JP3859973B2 - Mold for waterproof mold - Google Patents

Mold for waterproof mold Download PDF

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Publication number
JP3859973B2
JP3859973B2 JP2001011934A JP2001011934A JP3859973B2 JP 3859973 B2 JP3859973 B2 JP 3859973B2 JP 2001011934 A JP2001011934 A JP 2001011934A JP 2001011934 A JP2001011934 A JP 2001011934A JP 3859973 B2 JP3859973 B2 JP 3859973B2
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Japan
Prior art keywords
mold
waterproof
cylindrical
molding
holding
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JP2001011934A
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JP2002210759A (en
Inventor
浩孝 山田
康弘 服部
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Sumitomo Wiring Systems Ltd
AutoNetworks Technologies Ltd
Sumitomo Electric Industries Ltd
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Sumitomo Wiring Systems Ltd
AutoNetworks Technologies Ltd
Sumitomo Electric Industries Ltd
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Priority to JP2001011934A priority Critical patent/JP3859973B2/en
Priority to US09/984,919 priority patent/US6409541B1/en
Priority to EP01126129A priority patent/EP1204173B1/en
Priority to DE60109005T priority patent/DE60109005T2/en
Priority to US10/106,066 priority patent/US6709253B2/en
Priority to US10/106,051 priority patent/US6485334B2/en
Publication of JP2002210759A publication Critical patent/JP2002210759A/en
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
    • Y02A30/00—Adapting or protecting infrastructure or their operation
    • Y02A30/14—Extreme weather resilient electric power supply systems, e.g. strengthening power lines or underground power cables

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  • Insulated Conductors (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Description

【０００１】
【発明の属する技術分野】
本発明は、導線が配設された配線材に取り付けられる防水モールドを成形する防水モールド用の成形金型に関するものである。
【０００２】
【従来の技術】
従来、導体が配設された配線材を隔壁部に挿通させた状態で設置する場合等に、上記隔壁部に形成された開口部から水分等が侵入するのを防止するための防水モールドを上記配線材に取り付けることが行われている。この防水モールドは、例えば図６示すように、隔壁部の開口部等に嵌入される小径のシール部３と、大径のフランジ部２とを有し、図７に示すように、上記防水モールド４のシール部３と、隔壁部２１の開口部２２との間にＯリング２３等を設置することにより、上記シール部３の嵌着部を効果的にシールするように構成されている。
【０００３】
図８は、上記防水モールド用の成形金型を示し、この成形金型は、防水モールド４の外形に対応した成形面を形成する上型５０と下型６０とからなり、この上型５０と下型６０とを型締めした状態で、上記成形面内に溶融状態の絶縁性材料を注入することにより、上記防水モールド４を成形するように構成されている。
【０００４】
【発明が解決しようとする課題】
上記のように上型５０と下型６０とからなる成形金型によって上記防水モールド４を成形した場合には、上記成形面内に注入された絶縁材料が、上記上型５０と下型６０との接合面部分から漏出することにより、図６に示すように、防水モールド４の外周面にバリが形成されることが避けらない。このため、図７に示すように、隔壁部２１の開口部２２に嵌入される防水モールド４のシール部３と、上記開口部２２との間にＯリング２３等からなるシール部材を設置することにより、この部分をシールする際に、防水モールド４のシール部３とＯリング２３等からなるシール部材との間に、上記バリ２４の存在に起因した隙間が形成されてシール性が低下するという問題があった。
【０００５】
本発明は、上記の点に鑑みてなされたものであり、防水モールドの成形時に、その外周面にバリが形成されることに起因したシール性の低下を防止することができる防水モールド用の成形金型を提供することを目的としている。
【０００６】
【課題を解決するための手段】
請求項１に係る発明は、導線が配設された配線材に取り付けられる大径のフランジ部と小径のシール部とを有する防水モールドを成形する防水モールド用の成形金型であって、上記防水モールドのフランジ部の成形面を構成する上型と下型とからなる金型本体と、この金型本体の上型と下型とによって少なくとも一部が保持される一体構造の筒状金型とを有し、この筒状金型に、上記防水モールドのシール部の成形面を設け、筒状金型の一端部を金型本体の外部に露出させるとともに、この筒状金型の露出部に、配線材を保持する分割型からなる保持金型を設置し、この保持金型の外周部に先窄まりのテーパ面を形成するとともに、このテーパ面に対応した外広がりのテーパ面を有する設置孔を上記筒状金型に形成したものである。
【０００７】
上記構成によれば、金型本体および筒状金型により形成された成形面内に溶融状態の絶縁材料を注入することにより、金型本体の上型と下型との間に形成された成形面に対応した形状のフランジ部と、筒状金型の成形面に対応した形状のシール部とを有する防水モールドが成形され、このシール部の外周面にバリが形成されることが防止される。また、配線材を上記挿通部に挿通させた状態で、上記金型本体、筒状金型および保持金型により形成された成形面内に溶融状態の絶縁材料を注入することにより、上記配線材の外周面に防水モールドが一体に取り付けられた状態で成形される。その後、上記保持金型を筒状金型の設置孔から引き抜いて上記分割型を型開きするとともに、上記金型本体の上型と下型とを型開きした状態で、上記筒状金型を防水モールドから離型する作業が容易に行われることになる。
【０００８】
請求項２に係る発明は、上記請求項１記載の防水モールド用の成形金型において、金型本体を構成する上型と下型との接合面に配線材の挿通部を設けるとともに、この挿通部に弾性シール材を配設したものである。
【０００９】
上記構成によれば、配線材を上記挿通部に挿通させた状態で、上記金型本体および筒状金型により形成された成形面内に溶融状態の絶縁材料を注入することにより、上記配線材の外周面に防水モールドが一体に取り付けられた状態で成形されることになる。
【００１２】
【発明の実施の形態】
図１および図２は、本発明に係る防水モールド用の成形金型の実施形態を示している。この成形金型は、内部に複数本の導線が配設された扁平なフラットケーブル等からなる配線材１に取り付けられる大径のフランジ部２と小径のシール部３とを有する防水モールド４を成形するのに使用されるものであり、上記防水モールド４のフランジ部２の成形面を構成する上型５と下型６とを有する金型本体７と、この金型本体７の上型５と下型６とによって少なくとも一部が保持される一体構造の筒状金型８と、この筒状金型８に設けられた設置孔９に設置される保持金型１０とを有している。
【００１３】
上記金型本体７の上型５および下型６は、上記フランジ部２の成形面の端面部を構成する外壁部１１と、上記成形面の外周面部を構成する大径の筒状部１２とを有し、この筒状部１２には、上記筒状金型８を保持する保持部１３となる段部が形成されている。また、上記金型本体７の外壁部１１には、配線材１の挿通部となる切欠きが、上記上型５および下型６の接合面部分に形成されるとともに、上記配線材１の挿通部には、成形金型内に注入された溶融状態の絶縁材料が外部に漏出するのを防止するための耐熱性ゴム材等からなる弾性シール材１４が固着されている。
【００１４】
上記筒状金型８は、防水モールド４のシール部３の成形面を構成する小径の筒状部１５と、この成形面の端面部を構成する外壁部１６とを有し、上記筒状部１４が金型本体７の上型５および下型６によって挟持されることにより、上記外壁部１６が外部に露出した状態で金型本体７に保持されるように構成されている。、また、上記外壁部１６の中央部分には、上記保持金型１０の外周面に形成された先窄まりのテーパ面１７に対応した外広がりのテーパ面を有する設置孔９が形成されている。
【００１５】
上記保持金型１０は、上記設置孔９内に嵌入される上下一対の分割型１８，１９からなり、その外周部に先窄まりのテーパ面１７が形成されている。また、上記分割型１８，１９の接合面部分には、配線材１の挿通部となる切欠きが形成されるとともに、この配線材１の挿通部には、成形金型内に注入された溶融状態の絶縁材料が外部に漏出するのを防止するための耐熱性ゴム材等からなる弾性シール材２０が固着されている。
【００１６】
上記構成の成形金型により防水モールド４を成形するには、上記筒状金型８に配線材１を挿通させた状態で、上記金型本体７の上型５と下型６とを型閉じすることにより、金型本体７の保持部１３によって筒状金型８の筒状部１５を保持するとともに、上記金型本体７の挿通部に配設された弾性シール材１４によって上記配線材１を挟持する。その後、上記筒状金型８の設置孔９内に、上記保持金型１０の分割型１８，１９を挿入することにより、この保持金型１０の挿通部に配設された弾性シール材２０によって配線材１を挟持する。
【００１７】
このようにして金型本体７、筒状金型８および保持金型１０により構成された成形面内に、溶融状態の絶縁材料、例えば液状シリコーンゴムを注入して硬化させた後に、上記保持金型１０を筒状金型８の設置孔９から引き抜いて上記分割型１８，１９を型開きするとともに、金型本体７の上型５と下型６とを上下に分離して型開きする。次いで、上記絶縁材料によって形成された防水モールド４のシール部３から筒状金型８を離型させることにより、図３に示すように、配線材１を被覆するように一体に形成された大径のフランジ部２と小径のシール部３とを有する防水モールド４が成形されることになる。
【００１８】
上記のように防水モールド４のフランジ部２の成形面を構成する上型５と下型６とからなる金型本体７と、この金型本体７の上型５と下型６とによって少なくとも一部が保持される一体構造の筒状金型８とを設け、この筒状金型８に、上記防水モールド４のシール部３を成形するための成形面を設けたため、この筒状金型８の成形面に分割型を使用した場合のような接合面が形成されることがなく、上記筒状金型８の成形面より形成される上記シール部３の外周面にバリが形成されるのを防止することができる。
【００１９】
したがって、図４に示すように、上記防水モールド４が取り付けられた配線材１を隔壁部２１に挿通させるとともに、この隔壁部２１に形成された開口部２２に嵌入される防水モールド４のシール部３と、開口部２２との間にＯリング２３等からなるシール部材を設置する際に、上記バリの存在に起因した隙間が上記シール部３とＯリング２３等との間に形成されることがなく、上記配線材１の挿通部を上記Ｏリング２３等からなるシール部材によって確実にシールし、上記開口部２２を介して隔壁部２１の内部に水分が侵入すること等を効果的に防止することができる。
【００２０】
また、上記実施形態では、金型本体７を構成する上型５と下型６との接合面部分に扁平な配線材１の挿通部を構成する切欠きを設けるとともに、この挿通部に弾性シール材１３を配設したため、配線材１を上記挿通部に挿通させた状態で、上記金型本体７および筒状金型８等により形成された成形面内に、溶融状態の絶縁材料を注入した場合においても、この絶縁材料が上記配線材１の挿通部から漏出することがなく、上記成形面内に絶縁材料を充填することにより、上記配線材１の外周面に一体に取り付けられた状態で上記防水モールド４が成形されることになる。
【００２１】
さらに、上記のように、筒状金型８の一端部を金型本体７の外部に露出させるとともに、この筒状金型７の露出部に、配線材１を保持する分割型１８，１９からなる保持金型１０を設置し、この保持金型１０の外周部に先窄まりのテーパ面１７を形成するとともに、このテーパ面１７に対応した外広がりのテーパ面を有する設置孔９を上記筒状金型８に形成したため、上記保持金型１０を筒状金型８の設置孔９に設置した状態で、上記金型本体７の上型５と下型６とを型閉じして上記筒状金型８を保持しつつ、成形面内に溶融状態の絶縁材料を注入することにより、上記配線材１の外周面に一体に取り付けられた状態で防水モールド４を成形することができる。
【００２２】
そして、上記筒状金型８の設置孔９に設けられたテーパ面に沿って保持金型１０を引き抜くことにより、この保持金型１０を構成する分割型１８，１９を型開きして上記配線材１の保持状態を解除することができるため、上記金型本体７の上型５と下型６とを型開きした後に、上記筒状金型８の筒状部１５と防水モールド４のシール部３とを分離して筒状金型８を離型する作業を容易に行うことができる。
【００２３】
さらに、上記実施形態では、保持金型１０を構成する分割型１８，１９の接合面に配線材１の挿通部となるスリット状の切欠きを形成するとともに、この挿通部に弾性シール材２０を配設したため、上記挿通部に配線材１を挿通させた状態で、上記金型本体７、筒状金型８および保持金型１０により形成された成形面内に、溶融状態の絶縁材料を注入した場合においても、この絶縁材料が上記配線材１の挿通部から漏出することがなく、上記成形面内に絶縁材料を充填することにより、配線材１の外周面に一体に取り付けられた状態で防水モールド４が成形されることになる。
【００２４】
なお、上記筒状金型８の筒状部１４が金型本体７の上型５および下型６によって保持されるとともに、筒状金型８の外壁部１５が外部に露出するように構成された上記実施形態に代え、図５に示すように、防水モールド材４の成形面の全体を覆うように構成された上型５ａおよび下型６ａからなる金型本体７ａの内部に、筒状体からなる筒状金型８ａを配設し、この筒状金型８ａの全体を上記金型本体７ａによって保持するように構成してもよい。この場合、上記金型本体８ａの両端部に、配線材１の挿通部となる切欠きをそれぞれ形成するとともに、この挿通部に絶縁材料の漏出を防止するための弾性シール材１４を配設した構造とすることが望ましい。
【００２５】
【発明の効果】
以上説明したように、本発明は、導線が配設された配線材に取り付けられる大径のフランジ部と小径のシール部とを有する防水モールドを成形する防水モールド用の成形金型であって、上記防水モールドのフランジ部の成形面を構成する上型と下型とからなる金型本体と、この金型本体の上型と下型とによって少なくとも一部が保持される一体構造の筒状金型とを有し、この筒状金型に、上記防水モールドのシール部の成形面を設けたため、上記筒状金型の成形面より形成される上記シール部の外周面にバリが形成されるのを防止できるという利点がある。また、筒状金型の一端部を金型本体の外部に露出させるとともに、この筒状金型の露出部に、配線材を保持する分割型からなる保持金型を設置し、この保持金型の外周部に先窄まりのテーパ面を形成するとともに、このテーパ面に対応した外広がりのテーパ面を有する設置孔を上記筒状金型に形成しため、配線材を上記挿通部に挿通させた状態で、上記金型本体、筒状金型および保持金型により形成された成形面内に溶融状態の絶縁材料を注入することにより、上記配線材の外周面に防水モールドを一体に取り付けた状態で成形した後、上記保持金型を筒状金型の設置孔から引き抜いて上記分割型を型開きするとともに、上記金型本体の上型と下型とを型開きした状態で、上記筒状金型を防水モールドから離型する作業を容易に行うことができる。
【図面の簡単な説明】
【図１】本発明に係る防水モールド用の成形金型の実施形態を示す断面図である。
【図２】上記成形金型内に絶縁材料を注入した状態を示す断面図である。
【図３】防水モールドの具体的構成を示す斜視図である。
【図４】防水モードの設置状態を示す説明図である。
【図５】本発明に係る防水モールド用の成形金型の別の実施形態を示す断面図である。
【図６】従来の成形金型により成形された防水モードの例を示す斜視図である。
【図７】上記防水モールドの設置状態を示す説明図である。
【図８】成形金型の従来例を示す断面図である。
【符号の説明】
１ 配線材
２ フランジ部
３ シール部
４ 防水モールド
５ 上型
６ 下型
７ 金型本体
８ 筒状金型
９ 設置孔
１０ 保持金型
１４ 弾性シール材
１７ テーパ面[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a molding die for a waterproof mold for molding a waterproof mold to be attached to a wiring member provided with a conducting wire.
[0002]
[Prior art]
Conventionally, when a wiring material provided with a conductor is installed in a state of being inserted through the partition wall, a waterproof mold for preventing moisture and the like from entering from the opening formed in the partition wall is used. Attaching to the wiring material is performed. For example, as shown in FIG. 6, this waterproof mold has a small-diameter seal portion 3 fitted into the opening of the partition wall and the like, and a large-diameter flange portion 2. As shown in FIG. 4 and the opening 22 of the partition wall 21 are provided with an O-ring 23 or the like to effectively seal the fitting portion of the seal 3.
[0003]
FIG. 8 shows a molding die for the waterproof mold, and the molding die is composed of an upper mold 50 and a lower mold 60 that form a molding surface corresponding to the outer shape of the waterproof mold 4. The waterproof mold 4 is formed by injecting a molten insulating material into the molding surface while the lower mold 60 is clamped.
[0004]
[Problems to be solved by the invention]
As described above, when the waterproof mold 4 is molded by the molding die including the upper mold 50 and the lower mold 60, the insulating material injected into the molding surface is the upper mold 50, the lower mold 60, and the like. It is inevitable that burrs are formed on the outer peripheral surface of the waterproof mold 4 as shown in FIG. For this reason, as shown in FIG. 7, a seal member composed of an O-ring 23 or the like is installed between the seal portion 3 of the waterproof mold 4 inserted into the opening portion 22 of the partition wall portion 21 and the opening portion 22. Therefore, when this portion is sealed, a gap due to the presence of the burr 24 is formed between the seal portion 3 of the waterproof mold 4 and the seal member made of the O-ring 23 and the like, and the sealing performance is reduced. There was a problem.
[0005]
The present invention has been made in view of the above points, and for molding a waterproof mold, it is possible to prevent deterioration in sealing performance due to the formation of burrs on the outer peripheral surface of the waterproof mold. The purpose is to provide molds.
[0006]
[Means for Solving the Problems]
The invention according to claim 1 is a waterproof mold for a waterproof mold for forming a waterproof mold having a large-diameter flange portion and a small-diameter seal portion that are attached to a wiring member on which a conducting wire is disposed. A mold main body composed of an upper mold and a lower mold constituting the molding surface of the flange portion of the mold, and an integrally structured cylindrical mold that is at least partially held by the upper mold and the lower mold of the mold main body; The cylindrical mold is provided with a molding surface of the sealing portion of the waterproof mold, and one end of the cylindrical mold is exposed to the outside of the mold body, and the exposed portion of the cylindrical mold is An installation having a split die for holding the wiring material, forming a tapered surface on the outer periphery of the holding die, and having an outwardly tapered surface corresponding to the taper surface A hole is formed in the cylindrical mold .
[0007]
According to the above configuration, the molding formed between the upper mold and the lower mold of the mold body by injecting the molten insulating material into the molding surface formed by the mold body and the cylindrical mold. A waterproof mold having a flange portion having a shape corresponding to the surface and a seal portion having a shape corresponding to the molding surface of the cylindrical mold is formed, and burrs are prevented from being formed on the outer peripheral surface of the seal portion. . Further, the wiring material is injected by injecting a molten insulating material into a molding surface formed by the mold body, the cylindrical mold and the holding mold in a state where the wiring material is inserted through the insertion portion. A waterproof mold is integrally formed on the outer peripheral surface of the mold. Thereafter, the holding mold is pulled out from the installation hole of the cylindrical mold to open the split mold, and the cylindrical mold is opened with the upper mold and the lower mold of the mold body opened. The work of releasing from the waterproof mold is easily performed.
[0008]
According to a second aspect of the present invention, in the molding die for the waterproof mold according to the first aspect, a wiring material insertion portion is provided on the joint surface between the upper die and the lower die constituting the die main body, and the insertion An elastic sealing material is disposed on the part.
[0009]
According to the above configuration, the wiring material is injected by injecting a molten insulating material into a molding surface formed by the mold body and the cylindrical mold in a state where the wiring material is inserted through the insertion portion. A waterproof mold is integrally formed on the outer peripheral surface of the mold.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
1 and 2 show an embodiment of a molding die for a waterproof mold according to the present invention. This molding die forms a waterproof mold 4 having a large-diameter flange portion 2 and a small-diameter seal portion 3 attached to a wiring member 1 made of a flat cable or the like in which a plurality of conductive wires are disposed. A mold body 7 having an upper mold 5 and a lower mold 6 constituting the molding surface of the flange portion 2 of the waterproof mold 4, and an upper mold 5 of the mold body 7. It has an integrally structured cylindrical mold 8 that is at least partially held by the lower mold 6, and a holding mold 10 that is installed in an installation hole 9 provided in the cylindrical mold 8.
[0013]
The upper mold 5 and the lower mold 6 of the mold body 7 include an outer wall portion 11 that constitutes an end surface portion of the molding surface of the flange portion 2, and a large-diameter cylindrical portion 12 that constitutes an outer peripheral surface portion of the molding surface. The cylindrical portion 12 is formed with a step portion serving as a holding portion 13 for holding the cylindrical mold 8. Further, a notch serving as an insertion portion for the wiring member 1 is formed in the outer wall portion 11 of the mold body 7 at the joint surface portion between the upper die 5 and the lower die 6, and the insertion of the wiring member 1 is performed. An elastic sealing material 14 made of a heat-resistant rubber material or the like for preventing the molten insulating material injected into the molding die from leaking to the outside is fixed to the part.
[0014]
The cylindrical mold 8 includes a small-diameter cylindrical portion 15 that constitutes a molding surface of the seal portion 3 of the waterproof mold 4 and an outer wall portion 16 that constitutes an end surface portion of the molding surface. 14 is sandwiched between the upper mold 5 and the lower mold 6 of the mold body 7 so that the outer wall portion 16 is exposed to the outside and is held by the mold body 7. In addition, an installation hole 9 having an outwardly extending tapered surface corresponding to the tapered surface 17 of the tapered shape formed on the outer peripheral surface of the holding mold 10 is formed in the central portion of the outer wall portion 16. .
[0015]
The holding mold 10 includes a pair of upper and lower divided molds 18 and 19 that are fitted into the installation hole 9, and a tapered surface 17 that is tapered is formed on the outer periphery thereof. In addition, a cutout serving as an insertion portion for the wiring member 1 is formed in the joint surface portion of the split molds 18 and 19, and the melt injected into the molding die is inserted into the insertion portion for the wiring member 1. An elastic sealing material 20 made of a heat-resistant rubber material or the like for preventing the insulating material in the state from leaking to the outside is fixed.
[0016]
In order to mold the waterproof mold 4 with the molding die having the above-described configuration, the upper mold 5 and the lower mold 6 of the mold body 7 are closed while the wiring material 1 is inserted through the cylindrical mold 8. As a result, the cylindrical portion 15 of the cylindrical mold 8 is held by the holding portion 13 of the mold main body 7, and the wiring material 1 is held by the elastic seal material 14 disposed in the insertion portion of the mold main body 7. Pinch. Thereafter, by inserting the split molds 18 and 19 of the holding mold 10 into the installation hole 9 of the cylindrical mold 8, the elastic sealing material 20 disposed in the insertion portion of the holding mold 10 is used. The wiring material 1 is clamped.
[0017]
In this way, after injecting a molten insulating material, for example, liquid silicone rubber, into the molding surface constituted by the mold body 7, the cylindrical mold 8, and the holding mold 10, the holding mold is used. The mold 10 is pulled out from the installation hole 9 of the cylindrical mold 8 to open the divided molds 18 and 19, and the upper mold 5 and the lower mold 6 of the mold main body 7 are separated vertically to open the mold. Next, the cylindrical mold 8 is released from the seal portion 3 of the waterproof mold 4 formed of the above insulating material, so that the wiring material 1 is integrally formed so as to cover the wiring member 1 as shown in FIG. A waterproof mold 4 having a diameter flange portion 2 and a small diameter seal portion 3 is formed.
[0018]
As described above, at least one of the mold body 7 composed of the upper mold 5 and the lower mold 6 constituting the molding surface of the flange portion 2 of the waterproof mold 4 and the upper mold 5 and the lower mold 6 of the mold body 7. The cylindrical mold 8 having an integral structure for holding the portion is provided, and the cylindrical mold 8 is provided with a molding surface for molding the seal portion 3 of the waterproof mold 4. As a result, no burrs are formed on the outer peripheral surface of the seal portion 3 formed from the molding surface of the cylindrical mold 8. Can be prevented.
[0019]
Therefore, as shown in FIG. 4, the wiring member 1 to which the waterproof mold 4 is attached is inserted into the partition wall portion 21, and the seal portion of the waterproof mold 4 inserted into the opening 22 formed in the partition wall portion 21. 3 and the opening 22, a gap due to the presence of the burr is formed between the seal 3 and the O-ring 23. The insertion portion of the wiring member 1 is securely sealed by a sealing member made of the O-ring 23 or the like, and moisture can be effectively prevented from entering the partition portion 21 through the opening 22. can do.
[0020]
Moreover, in the said embodiment, while providing the notch which comprises the insertion part of the flat wiring material 1 in the junction surface part of the upper mold | type 5 and the lower mold | type 6 which comprises the metal mold body 7, elastic sealing is provided in this insertion part. Since the material 13 is disposed, the molten insulating material is injected into the molding surface formed by the mold body 7 and the cylindrical mold 8 with the wiring material 1 inserted through the insertion portion. Even in this case, the insulating material does not leak out from the insertion portion of the wiring material 1, and the insulating material is filled in the molding surface so that the insulating material is integrally attached to the outer peripheral surface of the wiring material 1. The waterproof mold 4 is formed.
[0021]
Further, as described above , one end of the cylindrical mold 8 is exposed to the outside of the mold body 7, and the divided molds 18 and 19 that hold the wiring material 1 are exposed to the exposed part of the cylindrical mold 7. The holding mold 10 is installed, a tapered surface 17 that is tapered at the outer periphery of the holding mold 10 is formed, and the installation hole 9 having an outwardly extending tapered surface corresponding to the tapered surface 17 is formed in the cylinder. since it formed in Jokin type 8, when it is installed to the holding mold 10 to the installation hole 9 of the tubular mold 8, and mold closing an upper die 5 and the lower die 6 of the die body 7 above The waterproof mold 4 can be molded in a state of being integrally attached to the outer peripheral surface of the wiring member 1 by injecting a molten insulating material into the molding surface while holding the cylindrical mold 8.
[0022]
Then, by pulling out the holding mold 10 along the tapered surface provided in the installation hole 9 of the cylindrical mold 8, the divided molds 18 and 19 constituting the holding mold 10 are opened to open the wiring. Since the holding state of the material 1 can be released, after the upper mold 5 and the lower mold 6 of the mold body 7 are opened, the cylindrical portion 15 of the cylindrical mold 8 and the waterproof mold 4 are sealed. The operation | work which isolate | separates from the part 3 and molds the cylindrical metal mold | die 8 can be performed easily.
[0023]
Furthermore, in the said embodiment, while forming the slit-shaped notch used as the insertion part of the wiring material 1 in the joint surface of the split molds 18 and 19 which comprise the holding metal mold | die 10, the elastic sealing material 20 is attached to this insertion part. Since the wiring material 1 is inserted through the insertion portion, the molten insulating material is injected into the molding surface formed by the mold body 7, the cylindrical mold 8, and the holding mold 10 Even in this case, the insulating material does not leak out from the insertion portion of the wiring material 1, and the insulating material is filled in the molding surface so that the insulating material is integrally attached to the outer peripheral surface of the wiring material 1. The waterproof mold 4 is formed.
[0024]
The cylindrical portion 8 of the cylindrical mold 8 is held by the upper mold 5 and the lower mold 6 of the mold body 7 and the outer wall portion 15 of the cylindrical mold 8 is exposed to the outside. Instead of the above embodiment, as shown in FIG. 5, a cylindrical body is provided inside a mold body 7 a composed of an upper mold 5 a and a lower mold 6 a configured to cover the entire molding surface of the waterproof mold material 4. A cylindrical mold 8a may be provided, and the entire cylindrical mold 8a may be held by the mold body 7a. In this case, notches that serve as insertion portions for the wiring member 1 are formed at both ends of the mold body 8a, and elastic sealing members 14 for preventing leakage of the insulating material are disposed at the insertion portions. A structure is desirable.
[0025]
【The invention's effect】
As described above, the present invention is a molding die for a waterproof mold that molds a waterproof mold having a large-diameter flange portion and a small-diameter seal portion that are attached to a wiring member provided with a conducting wire, A mold main body composed of an upper mold and a lower mold constituting the molding surface of the flange portion of the waterproof mold, and an integral structure cylindrical mold that is at least partially held by the upper mold and the lower mold of the mold main body Since the molding surface of the sealing part of the waterproof mold is provided on the cylindrical mold, burrs are formed on the outer peripheral surface of the sealing part formed from the molding surface of the cylindrical mold. There is an advantage that can be prevented. In addition, one end of the cylindrical mold is exposed to the outside of the mold body, and a holding mold including a split mold for holding the wiring material is installed on the exposed portion of the cylindrical mold. A tapered surface is formed on the outer peripheral portion of the wire, and an installation hole having an outwardly extending taper surface corresponding to the tapered surface is formed in the cylindrical mold, so that the wiring material is inserted through the insertion portion. In such a state, a waterproof mold is integrally attached to the outer peripheral surface of the wiring member by injecting a molten insulating material into the molding surface formed by the mold body, the cylindrical mold and the holding mold. After forming in the state, the holding mold is pulled out from the installation hole of the cylindrical mold to open the split mold, and the cylinder body is opened with the upper mold and the lower mold opened. The mold can be easily removed from the waterproof mold. That.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing an embodiment of a molding die for a waterproof mold according to the present invention.
FIG. 2 is a cross-sectional view showing a state where an insulating material is injected into the molding die.
FIG. 3 is a perspective view showing a specific configuration of a waterproof mold.
FIG. 4 is an explanatory diagram showing an installation state in a waterproof mode.
FIG. 5 is a cross-sectional view showing another embodiment of a molding die for waterproof mold according to the present invention.
FIG. 6 is a perspective view showing an example of a waterproof mode molded by a conventional molding die.
FIG. 7 is an explanatory view showing an installation state of the waterproof mold.
FIG. 8 is a cross-sectional view showing a conventional example of a molding die.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Wiring material 2 Flange part 3 Seal part 4 Waterproof mold 5 Upper mold 6 Lower mold 7 Mold main body 8 Cylindrical mold 9 Installation hole 10 Holding mold 14 Elastic sealing material 17 Tapered surface

Claims (2)

導線が配設された配線材に取り付けられる大径のフランジ部と小径のシール部とを有する防水モールドを成形する防水モールド用の成形金型であって、上記防水モールドのフランジ部の成形面を構成する上型と下型とからなる金型本体と、この金型本体の上型と下型とによって少なくとも一部が保持される一体構造の筒状金型とを有し、この筒状金型に、上記防水モールドのシール部の成形面を設け、筒状金型の一端部を金型本体の外部に露出させるとともに、この筒状金型の露出部に、配線材を保持する分割型からなる保持金型を設置し、この保持金型の外周部に先窄まりのテーパ面を形成するとともに、このテーパ面に対応した外広がりのテーパ面を有する設置孔を上記筒状金型に形成したことを特徴とする防水モールド用の成形金型。A molding die for a waterproof mold for molding a waterproof mold having a large-diameter flange portion and a small-diameter seal portion to be attached to a wiring material provided with a conductive wire, the molding surface of the flange portion of the waterproof mold being A mold main body composed of an upper mold and a lower mold, and a cylindrical mold having an integral structure that is at least partially held by the upper mold and the lower mold of the mold main body. The mold is provided with a molding surface for the sealing part of the waterproof mold, and one end of the cylindrical mold is exposed to the outside of the mold body, and the divided mold that holds the wiring material on the exposed part of the cylindrical mold The holding mold is provided, and a tapered surface is formed on the outer peripheral portion of the holding mold, and an installation hole having an outwardly tapered surface corresponding to the tapered surface is formed in the cylindrical mold. A molding die for a waterproof mold characterized by being formed . 金型本体を構成する上型と下型との接合面に配線材の挿通部を設けるとともに、この挿通部に弾性シール材を配設したことを特徴とする請求項１記載の防水モールド用の成形金型。  2. The waterproof mold for a waterproof mold according to claim 1, wherein an insertion portion for the wiring material is provided on a joint surface between the upper die and the lower die constituting the mold body, and an elastic seal material is disposed on the insertion portion. Molding mold.
JP2001011934A 2000-11-02 2001-01-19 Mold for waterproof mold Expired - Fee Related JP3859973B2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2001011934A JP3859973B2 (en) 2001-01-19 2001-01-19 Mold for waterproof mold
US09/984,919 US6409541B1 (en) 2000-11-02 2001-10-31 Waterproof structure in cable insertion section, method of manufacturing the same, and die for waterproof molding
EP01126129A EP1204173B1 (en) 2000-11-02 2001-11-02 Waterproof structure in cable insertion section, method of manufacturing the same, and die for waterproof molding
DE60109005T DE60109005T2 (en) 2000-11-02 2001-11-02 Waterproof structure for cable entry, its manufacturing process and mold for a watertight over-pouring
US10/106,066 US6709253B2 (en) 2000-11-02 2002-03-27 Die for waterproof molding
US10/106,051 US6485334B2 (en) 2000-11-02 2002-03-27 Waterproof structure in cable insertion section, method of manufacturing the same, and die for waterproof molding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001011934A JP3859973B2 (en) 2001-01-19 2001-01-19 Mold for waterproof mold

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JP2002210759A JP2002210759A (en) 2002-07-30
JP3859973B2 true JP3859973B2 (en) 2006-12-20

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KR100711792B1 (en) * 2001-08-30 2007-05-02 주식회사 포스코 Apparatus for straight knife of dividing shear
JP5390838B2 (en) * 2008-11-21 2014-01-15 古河電気工業株式会社 Flat cable and flat cable connector

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