CA1261482A - Boitier autonome pour circuits integres a transfert thermique - Google Patents

Boitier autonome pour circuits integres a transfert thermique

Info

Publication number
CA1261482A
CA1261482A CA000570055A CA570055A CA1261482A CA 1261482 A CA1261482 A CA 1261482A CA 000570055 A CA000570055 A CA 000570055A CA 570055 A CA570055 A CA 570055A CA 1261482 A CA1261482 A CA 1261482A
Authority
CA
Canada
Prior art keywords
generally
integrated circuit
carrier package
circuit carrier
vessal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA000570055A
Other languages
English (en)
Inventor
John J. Kost
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CA000570055A priority Critical patent/CA1261482A/fr
Application granted granted Critical
Publication of CA1261482A publication Critical patent/CA1261482A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CA000570055A 1988-06-22 1988-06-22 Boitier autonome pour circuits integres a transfert thermique Expired CA1261482A (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CA000570055A CA1261482A (fr) 1988-06-22 1988-06-22 Boitier autonome pour circuits integres a transfert thermique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CA000570055A CA1261482A (fr) 1988-06-22 1988-06-22 Boitier autonome pour circuits integres a transfert thermique

Publications (1)

Publication Number Publication Date
CA1261482A true CA1261482A (fr) 1989-09-26

Family

ID=4138249

Family Applications (1)

Application Number Title Priority Date Filing Date
CA000570055A Expired CA1261482A (fr) 1988-06-22 1988-06-22 Boitier autonome pour circuits integres a transfert thermique

Country Status (1)

Country Link
CA (1) CA1261482A (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0471552A1 (fr) * 1990-08-14 1992-02-19 Texas Instruments Incorporated Module de transport de chaleur pour des applications à très haute densité et à empaquetage silicium sur silicium
EP0510734A1 (fr) * 1991-02-20 1992-10-28 Akzo Nobel N.V. Corps d'échange de chaleur, en particulier pour le refroidissement d'un module semi-conducteur
EP0530002A1 (fr) * 1991-08-30 1993-03-03 Yamaichi Electronics Co., Ltd. Support de circuit intégré ou monture de circuit intégré
EP0865082A1 (fr) * 1995-11-28 1998-09-16 Hitachi, Ltd. Dispositif a semi-conducteur, procede de production de ce dispositif, et substrat encapsule
WO1999009594A1 (fr) * 1997-08-20 1999-02-25 Frank Baxmann Dissipateur de chaleur fritte
EP1263040A2 (fr) * 2001-06-01 2002-12-04 Delphi Technologies, Inc. Dissipateur de chaleur à haut prestation pour des dispositif électroniques

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0471552A1 (fr) * 1990-08-14 1992-02-19 Texas Instruments Incorporated Module de transport de chaleur pour des applications à très haute densité et à empaquetage silicium sur silicium
EP0510734A1 (fr) * 1991-02-20 1992-10-28 Akzo Nobel N.V. Corps d'échange de chaleur, en particulier pour le refroidissement d'un module semi-conducteur
EP0530002A1 (fr) * 1991-08-30 1993-03-03 Yamaichi Electronics Co., Ltd. Support de circuit intégré ou monture de circuit intégré
EP0865082A1 (fr) * 1995-11-28 1998-09-16 Hitachi, Ltd. Dispositif a semi-conducteur, procede de production de ce dispositif, et substrat encapsule
EP0865082A4 (fr) * 1995-11-28 1999-10-13 Hitachi Ltd Dispositif a semi-conducteur, procede de production de ce dispositif, et substrat encapsule
US6404049B1 (en) 1995-11-28 2002-06-11 Hitachi, Ltd. Semiconductor device, manufacturing method thereof and mounting board
US6563212B2 (en) 1995-11-28 2003-05-13 Hitachi, Ltd. Semiconductor device
US6621160B2 (en) 1995-11-28 2003-09-16 Hitachi, Ltd. Semiconductor device and mounting board
WO1999009594A1 (fr) * 1997-08-20 1999-02-25 Frank Baxmann Dissipateur de chaleur fritte
EP1263040A2 (fr) * 2001-06-01 2002-12-04 Delphi Technologies, Inc. Dissipateur de chaleur à haut prestation pour des dispositif électroniques
EP1263040A3 (fr) * 2001-06-01 2005-05-25 Delphi Technologies, Inc. Dissipateur de chaleur à haut prestation pour des dispositif électroniques

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Legal Events

Date Code Title Description
MKEX Expiry