CA2025337A1 - Process for directly metallizing circuit boards - Google Patents

Process for directly metallizing circuit boards

Info

Publication number
CA2025337A1
CA2025337A1 CA002025337A CA2025337A CA2025337A1 CA 2025337 A1 CA2025337 A1 CA 2025337A1 CA 002025337 A CA002025337 A CA 002025337A CA 2025337 A CA2025337 A CA 2025337A CA 2025337 A1 CA2025337 A1 CA 2025337A1
Authority
CA
Canada
Prior art keywords
circuit boards
directly metallizing
oxidation agent
directly
metallizing circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA002025337A
Other languages
French (fr)
Other versions
CA2025337C (en
Inventor
Burkhard Bressel
Heinrich Meyer
Walter Meyer
Klaus Gedrat
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Schering AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE3931003A external-priority patent/DE3931003A1/en
Application filed by Schering AG filed Critical Schering AG
Publication of CA2025337A1 publication Critical patent/CA2025337A1/en
Application granted granted Critical
Publication of CA2025337C publication Critical patent/CA2025337C/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/12—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
    • C08G61/122—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides
    • C08G61/123—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides derived from five-membered heterocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0329—Intrinsically conductive polymer [ICP]; Semiconductive polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Chemically Coating (AREA)
  • Laminated Bodies (AREA)
  • Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)

Abstract

The present invention relates to a process for directly metallizing circuit boards, preferably in a horizontal throughput system, with the omission of electrolyte that requires no outside current. A multi-functional adsorption layer is produced selectively on the non-conductive parts of the circuit boards, said layer being able to adsorb an oxidation agent and/or store, this in pores or which is itself an oxidation agent, and which then is brought to reaction with such monomers as are suitable for the formation of conductive polymers, and which are metallized by electroplating.
CA002025337A 1989-09-14 1990-09-13 Process for directly metallizing circuit boards Expired - Lifetime CA2025337C (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DEP3931003.5 1989-09-14
DE3931003A DE3931003A1 (en) 1989-09-14 1989-09-14 Direct metallisation of circuits boards
DE3940565 1989-12-05
DEP3940565.6 1989-12-05

Publications (2)

Publication Number Publication Date
CA2025337A1 true CA2025337A1 (en) 1991-03-15
CA2025337C CA2025337C (en) 2001-04-17

Family

ID=25885248

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002025337A Expired - Lifetime CA2025337C (en) 1989-09-14 1990-09-13 Process for directly metallizing circuit boards

Country Status (9)

Country Link
EP (1) EP0417750B1 (en)
JP (1) JP2871828B2 (en)
KR (1) KR100216328B1 (en)
CN (1) CN1021949C (en)
AT (1) ATE145313T1 (en)
CA (1) CA2025337C (en)
DD (1) DD297669A5 (en)
DE (1) DE59010565D1 (en)
ES (1) ES2095227T3 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4040226C2 (en) * 1990-12-15 1994-09-29 Hoellmueller Maschbau H Process for the production of plated-through printed circuit boards or multilayer printed circuit boards (multilayers)
US5840363A (en) * 1993-04-30 1998-11-24 Grundig Ag Process for throughplating printed circuit boards using conductive plastics
DE4314259C2 (en) * 1993-04-30 1997-04-10 Grundig Emv Process for through-contacting printed circuit boards using conductive plastics for direct metallization
FR2737507B1 (en) * 1995-08-04 1997-09-26 Scps COMPOUND POROUS METALLIC OR METALLIC STRUCTURES, PRE-METALLIZED BY DEPOSITION OF A CONDUCTIVE POLYMER
DE19637018A1 (en) * 1996-09-12 1998-03-19 Bayer Ag Process for the production of rigid and flexible circuits
DE10124631C1 (en) * 2001-05-18 2002-11-21 Atotech Deutschland Gmbh Direct electrolytic metallization of insulating substrate surface, used in circuit board production, e.g. for metallizing fine holes, uses pretreatment with water-soluble polymer and acid solutions of permanganate and thiophen compound
WO2004098303A1 (en) 2003-04-16 2004-11-18 Vdf Futureceuticals Low-mycotoxin coffee cherry products
CN104018196A (en) * 2013-02-28 2014-09-03 武汉孟鼎电化学技术有限公司 Direct plating method for printed circuit board free of chemical plating

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0206133B1 (en) * 1985-06-12 1991-07-31 BASF Aktiengesellschaft Use of polypyrrole to deposit metallic copper onto non-electroconductive materials
KR960014476B1 (en) * 1988-03-03 1996-10-15 블라스베르그 오베르플래첸테크닉 게엠베하 Printed circuit board plated with novel through-holes and manufacturing method thereof

Also Published As

Publication number Publication date
EP0417750B1 (en) 1996-11-13
CN1050965A (en) 1991-04-24
CA2025337C (en) 2001-04-17
CN1021949C (en) 1993-08-25
KR100216328B1 (en) 1999-08-16
ES2095227T3 (en) 1997-02-16
EP0417750A2 (en) 1991-03-20
KR910006516A (en) 1991-04-29
DE59010565D1 (en) 1996-12-19
DD297669A5 (en) 1992-01-16
ATE145313T1 (en) 1996-11-15
JPH03175692A (en) 1991-07-30
JP2871828B2 (en) 1999-03-17
EP0417750A3 (en) 1991-10-30

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Legal Events

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