CA2010717A1 - Thermoplastic molding compositions based on polyphenylene ethers and aromatic vinyl polymers - Google Patents
Thermoplastic molding compositions based on polyphenylene ethers and aromatic vinyl polymersInfo
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- CA2010717A1 CA2010717A1 CA002010717A CA2010717A CA2010717A1 CA 2010717 A1 CA2010717 A1 CA 2010717A1 CA 002010717 A CA002010717 A CA 002010717A CA 2010717 A CA2010717 A CA 2010717A CA 2010717 A1 CA2010717 A1 CA 2010717A1
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- thermoplastic molding
- molding composition
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- aromatic vinyl
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
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- Compositions Of Macromolecular Compounds (AREA)
Abstract
- 12 - O.Z. 0050/40641 Abstract of the Disclosure: Thermoplastic molding com-positions contain as essential components (A) 9.9-89.9% by weight of a polyphenylene ether, (B) 10-90% by weight of an aromatic vinyl polymer and (C) 0.1-5% by weight of a low molecular weight compound which contains at least one Si-O-C group and at least one epoxy, nitrogen-containing or sulfur-containing group.
Description
2Q1071~
O.Z. 0050/40641 Thermopla~tic molding compositions based on polyphenvlene ethers and aromatic vinyl polymers The present invention relates to thermoplastic molding composition~ containing as es~ential components S (A) 9.9 89.9% by weight of a polyphenylene ether, ~B~ 10-90% by weight of an aromatic vinyl polymer and (C) 0.1-5% by weight of a low molecular weight compound which contains at least one Si-O-C group ~nd at least one epoxy, nitrogen-containing or sulfur-containing group.
MoldLng compositions based on polyphenyleneethers and high impact polystyrene and polysiloxanes are known from DE-A-3 118 629. Their stress crack resistance is not wholly 3atisfactory.
&erman Application P 37 41 670. 7 describes mixtures of polyphenylene ethers, impact modifiad poly-styrene and a silane-containing polymer of styrene and silane-containing methacrylate.
According to EP-B-107 835~ alkanesulfonates can influence the stress crack resistance of blends of polyphenylene ethers and impact modified polystyrene.
However, di~advantages are the poor heat distortion resi~tance and the poor self-color. In addition, the stress crack resistance and toughness are still in need of improvement.
EP-A-182 163 discloses mixtures of polyamide, polyphenylene ether and a silane as processing aid.
Disadvantages of these polyamide molding compositions are their high water regain, their low dimensional stability 30 after processing and their unfavorable color quality.
DE-A-3 619 225 discloses molding compositions based on aromatic vinyl polymers and a polyphenylene ether which has been modified with maleimide. It turns out that the stress crack resistance is still in need of improvement.
It i~ an ob~ect of the present invention to provide thermoplastic molding compositions based on a ~01(:~7~7 - 2 - o.Z. 0050/40641 polyphenylene ether and an aromatic vinyl polymer which have good mechanical propertiQs ~uch as toughne~ , good distortion resiQtanCe, good stress cracX resi~tance and ~ood color quality.
5We have found that this ob~ect i~ achieved by the thermoplastic molding compositions defined above.
We have also found pre~erred embodiments as set forth in the cubclaim~, a process for producing the molding compositions, and the use thereof for producing 10moldings and semi-finished products.
The molding compositions according to the present invention contain a3 essential components from 9.9 to 89.9, preferably from 19.9 to 79.9, in particular from 29.7 to 69.7, % by weight of A, from 10 to 90, preferably lSfrom 20 to 80, in particular from 30 to 70, % by weight of B and from 0.1 to 5, preferably from 0.1 to 4, in particular from 0.3 to 3, % by weight of C, all the weight %ages being based on the total amount of A, B and C.
20Suitable polyphenylene ethers A are known per ~e;
they are prepared in a conventional manner by oxidative coupllng from phenols which are di~ubstituted Ln the ortho po~ition by alkyl, alkoxy, chlorine or bromine (c~. US Patents 3,661,848, 3,378,505, 3,306,874, 253,306,875 and 3,639,656). The alkyl or alkoxy groups, which preferably contain from 1 to 4 carbon atoms but no ~-dispo~ed tertiary hydrogen atom, may in turn be sub-stituted by chlorine or bromine. Suitable polyphenylene ether~ are for example poly-2,6-diethyl-1,4-phenylene 30ether, poly-2-methyl-6-ethyl-1,4-phenylene ether, poly-2-methyl-6-propyl-1,4-phenyleneether,poly-2,6-dipropyl-1,4-phenylene ether, poly-2-ethyl-6-propyl-1,4-phenylene ether, poly-2,6-dichloro-1,4-phenylene ether and poly-2,6-dibromo-1,4-phenylene ether, copolymers such as those 35which contain 2,3,6-trimethylphenol, and also polyblends.
Preference is given to poly-2,6-dimethyl-1,4-phenylene ether. The polyphenylene ethers generally have an 7~7 3 - O.Z. 005~/40641 :Lntrinsic vi~co~ity of 0.5 to 0.9 dl/g, measured in chloroform at 25C.
It is normally advantageous to u~e the polypheny-lene ethers mentioned~ In some cases, however, it will 5pro~e advantageous to use modified polyphenylene ethers.
Such polyphenylene ether~ incorporate for example a compound containing a C-C double or triple bond and a carboxyl group or a derivative thereof, such as maleic acid, maleic anhydride, fumaric acid, maleimide or the 10acyl chloride of trimellitic anhydride. Such modified polyphenylene ethers are known for example from NO-A-87/00540.
~he aromatic vinyl polymer B can be any customary homopolymer or copolymer of styrene. Customarily, the 15molecular weights of the useable styrene polymers (weiqht average M~) are within the ranqe from 150,000 to 300,000.
SuLtable styrene polymers are prepared in a known manner from, predominantly, styrene but also from ring- or sidechain-C1-C4-alkylated styrenes such as ~-methylstyrene 20or p-methylstyrene, by bulk, solution or suspension polymerization (cf. Ullmanns Encyklopadie der Technischen Chemie, Volume 19, pages 265-272, Verlag Chemie, Weinheim 1980).
The aromatic vinyl polymer is preferably an 25impact modified grad~.
Impact modification can be achieved by admixing small amounts, preferably 2-20~ by weight, based on the aromatic vinyl polymer, of a rubber. Suitable rubbers are olefin rubbers such as EPDM rubber, acrylate rubber~ and 30polymers of a con~ugated diene such as butadiene or i~oprene. The diene polymers may have been partially or completely hydrogenated. The rubber should have a glass tran3ition temperature of below 0C, measured by the method of R.H. Illers and ~. Breuer, Kolloid Zeitschrift 35176 (1961), llO. It is possible to use customary rubbers such as polybutadiene rubber, acrylate rubber, styrene-butadiene rubber, hydrogenated styrene-butadiene rubber, Z()1(~7~'7 4 - O.Z. 0050/40641 acrylonitrile-butadiene rubber, polyisoprene rubber, ionomer~, styrene-butadiene block copolymer~, including AB, ABA, ABAB tapered block copolymers, star block copolymers and similar isoprene block polymer~, and in particular (partially~ hydrogenated block copolymers as described in EP-A-62 283. Such synthetic rubbers are known to those skilled in the art.
Impact modification can preferably also be effected by preparing the aromatic vinyl polymer in the presence of minor amounts, for example in the presence of 2-20% by weight, ba~ed on the aromatic vinyl polymer, of a rubberlike polymer of the abovementioned type, for example a rubberlike polymer based on a con~ugated diene, with or without an acrylate rubber, to prepare a HIPS
type product. Suitable for this purpose are rubberlike polymers based on butadiene, eg. styrene-butadiene polymer~, polybutadiene and butadiene-styrene block copolymers.
The~e ~pecific high impact styrene polymers are 80 familiar from the prior art and usage that no further explanation i8 required here (cf. Ullmanns Encyklopadie der techni~chen Chemie, 4th edition, Volume 19, pages 272-295, Verlag Chemie GmbH, 1980).
The compound C is known per se. It has a low molecular weight, containing not more than 10, preferably not more 3, in particular not more than one Si atom. It is customary to use a compound of the general formula I
R~ (CH2) -X
oR3 where R1, R2 and R3 are each independently of the other~ alkyl, cycloalkyl or aralkyl of up to 20 carbon atoms, in particular methyl, ethyl, or propyl, X is a radical which contains a group containing a culfur atom or preferably an epoxy group or a group containing :~()1()7~
O.Z. 0050/40641 Thermopla~tic molding compositions based on polyphenvlene ethers and aromatic vinyl polymers The present invention relates to thermoplastic molding composition~ containing as es~ential components S (A) 9.9 89.9% by weight of a polyphenylene ether, ~B~ 10-90% by weight of an aromatic vinyl polymer and (C) 0.1-5% by weight of a low molecular weight compound which contains at least one Si-O-C group ~nd at least one epoxy, nitrogen-containing or sulfur-containing group.
MoldLng compositions based on polyphenyleneethers and high impact polystyrene and polysiloxanes are known from DE-A-3 118 629. Their stress crack resistance is not wholly 3atisfactory.
&erman Application P 37 41 670. 7 describes mixtures of polyphenylene ethers, impact modifiad poly-styrene and a silane-containing polymer of styrene and silane-containing methacrylate.
According to EP-B-107 835~ alkanesulfonates can influence the stress crack resistance of blends of polyphenylene ethers and impact modified polystyrene.
However, di~advantages are the poor heat distortion resi~tance and the poor self-color. In addition, the stress crack resistance and toughness are still in need of improvement.
EP-A-182 163 discloses mixtures of polyamide, polyphenylene ether and a silane as processing aid.
Disadvantages of these polyamide molding compositions are their high water regain, their low dimensional stability 30 after processing and their unfavorable color quality.
DE-A-3 619 225 discloses molding compositions based on aromatic vinyl polymers and a polyphenylene ether which has been modified with maleimide. It turns out that the stress crack resistance is still in need of improvement.
It i~ an ob~ect of the present invention to provide thermoplastic molding compositions based on a ~01(:~7~7 - 2 - o.Z. 0050/40641 polyphenylene ether and an aromatic vinyl polymer which have good mechanical propertiQs ~uch as toughne~ , good distortion resiQtanCe, good stress cracX resi~tance and ~ood color quality.
5We have found that this ob~ect i~ achieved by the thermoplastic molding compositions defined above.
We have also found pre~erred embodiments as set forth in the cubclaim~, a process for producing the molding compositions, and the use thereof for producing 10moldings and semi-finished products.
The molding compositions according to the present invention contain a3 essential components from 9.9 to 89.9, preferably from 19.9 to 79.9, in particular from 29.7 to 69.7, % by weight of A, from 10 to 90, preferably lSfrom 20 to 80, in particular from 30 to 70, % by weight of B and from 0.1 to 5, preferably from 0.1 to 4, in particular from 0.3 to 3, % by weight of C, all the weight %ages being based on the total amount of A, B and C.
20Suitable polyphenylene ethers A are known per ~e;
they are prepared in a conventional manner by oxidative coupllng from phenols which are di~ubstituted Ln the ortho po~ition by alkyl, alkoxy, chlorine or bromine (c~. US Patents 3,661,848, 3,378,505, 3,306,874, 253,306,875 and 3,639,656). The alkyl or alkoxy groups, which preferably contain from 1 to 4 carbon atoms but no ~-dispo~ed tertiary hydrogen atom, may in turn be sub-stituted by chlorine or bromine. Suitable polyphenylene ether~ are for example poly-2,6-diethyl-1,4-phenylene 30ether, poly-2-methyl-6-ethyl-1,4-phenylene ether, poly-2-methyl-6-propyl-1,4-phenyleneether,poly-2,6-dipropyl-1,4-phenylene ether, poly-2-ethyl-6-propyl-1,4-phenylene ether, poly-2,6-dichloro-1,4-phenylene ether and poly-2,6-dibromo-1,4-phenylene ether, copolymers such as those 35which contain 2,3,6-trimethylphenol, and also polyblends.
Preference is given to poly-2,6-dimethyl-1,4-phenylene ether. The polyphenylene ethers generally have an 7~7 3 - O.Z. 005~/40641 :Lntrinsic vi~co~ity of 0.5 to 0.9 dl/g, measured in chloroform at 25C.
It is normally advantageous to u~e the polypheny-lene ethers mentioned~ In some cases, however, it will 5pro~e advantageous to use modified polyphenylene ethers.
Such polyphenylene ether~ incorporate for example a compound containing a C-C double or triple bond and a carboxyl group or a derivative thereof, such as maleic acid, maleic anhydride, fumaric acid, maleimide or the 10acyl chloride of trimellitic anhydride. Such modified polyphenylene ethers are known for example from NO-A-87/00540.
~he aromatic vinyl polymer B can be any customary homopolymer or copolymer of styrene. Customarily, the 15molecular weights of the useable styrene polymers (weiqht average M~) are within the ranqe from 150,000 to 300,000.
SuLtable styrene polymers are prepared in a known manner from, predominantly, styrene but also from ring- or sidechain-C1-C4-alkylated styrenes such as ~-methylstyrene 20or p-methylstyrene, by bulk, solution or suspension polymerization (cf. Ullmanns Encyklopadie der Technischen Chemie, Volume 19, pages 265-272, Verlag Chemie, Weinheim 1980).
The aromatic vinyl polymer is preferably an 25impact modified grad~.
Impact modification can be achieved by admixing small amounts, preferably 2-20~ by weight, based on the aromatic vinyl polymer, of a rubber. Suitable rubbers are olefin rubbers such as EPDM rubber, acrylate rubber~ and 30polymers of a con~ugated diene such as butadiene or i~oprene. The diene polymers may have been partially or completely hydrogenated. The rubber should have a glass tran3ition temperature of below 0C, measured by the method of R.H. Illers and ~. Breuer, Kolloid Zeitschrift 35176 (1961), llO. It is possible to use customary rubbers such as polybutadiene rubber, acrylate rubber, styrene-butadiene rubber, hydrogenated styrene-butadiene rubber, Z()1(~7~'7 4 - O.Z. 0050/40641 acrylonitrile-butadiene rubber, polyisoprene rubber, ionomer~, styrene-butadiene block copolymer~, including AB, ABA, ABAB tapered block copolymers, star block copolymers and similar isoprene block polymer~, and in particular (partially~ hydrogenated block copolymers as described in EP-A-62 283. Such synthetic rubbers are known to those skilled in the art.
Impact modification can preferably also be effected by preparing the aromatic vinyl polymer in the presence of minor amounts, for example in the presence of 2-20% by weight, ba~ed on the aromatic vinyl polymer, of a rubberlike polymer of the abovementioned type, for example a rubberlike polymer based on a con~ugated diene, with or without an acrylate rubber, to prepare a HIPS
type product. Suitable for this purpose are rubberlike polymers based on butadiene, eg. styrene-butadiene polymer~, polybutadiene and butadiene-styrene block copolymers.
The~e ~pecific high impact styrene polymers are 80 familiar from the prior art and usage that no further explanation i8 required here (cf. Ullmanns Encyklopadie der techni~chen Chemie, 4th edition, Volume 19, pages 272-295, Verlag Chemie GmbH, 1980).
The compound C is known per se. It has a low molecular weight, containing not more than 10, preferably not more 3, in particular not more than one Si atom. It is customary to use a compound of the general formula I
R~ (CH2) -X
oR3 where R1, R2 and R3 are each independently of the other~ alkyl, cycloalkyl or aralkyl of up to 20 carbon atoms, in particular methyl, ethyl, or propyl, X is a radical which contains a group containing a culfur atom or preferably an epoxy group or a group containing :~()1()7~
- 5 - O.Z. 0050/40641 a nitrogen atom, and n i5 an integer from 1 to 8, preferably from 1 to 3.
Preference i~ given to compound-~ which contain no olefinic CC double bond.
Examples are the compounds having the structures indicated in the Table below. The Table also indicates the names used.
Nbme Str~Nre ~ lxql~Qyltrim~thoxysila~e ~(C~)3Si(OCH3)3 ~-AIl~qn~pyltriethoxysilane ~N(C~33Si(OC~)3 N-~-B~i~x~hyl-7_~1nqp~Qyl-trimE~xysilane H2N(C~ (C~)3Si(OCH3)3 ( ( (N'-,9-h~i~l)-N-~l~lli~ E~N(cH2)2NEl(cE~)2NH(cHz)3si(a~H3)3 ethyl)-~a~sop~Iyl)trimetho~y-silane 4,5-Dihy~1-[3-(triethoxysilyl)- ~ - C~
prcQyl]imic~ole l l N N - (C~)3Si(OE~)3 CH
~-~erc~pt~pyltrimethoxy~llane HS(C~)3Si(OCH3)3 ~-Glycidylo~xpyltri ~ - /0 silane c~-cH~o~o(o~)3si(ocH3)3 Such compound~ are commercially available, for example from H~ls Troisdorf AG under the name Dynasilan.
In addition to these essential components the molding compo~itions according to the present invention may contain as component D customary reinforcing materials such as glass ball~, mineral fibers, whiskers, aluminum oxide fibers, mica or in particular glasq fibers in amounts of from 10 to 40 parts by weight, based on 100 parts by weight of the total amount of component~ A, B
and C.
The glass fibers can be made of E-, A- or C-glas~. They may be ~ized with an adhe~ion promoter. Theirdiameter is in general within the range from 6 to 20 ~m.
~0107~7 ~ 6 - O.Z. 0050/40641 Xt i8 possible to use not only strandlike continuous fibers (rovings) but also chopped glass fibers from 1 to 10 mm, preferably from 3 to 6 mm, in length or ultrashort 511ass fibers from 0.05 to 1.5 mm in length.
In ~ome cases, it has proved advantageous to use no reinforcing materials D.
In addition to the components mentioned, the molding compositions according to the present invention may contain further substances such as customary heat and light stabilizer~, lubricants, mold release agent~ and colorants such as dyes and pigments in customary amounts.
Other possibilities are flame retardants, in particular phosphorus-containing ones, such a-q phosphoric esters, phosphinic esters and phosphine oxides. Good flame lS inhibition is achieved with triphenyl phosphate and triphenylphosphine oxide.
The thermopla3tic molding compositions according to the present invention are advantageously prepared by mixing the components at 200-320C, preferably 250-300C, in customary mixing apparatug, eg. kneaders, Banbury mixers and single-screw extruders, preferably in a twin-screw extruder. To obtain a very homogeneous molding composition, it is nece3sary to ensure thorough mixing, which can be achieved in a conventional manner. The residence times are in general within the range from 0.5 to 30 minutes, preferably from 1 to 5 minutes. The order of addition of the components can be varied; selected components can be premixed, or else all the components may be mixed together at one and the ~ame time.
Component C can be incorporated in the mixture with or without an inert solvent or diluent, eg. toluene or a low-boiling hydrocarbon such as hsxans. If a solvent or diluent is used, a uniform distribution of C in the molding composition is quickly produced in some cases. In such a case the solvent or diluent is then removed by suitable measures, for example the employment of reduced pressure.
201(~7~7 - 7 - O.Z. 0050/40641 It may be mentioned that the molding compositions according to the present invention may also contain minor amount3 of reaction products of the components.
The molding compositions according to the present invention are highly ~uitable for producing moldings of any kind, for example by in~ection molding or extrusion.
They can also be used for producing sheets and semi-finished products for thermoforming or blow molding.
The molding compositions and the molded articles produced therefrom have a balanced ratio of thermal and mechanical properties. Among the~e, they po~sess good heat distortion resistance, multiaxial toughness, stress crack re~i~tance and color quality.
EXAMPLES 1 ~O 4 AND COMPARATIYE TESTS 2* AND 4*
The Examples and Comparative Tests were carried out using the following components:
Component A
A (1): Poly-2,6-dimethyl-1,4-phenylene ether having an intrinsic viscosity of 0.55 dl/g, measured in CHCl~ at 25 A (2)s same a~ A(1), except the relative viscosity is 0.65 dl/g.
Component B
B (1): High impact polystyrene 576 ~ (BASF) containing 8% by weight of butadiene and having a melt flow index of 5.5 g/10 min., measured by German Standard Specification DIN 53 735 at 200C under a load of 5 kg.
B 12): High impact polystyrene 586 G from BASF AG, containing 10% by weight of butadiene and having a molt flow index (200C/5 kg) of 4 g/10 min.
Component C
C (1): y-Aminopropyltrimethoxy~ilane C (2)s (((N'-~-Aminoethyl)-N-~-aminoethyl)-~-amino-propyl)trimathoxysilane C (3)s ~-Glycidyloxypropyltrimethoxysilane.
~he components indicated in Table 1 were each 201~7 - 8 - o.z. on50/4064 melted together with 0.08 kg of tris~nonylphenyl) phos-phite and 0.15 kg of polyethylene at 280~C in a 2-shaft extruder, homogenized, mixed and then granulated.
The parameters mentioned in Table 2 were deter-mined on te~t specimens in~ection molded at 280C as ollows:
the Vicat temperature Vicat B by German Standard Specifi-cation DIN 53 460;
the penetration energy PE by German Standard Specifica-tion DIN 53 443.
The stres~ crack resistance was determined byGerman Standard Specification DIN 53 449 Part 1 on test specimens immersed in isopropanol for one hour. The indication characteristics used were the tensile ~trength and the breaking extension as defined in German Standard Specification DIN 53 455.
Examples and M~oeup of the mDlding co~x~ition Co~x~ative Iype hnLunt [kg] ~ hK~nt [kg] Type h~nt [kg]
~8 _ 1 A~ 4.0 ~ 5.9 C~ 0.1 2 ~ 3.5 B2 6.3 C3 0.2 2* A2 3.5 E~ 6.3 - - )*
3 ~ 5.0 E~ 4.a5 C~ 0.15 4 A2 6.5 E~ 3.25 C~ 0.25 4* ~ 6.5 E~ 3.5 - -)* 2* contains 0.2 kg of aL ~ lfonate R30 fmnE~er AG
;201(~71~
- 9 - O. Z . 0050/40~41 -Exa~ple~ an~ Prop~tie~
Ca~arative Vicat B PE [Nm] Crack limit ~ [~
Test~ [C] Tensile str~gth E3realci~ ext~sion 132 40> 500 ~ 500 2 125 38> 500 > 500 2~ 122 32 400 -390 3 145 48> 500 ~ 500 4 157 65> 5CO > 500 4~ 152 12 90 80
Preference i~ given to compound-~ which contain no olefinic CC double bond.
Examples are the compounds having the structures indicated in the Table below. The Table also indicates the names used.
Nbme Str~Nre ~ lxql~Qyltrim~thoxysila~e ~(C~)3Si(OCH3)3 ~-AIl~qn~pyltriethoxysilane ~N(C~33Si(OC~)3 N-~-B~i~x~hyl-7_~1nqp~Qyl-trimE~xysilane H2N(C~ (C~)3Si(OCH3)3 ( ( (N'-,9-h~i~l)-N-~l~lli~ E~N(cH2)2NEl(cE~)2NH(cHz)3si(a~H3)3 ethyl)-~a~sop~Iyl)trimetho~y-silane 4,5-Dihy~1-[3-(triethoxysilyl)- ~ - C~
prcQyl]imic~ole l l N N - (C~)3Si(OE~)3 CH
~-~erc~pt~pyltrimethoxy~llane HS(C~)3Si(OCH3)3 ~-Glycidylo~xpyltri ~ - /0 silane c~-cH~o~o(o~)3si(ocH3)3 Such compound~ are commercially available, for example from H~ls Troisdorf AG under the name Dynasilan.
In addition to these essential components the molding compo~itions according to the present invention may contain as component D customary reinforcing materials such as glass ball~, mineral fibers, whiskers, aluminum oxide fibers, mica or in particular glasq fibers in amounts of from 10 to 40 parts by weight, based on 100 parts by weight of the total amount of component~ A, B
and C.
The glass fibers can be made of E-, A- or C-glas~. They may be ~ized with an adhe~ion promoter. Theirdiameter is in general within the range from 6 to 20 ~m.
~0107~7 ~ 6 - O.Z. 0050/40641 Xt i8 possible to use not only strandlike continuous fibers (rovings) but also chopped glass fibers from 1 to 10 mm, preferably from 3 to 6 mm, in length or ultrashort 511ass fibers from 0.05 to 1.5 mm in length.
In ~ome cases, it has proved advantageous to use no reinforcing materials D.
In addition to the components mentioned, the molding compositions according to the present invention may contain further substances such as customary heat and light stabilizer~, lubricants, mold release agent~ and colorants such as dyes and pigments in customary amounts.
Other possibilities are flame retardants, in particular phosphorus-containing ones, such a-q phosphoric esters, phosphinic esters and phosphine oxides. Good flame lS inhibition is achieved with triphenyl phosphate and triphenylphosphine oxide.
The thermopla3tic molding compositions according to the present invention are advantageously prepared by mixing the components at 200-320C, preferably 250-300C, in customary mixing apparatug, eg. kneaders, Banbury mixers and single-screw extruders, preferably in a twin-screw extruder. To obtain a very homogeneous molding composition, it is nece3sary to ensure thorough mixing, which can be achieved in a conventional manner. The residence times are in general within the range from 0.5 to 30 minutes, preferably from 1 to 5 minutes. The order of addition of the components can be varied; selected components can be premixed, or else all the components may be mixed together at one and the ~ame time.
Component C can be incorporated in the mixture with or without an inert solvent or diluent, eg. toluene or a low-boiling hydrocarbon such as hsxans. If a solvent or diluent is used, a uniform distribution of C in the molding composition is quickly produced in some cases. In such a case the solvent or diluent is then removed by suitable measures, for example the employment of reduced pressure.
201(~7~7 - 7 - O.Z. 0050/40641 It may be mentioned that the molding compositions according to the present invention may also contain minor amount3 of reaction products of the components.
The molding compositions according to the present invention are highly ~uitable for producing moldings of any kind, for example by in~ection molding or extrusion.
They can also be used for producing sheets and semi-finished products for thermoforming or blow molding.
The molding compositions and the molded articles produced therefrom have a balanced ratio of thermal and mechanical properties. Among the~e, they po~sess good heat distortion resistance, multiaxial toughness, stress crack re~i~tance and color quality.
EXAMPLES 1 ~O 4 AND COMPARATIYE TESTS 2* AND 4*
The Examples and Comparative Tests were carried out using the following components:
Component A
A (1): Poly-2,6-dimethyl-1,4-phenylene ether having an intrinsic viscosity of 0.55 dl/g, measured in CHCl~ at 25 A (2)s same a~ A(1), except the relative viscosity is 0.65 dl/g.
Component B
B (1): High impact polystyrene 576 ~ (BASF) containing 8% by weight of butadiene and having a melt flow index of 5.5 g/10 min., measured by German Standard Specification DIN 53 735 at 200C under a load of 5 kg.
B 12): High impact polystyrene 586 G from BASF AG, containing 10% by weight of butadiene and having a molt flow index (200C/5 kg) of 4 g/10 min.
Component C
C (1): y-Aminopropyltrimethoxy~ilane C (2)s (((N'-~-Aminoethyl)-N-~-aminoethyl)-~-amino-propyl)trimathoxysilane C (3)s ~-Glycidyloxypropyltrimethoxysilane.
~he components indicated in Table 1 were each 201~7 - 8 - o.z. on50/4064 melted together with 0.08 kg of tris~nonylphenyl) phos-phite and 0.15 kg of polyethylene at 280~C in a 2-shaft extruder, homogenized, mixed and then granulated.
The parameters mentioned in Table 2 were deter-mined on te~t specimens in~ection molded at 280C as ollows:
the Vicat temperature Vicat B by German Standard Specifi-cation DIN 53 460;
the penetration energy PE by German Standard Specifica-tion DIN 53 443.
The stres~ crack resistance was determined byGerman Standard Specification DIN 53 449 Part 1 on test specimens immersed in isopropanol for one hour. The indication characteristics used were the tensile ~trength and the breaking extension as defined in German Standard Specification DIN 53 455.
Examples and M~oeup of the mDlding co~x~ition Co~x~ative Iype hnLunt [kg] ~ hK~nt [kg] Type h~nt [kg]
~8 _ 1 A~ 4.0 ~ 5.9 C~ 0.1 2 ~ 3.5 B2 6.3 C3 0.2 2* A2 3.5 E~ 6.3 - - )*
3 ~ 5.0 E~ 4.a5 C~ 0.15 4 A2 6.5 E~ 3.25 C~ 0.25 4* ~ 6.5 E~ 3.5 - -)* 2* contains 0.2 kg of aL ~ lfonate R30 fmnE~er AG
;201(~71~
- 9 - O. Z . 0050/40~41 -Exa~ple~ an~ Prop~tie~
Ca~arative Vicat B PE [Nm] Crack limit ~ [~
Test~ [C] Tensile str~gth E3realci~ ext~sion 132 40> 500 ~ 500 2 125 38> 500 > 500 2~ 122 32 400 -390 3 145 48> 500 ~ 500 4 157 65> 5CO > 500 4~ 152 12 90 80
Claims (8)
1. A thermoplastic molding composition containing as essential components (A) 9.9-89.9% by weight of a polyphenylene ether, (B) 10-90% by weight of an aromatic vinyl polymer and (C) 0.1-5% by weight of a low molecular weight compound which contains at least one Si-O-C group and at least one epoxy, nitrogen-containing or sulfur-containing group.
2. A thermopla tic molding composition as claimed in claim 1, containing 19.9-79.9% by weight of A, 20-80% by weight of B and 0.1-4% by weight of C.
3. A thermoplastic molding composition as claimed in claim 1, wherein B is an impact modified grade.
4. A thermoplastic molding composition as claimed in claim 1, wherein C is a compound of the general formula I
I
where R1, R2 and R3 are each independently of the others alkyl, cycloalkyl or aralkyl of up to 20 carbon atoms, in particular methyl, ethyl, or propyl, X is a radical which contains a group containing a sulfur atom or preferably an epoxy group or a group containing a nitrogen atom, and n is an integer from 1 to 8.
I
where R1, R2 and R3 are each independently of the others alkyl, cycloalkyl or aralkyl of up to 20 carbon atoms, in particular methyl, ethyl, or propyl, X is a radical which contains a group containing a sulfur atom or preferably an epoxy group or a group containing a nitrogen atom, and n is an integer from 1 to 8.
5. A thermoplastic molding composition as claimed in claim 1, wherein C is .gamma.-aminopropyltrimethoxysilane.
6. A thermoplastic molding composition as claimed in claim 1, wherein C is (((N'-.beta.-aminoethyl)-N-.beta.-amino-ethyl)-.gamma.-aminopropyl)trimethoxysilane.
7. A thermoplastic molding composition as claimed in claim 1, wherein C is .gamma.-glycidyloxypropyltrimethoxy-silane.
- 11 - O.Z. 0050/40641
- 11 - O.Z. 0050/40641
8. A process for producing a thermoplastic molding composition as claimed in claim 1, which comprises mixing the components at 200-320°C in the course of 0.5-30 minutes.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE3907992A DE3907992A1 (en) | 1989-03-11 | 1989-03-11 | THERMOPLASTIC MOLDS BASED ON POLYPHENYLENETHER AND VINYLAROMATIC POLYMERS |
| DEP3907992.9 | 1989-03-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2010717A1 true CA2010717A1 (en) | 1990-09-11 |
Family
ID=6376154
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002010717A Abandoned CA2010717A1 (en) | 1989-03-11 | 1990-02-22 | Thermoplastic molding compositions based on polyphenylene ethers and aromatic vinyl polymers |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP0387592B1 (en) |
| JP (1) | JPH02274746A (en) |
| CA (1) | CA2010717A1 (en) |
| DE (2) | DE3907992A1 (en) |
| ES (1) | ES2062129T3 (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3118629A1 (en) * | 1981-05-11 | 1982-11-25 | Basf Ag, 6700 Ludwigshafen | Thermoplastic moulding compositions |
| DE3578980D1 (en) * | 1984-11-07 | 1990-09-06 | Gen Electric | SILANE DERIVATIVES FOR IMPROVING THE PROPERTIES OF POLYPHENYLENE OXIDE-POLYAMIDE COMPOSITIONS. |
-
1989
- 1989-03-11 DE DE3907992A patent/DE3907992A1/en not_active Withdrawn
-
1990
- 1990-02-22 CA CA002010717A patent/CA2010717A1/en not_active Abandoned
- 1990-02-26 EP EP90103755A patent/EP0387592B1/en not_active Expired - Lifetime
- 1990-02-26 ES ES90103755T patent/ES2062129T3/en not_active Expired - Lifetime
- 1990-02-26 DE DE90103755T patent/DE59004454D1/en not_active Expired - Fee Related
- 1990-03-08 JP JP2055193A patent/JPH02274746A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| DE3907992A1 (en) | 1990-09-13 |
| EP0387592B1 (en) | 1994-02-02 |
| ES2062129T3 (en) | 1994-12-16 |
| JPH02274746A (en) | 1990-11-08 |
| EP0387592A1 (en) | 1990-09-19 |
| DE59004454D1 (en) | 1994-03-17 |
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