CA2036169A1 - Boitiers de microcircuits, lamines - Google Patents
Boitiers de microcircuits, laminesInfo
- Publication number
- CA2036169A1 CA2036169A1 CA002036169A CA2036169A CA2036169A1 CA 2036169 A1 CA2036169 A1 CA 2036169A1 CA 002036169 A CA002036169 A CA 002036169A CA 2036169 A CA2036169 A CA 2036169A CA 2036169 A1 CA2036169 A1 CA 2036169A1
- Authority
- CA
- Canada
- Prior art keywords
- laminates
- stack
- pressurizing medium
- membrane
- transfer membrane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000003475 lamination Methods 0.000 title abstract description 4
- 239000012528 membrane Substances 0.000 claims abstract description 47
- 238000000034 method Methods 0.000 claims abstract description 15
- 239000007787 solid Substances 0.000 claims abstract description 15
- 229920006311 Urethane elastomer Polymers 0.000 claims abstract description 10
- 230000000717 retained effect Effects 0.000 claims abstract description 6
- 238000003825 pressing Methods 0.000 claims abstract description 5
- 229920000126 latex Polymers 0.000 claims abstract description 4
- 239000004816 latex Substances 0.000 claims abstract description 3
- 229920002379 silicone rubber Polymers 0.000 claims abstract 4
- 239000004945 silicone rubber Substances 0.000 claims abstract 4
- 239000000463 material Substances 0.000 claims description 3
- 239000013536 elastomeric material Substances 0.000 claims 2
- 235000015095 lager Nutrition 0.000 claims 2
- 239000011343 solid material Substances 0.000 claims 1
- 239000012530 fluid Substances 0.000 abstract description 6
- 229920002063 Sorbothane Polymers 0.000 abstract description 4
- 238000007596 consolidation process Methods 0.000 abstract 1
- 229920001971 elastomer Polymers 0.000 description 15
- 239000005060 rubber Substances 0.000 description 15
- 230000007775 late Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 229920002635 polyurethane Polymers 0.000 description 3
- 239000004814 polyurethane Substances 0.000 description 3
- ODPOAESBSUKMHD-UHFFFAOYSA-L 6,7-dihydrodipyrido[1,2-b:1',2'-e]pyrazine-5,8-diium;dibromide Chemical compound [Br-].[Br-].C1=CC=[N+]2CC[N+]3=CC=CC=C3C2=C1 ODPOAESBSUKMHD-UHFFFAOYSA-L 0.000 description 2
- 239000005630 Diquat Substances 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 101150058765 BACE1 gene Proteins 0.000 description 1
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 241000100287 Membras Species 0.000 description 1
- 101100496106 Mus musculus Clec2f gene Proteins 0.000 description 1
- 241001163743 Perlodes Species 0.000 description 1
- 241001296096 Probles Species 0.000 description 1
- 241000534944 Thia Species 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 125000001145 hydrido group Chemical group *[H] 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920003225 polyurethane elastomer Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B25/00—Layered products comprising a layer of natural or synthetic rubber
- B32B25/04—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B25/042—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material of natural rubber or synthetic rubber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B25/00—Layered products comprising a layer of natural or synthetic rubber
- B32B25/20—Layered products comprising a layer of natural or synthetic rubber comprising silicone rubber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2439/00—Containers; Receptacles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Materials For Medical Uses (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US48309190A | 1990-02-20 | 1990-02-20 | |
| US483,091 | 1990-02-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2036169A1 true CA2036169A1 (fr) | 1991-08-21 |
Family
ID=23918620
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002036169A Abandoned CA2036169A1 (fr) | 1990-02-20 | 1991-02-12 | Boitiers de microcircuits, lamines |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JPH04214640A (fr) |
| KR (1) | KR920000129A (fr) |
| CA (1) | CA2036169A1 (fr) |
| DE (1) | DE4105275A1 (fr) |
| FR (1) | FR2658661A1 (fr) |
| GB (1) | GB2243803A (fr) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10327746A1 (de) * | 2003-06-18 | 2005-01-05 | Giesecke & Devrient Gmbh | Verfahren zum Fixieren einer Beschichtung auf einem Trägerband |
| JP2009117565A (ja) * | 2007-11-06 | 2009-05-28 | Maruwa Co Ltd | 電子部品を装着するためのセラミック成形体及びその製造方法並びにその方法に使用される弾性被覆シート |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4933042A (en) * | 1986-09-26 | 1990-06-12 | General Electric Company | Method for packaging integrated circuit chips employing a polymer film overlay layer |
| US4737208A (en) * | 1986-09-29 | 1988-04-12 | American Telephone And Telegraph Company, At&T Bell Laboratories | Method of fabricating multilayer structures with nonplanar surfaces |
| GB2222800B (en) * | 1988-09-16 | 1992-02-19 | Stc Plc | Hybrid circuits |
-
1991
- 1991-02-12 CA CA002036169A patent/CA2036169A1/fr not_active Abandoned
- 1991-02-15 GB GB9103242A patent/GB2243803A/en not_active Withdrawn
- 1991-02-19 FR FR9101962A patent/FR2658661A1/fr active Pending
- 1991-02-20 JP JP3026288A patent/JPH04214640A/ja active Pending
- 1991-02-20 DE DE4105275A patent/DE4105275A1/de not_active Withdrawn
- 1991-02-20 KR KR1019910002744A patent/KR920000129A/ko not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| DE4105275A1 (de) | 1991-08-22 |
| FR2658661A1 (fr) | 1991-08-23 |
| GB2243803A (en) | 1991-11-13 |
| GB9103242D0 (en) | 1991-04-03 |
| JPH04214640A (ja) | 1992-08-05 |
| KR920000129A (ko) | 1992-01-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FZDE | Dead |