturing a US transducer and sho~s a schematic, sectional view of the overall structure of a US
transducer manufactured with these steps which can be utilized as a gas counter.
DE8CRIPTION OF THE PREFERRED EMBODIMEN~8 As already stated, Figure 1 schematically shows the steps required for the inventive manufacture of a transducer core. For casting a transducer core, the piezoceramic wafer 1 provided with leads (not shown) that can be conducted toward the outside is placed into a core mold Fl for the formation of the transducer core 1/2. This core mold Fl has a recess F11 intended for the acceptance of the piezoceramic wafer 1. Damping material D is subsequently cast into the core mold F1. The core mold F1 is designed such that the damping member 2 is designed with a collar 2a at its side facing away from the piezoceramic wafer 1~ The finished transducer core 1/2 removed from the core mold F1 has its collar 2a introduced into a recess F2a of a first shaped part F2 of a mold F2/F3 for the formation of an adapter and assembly member 3, see Figure 2. A second shaped part F3 of the mold F2/F3 is introduced into the first shaped part F2 for forming an adapter and assembly member 3 such that the collar 2a of the ~ransducer core 1/2 is at least partially enclosed by, first, the first shaped part F2 and, second, by the second shaped part F3. Subsequently, an adapter material A is injected into the mold F2/F3 formed by the 20~2~3~
first shaped part F2 and by the second shaped part F3 for the formation of the adapter and assembly member 3. This is undertaken in order to design the adapter and assembly member 3 so that it completely surrounds the transducer core 1/2, except for an exposed part of the collar 2a.
A further, preferred method conforming to an exemplary embodiment of the invention provides that the piezoceramic wafer 1 provided with leads (not shown) that can be conducted toward the outside is placed into the core mold F1 for the formation of the transducer core 1/2, this core mold Fl comprising a recess F11 intended for the acceptance of the piezoceramic wafer 1.
Subsequently, damping material D is cast into the core mold Fl.
The core mold F1 is designed such that the damping member 2 has a collar 2a at its side facing away from the piezoceramic wafer 1.
The finished transducer core 1/2 removed from the core mold F1 has its collar 2a introduced into a recess F2a of a first shaped part F2 of a mold F2/F3 for the formation of the adapter and assembly member 3. For the formation of the adapter and assembly member 3, a second shaped part F3 of the mold F2/F3 having an upwardly directed opening F3a which accepts the transducer core is partially filled with adapter material. Subsequently, the first shaped part F2 together with the transducer core 1/2 directed down toward the opening F3a of the second shaped part F3 is pressed into the opening F3a of the second shaped part F3 until the two shaped parts F2/F3 enter into engagement with one another. Thus, the adapter material contained in the second shaped part F3 is displaced and ascends around the entering transducer core 1/2 to form the adapter and assembly member 3 (see Figure 3).
The aforementioned leads la, lb are preferably connected by soft soldering to terminal pins 5a, 5b. These terminal pins 5a, 5b are enclosed in the damping member 3 such that they preferably .' 2 0 ~ 2 ~ 3 !~
radially project toward the outside from the collar 2a in an anti-twist fashion (see Figure ~).
According to another embodiment of the invention, the leads la, lb, which are preferably connected by soft soldering to terminal plug pins 6a, 6b are held at a connector plug socket 6 where they can be connected to. The connector plug socket is enclosed in the damping member 2 when the damping member 2 is cast such that the terminal plug pins 6a, 6b are aligned parallel to the rotational axis of the transducer core 1/2 and are integrated in the damping member 2 projecting from the side thereof facing away from the piezoceramic wafer 1. The collar 2 is preferably designed with a channel 7 for anti-twist protection (see Figures 5 and 6).
According to another embodiment of the invention, a step can be provided for designing the adapter and assembly member 3 with an annular channel 8 for the acceptance of a rubber ring 9 for holding the adapter and assembly member 3 ~Figure 7).
The adapter and assembly member 3 can be designed as a hollow cylinder closed at its ends; however, it can also be expedient for assembly reasons that the end closing the hollow cylinder is designed in the shape of a truncated cone.
It can be advantageously provided according to another embodiment of the invention that the collar 2a is designed with a ridge 10 for decoupling structure-borne noise and i8 provided with an edge enlargement 11 for holding the damping member 2.
Although various minor changes and modifications might be proposed by those skilled in the art, it will be understood that we wish to include within the claims of the patent warranted hereon all such changes and modifications as reasonably come within our contribution to the art.
Claims (15)
1. A method for manufacturing a US
transducer, comprising the steps of:
providing a piezoceramic wafer and placing the piezoceramic wafer in a core mold together with respective leads, the piezoceramic wafer having a portion which is partially exposed at one side within the core mold;
introducing a castable damping material into the core mold to at least partially cover the exposed portion of the piezoceramic wafer at the one side;
removing the piezoceramic wafer with the casted damping material which together form a transducer core and introducing the transducer core into a bipartite mold for formation of an adapter and assembly member; and introducing a castable adapter material into the bipartite mold so that the adapter and assembly member is formed which envelopes the transducer core.
transducer, comprising the steps of:
providing a piezoceramic wafer and placing the piezoceramic wafer in a core mold together with respective leads, the piezoceramic wafer having a portion which is partially exposed at one side within the core mold;
introducing a castable damping material into the core mold to at least partially cover the exposed portion of the piezoceramic wafer at the one side;
removing the piezoceramic wafer with the casted damping material which together form a transducer core and introducing the transducer core into a bipartite mold for formation of an adapter and assembly member; and introducing a castable adapter material into the bipartite mold so that the adapter and assembly member is formed which envelopes the transducer core.
2. A method according to claim 1 wherein the castable adapter material covers an exposed side of the transducer core opposite said one side covered by the castable damping material.
3. A method according to claim 1 including the steps of:
said core mold having a recess which receives the piezoceramic wafer and its associated leads;
providing a collar in a damping member formed by the casted damping material at its side facing away from the piezoceramic wafer;
removing the finished transducer core from the core mold and introducing the collar into a recess of a first shaped part of said bipartite mold used for the formation of the adapter and assembly member;
providing the bipartite mold with a second shaped part which is introducible into the first shaped part with the collar of the transducer core being enclosed at least partly by the first shaped part and by the second shaped part; and injecting the adapter material into the bipartite mold for the formation of the adapter and assembly member by use of the first and second shaped parts so as to form the adapter and assembly member which completely envelopes the transducer core except for an exposed portion of the collar.
said core mold having a recess which receives the piezoceramic wafer and its associated leads;
providing a collar in a damping member formed by the casted damping material at its side facing away from the piezoceramic wafer;
removing the finished transducer core from the core mold and introducing the collar into a recess of a first shaped part of said bipartite mold used for the formation of the adapter and assembly member;
providing the bipartite mold with a second shaped part which is introducible into the first shaped part with the collar of the transducer core being enclosed at least partly by the first shaped part and by the second shaped part; and injecting the adapter material into the bipartite mold for the formation of the adapter and assembly member by use of the first and second shaped parts so as to form the adapter and assembly member which completely envelopes the transducer core except for an exposed portion of the collar.
4. A method according to claim 1 including the steps of:
providing said core mold with a recess for acceptance of the piezoceramic wafer when the wafer is placed in the core mold;
the core mold being shaped to provide a resulting damping member when the damping material is cast into the core mold with a collar at its side facing away from the piezoceramic wafer;
when the finished transducer core is removed from the core mold, introducing the collar into a recess of a first shaped part of the bipartite mold for the formation of the adapter and assembly member;
providing a second shaped part of the bipartite mold with an upwardly directed opening which accepts the transducer core and which is partially filled with said adapter material; and placing the transducer core in the first shaped part such that it is directed downward towards the opening of the second shaped part, and pressing the first shaped part into the opening of the second shaped part until the first and second shaped parts of the bipartite mold enter into engagement with one another such that the adapter material contained in the second shaped part is displaced and ascends around the entering transducer core so as to form the adapter and assembly member.
providing said core mold with a recess for acceptance of the piezoceramic wafer when the wafer is placed in the core mold;
the core mold being shaped to provide a resulting damping member when the damping material is cast into the core mold with a collar at its side facing away from the piezoceramic wafer;
when the finished transducer core is removed from the core mold, introducing the collar into a recess of a first shaped part of the bipartite mold for the formation of the adapter and assembly member;
providing a second shaped part of the bipartite mold with an upwardly directed opening which accepts the transducer core and which is partially filled with said adapter material; and placing the transducer core in the first shaped part such that it is directed downward towards the opening of the second shaped part, and pressing the first shaped part into the opening of the second shaped part until the first and second shaped parts of the bipartite mold enter into engagement with one another such that the adapter material contained in the second shaped part is displaced and ascends around the entering transducer core so as to form the adapter and assembly member.
5. A method according to claim 1 including the step of connecting the leads of the piezoceramic wafer to terminal pins which are enclosed in a damping member formed by the casted damping material such that they radially project from a collar of the damping member toward an outside.
6. A method according to claim 5 wherein the leads are connected to the terminal pins by soft soldering and the pins projecting from the collar toward the outside do so in an anti-twist manner.
7. A method according to claim 1 including the steps of providing terminal plug pins that are held by a connector plug socket enclosed within a damping member formed by the casted damping material such that the terminal plug pins are integrated in the damping member parallel to a rotational axis of the transducer core and project from the side facing away from the piezoceramic wafer, and connecting the leads of the piezoceramic wafer to the terminal plug pins.
8. A method according to claim 7 wherein the damping member is provided with a collar and the collar having a channel for anti-twist protection.
9. A method according to claim 1 including the step of providing the adapter and assembly member with an annular channel for acceptance of a rubber ring for holding the adapter and assembly member.
10. A method according to claim 1 including the step of providing the adapter and assembly member as a hollow cylinder closed at one of its ends.
11. A method according to claim 1 including the step of providing the adapter and assembly member as a hollow cylinder closed at its one end and wherein the end that closes the hollow cylinder is designed in a shape of a truncated cone.
12. A method according to claim 1 including the step of providing the damping member formed by the casted damping material with a collar having a peripheral ridge for decoupling structure-borne noise and an edge enlargement peripherally of the ridge for holding the damping member.
13. A method for manufacturing a US
transducer, comprising the steps of:
providing a piezoceramic wafer and placing the piezoceramic wafer in a seating recess in a core mold, the piezoceramic wafer having a portion which is partially exposed above the seating recess at one side within the core mold;
introducing a castable damping material into the core mold to at least partially cover the exposed portion of the piezoceramic wafer at the one side;
removing the piezoceramic wafer with the casted damping material which together form a transducer core and introducing the transducer core into a bipartite mold for formation of an adapter and assembly member; and introducing a castable adapter material into the bipartite mold so that the adapter and assembly member is formed which at least partially surrounds the transducer core.
transducer, comprising the steps of:
providing a piezoceramic wafer and placing the piezoceramic wafer in a seating recess in a core mold, the piezoceramic wafer having a portion which is partially exposed above the seating recess at one side within the core mold;
introducing a castable damping material into the core mold to at least partially cover the exposed portion of the piezoceramic wafer at the one side;
removing the piezoceramic wafer with the casted damping material which together form a transducer core and introducing the transducer core into a bipartite mold for formation of an adapter and assembly member; and introducing a castable adapter material into the bipartite mold so that the adapter and assembly member is formed which at least partially surrounds the transducer core.
14. A US transducer, comprising:
a transducer core formed of a piezoceramic wafer with leads and wherein said wafer is covered at one side by a damping member;
and the transducer core being at least partially surrounded with a castable adapter material means for formation of an adapter and assembly member.
a transducer core formed of a piezoceramic wafer with leads and wherein said wafer is covered at one side by a damping member;
and the transducer core being at least partially surrounded with a castable adapter material means for formation of an adapter and assembly member.
15. A US transducer, comprising:
a piezoceramic wafer having leads extending therefrom;
a damping material covering one side of the wafer and having the terminal leads embedded therein; and an adapter and assembly member covering an opposite side of said wafer covered by the damping member, said adapter and assembly member also at least partially surrounding portions of said damping material.
a piezoceramic wafer having leads extending therefrom;
a damping material covering one side of the wafer and having the terminal leads embedded therein; and an adapter and assembly member covering an opposite side of said wafer covered by the damping member, said adapter and assembly member also at least partially surrounding portions of said damping material.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DEP4030302.0 | 1990-09-25 | ||
| DE4030302 | 1990-09-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2052034A1 true CA2052034A1 (en) | 1992-03-26 |
Family
ID=6414935
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA 2052034 Abandoned CA2052034A1 (en) | 1990-09-25 | 1991-09-23 | Us transducer for air and gas flow measurement and a method for the manufacture thereof |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP0477575A1 (en) |
| JP (1) | JPH04258100A (en) |
| CA (1) | CA2052034A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9003887B2 (en) | 2010-05-28 | 2015-04-14 | Murata Manufacturing Co., Ltd. | Ultrasonic sensor |
| EP1993322A4 (en) * | 2006-03-06 | 2016-10-26 | Murata Manufacturing Co | Ultrasonic sensor, and its manufacturing method |
| WO2018177945A1 (en) | 2017-03-30 | 2018-10-04 | Robert Bosch Gmbh | Sound transducer, comprising a piezoceramic transducer element which is integrated in a diaphragm that can vibrate |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4330745C1 (en) * | 1993-09-10 | 1995-04-27 | Siemens Ag | Ultrasonic transducer with adapter body |
| DE19744229A1 (en) | 1997-10-07 | 1999-04-29 | Bosch Gmbh Robert | Ultrasonic transducer |
| DE10106477C2 (en) * | 2001-02-13 | 2002-12-19 | Fraunhofer Ges Forschung | Ultrasonic transducer with housing |
| DE10133395A1 (en) * | 2001-07-13 | 2003-01-23 | Flowtec Ag | Ultrasonic flow meter sensor has heat conducting moulded mount |
| DK200101780A (en) * | 2001-11-30 | 2002-11-27 | Danfoss As | An ultrasonic transducer |
| DE10304001A1 (en) * | 2003-02-01 | 2004-08-12 | Valeo Schalter Und Sensoren Gmbh | Pot-shaped menbrane for a sensor, in particular an ultrasonic sensor and sensor, in particular an ultrasonic sensor |
| DE10356114A1 (en) | 2003-11-27 | 2005-06-23 | Endress + Hauser Flowtec Ag, Reinach | Device for determining and / or monitoring the volume and / or mass flow rate of a measuring medium |
| JP4407767B2 (en) * | 2006-02-14 | 2010-02-03 | 株式会社村田製作所 | Ultrasonic sensor and manufacturing method thereof |
| DE102007010500A1 (en) * | 2007-03-05 | 2008-09-11 | Robert Bosch Gmbh | Ultrasonic transducer with directly embedded piezo |
| JP5099175B2 (en) | 2010-05-28 | 2012-12-12 | 株式会社村田製作所 | Ultrasonic sensor |
| EP2610432B8 (en) * | 2011-12-26 | 2016-08-03 | Services Pétroliers Schlumberger | Downhole ultrasonic transducer and method of making same |
| DE102017205376A1 (en) | 2017-03-30 | 2018-10-04 | Robert Bosch Gmbh | transducer |
| DE102018201404B3 (en) * | 2018-01-30 | 2019-04-11 | Pi Ceramic Gmbh | Ultrasonic transducer with a piezoceramic and method for producing such an ultrasonic transducer |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4011473A (en) * | 1974-08-26 | 1977-03-08 | Fred M. Dellorfano, Jr. & Donald P. Massa, Trustees Of The Stoneleigh Trust | Ultrasonic transducer with improved transient response and method for utilizing transducer to increase accuracy of measurement of an ultrasonic flow meter |
| JPS58193475A (en) * | 1982-05-07 | 1983-11-11 | Matsushita Electric Works Ltd | Ultrasonic reflection type detector |
| DE3301848C2 (en) * | 1983-01-20 | 1984-11-08 | Siemens AG, 1000 Berlin und 8000 München | Ultrasonic transducer |
| JPH0512740Y2 (en) * | 1988-01-11 | 1993-04-02 | ||
| DE3832947C2 (en) * | 1988-09-28 | 1996-04-11 | Siemens Ag | Ultrasound transducer |
-
1991
- 1991-08-28 EP EP91114484A patent/EP0477575A1/en not_active Withdrawn
- 1991-09-17 JP JP3265343A patent/JPH04258100A/en not_active Withdrawn
- 1991-09-23 CA CA 2052034 patent/CA2052034A1/en not_active Abandoned
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1993322A4 (en) * | 2006-03-06 | 2016-10-26 | Murata Manufacturing Co | Ultrasonic sensor, and its manufacturing method |
| US9003887B2 (en) | 2010-05-28 | 2015-04-14 | Murata Manufacturing Co., Ltd. | Ultrasonic sensor |
| WO2018177945A1 (en) | 2017-03-30 | 2018-10-04 | Robert Bosch Gmbh | Sound transducer, comprising a piezoceramic transducer element which is integrated in a diaphragm that can vibrate |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04258100A (en) | 1992-09-14 |
| EP0477575A1 (en) | 1992-04-01 |
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