CA1239115B - Sputtering apparatus and method - Google Patents
Sputtering apparatus and methodInfo
- Publication number
- CA1239115B CA1239115B CA000550621A CA550621A CA1239115B CA 1239115 B CA1239115 B CA 1239115B CA 000550621 A CA000550621 A CA 000550621A CA 550621 A CA550621 A CA 550621A CA 1239115 B CA1239115 B CA 1239115B
- Authority
- CA
- Canada
- Prior art keywords
- sputtering apparatus
- cathode target
- workpiece
- deposit
- vicinity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
An apparatus and method is described for the magnetron sputtering onto a workpiece to deposit a thin metallic film. A rotating magnetic field is provided in the vicinity of the cathode target to produce higher yield from a given cathode target.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CA 550621 CA1239115A (en) | 1987-10-29 | 1987-10-29 | Sputtering apparatus and method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CA 550621 CA1239115A (en) | 1987-10-29 | 1987-10-29 | Sputtering apparatus and method |
Publications (2)
Publication Number | Publication Date |
---|---|
CA1239115B true CA1239115B (en) | |
CA1239115A CA1239115A (en) | 1988-07-12 |
Family
ID=4136752
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA 550621 Expired CA1239115A (en) | 1987-10-29 | 1987-10-29 | Sputtering apparatus and method |
Country Status (1)
Country | Link |
---|---|
CA (1) | CA1239115A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2926161A1 (en) * | 2008-01-04 | 2009-07-10 | Horiba Jobin Yvon Sas Soc Par | SOURCE MAGNETRON FOR SPECTROMETER WITH LUMINESCENT DISCHARGE. |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5320728A (en) * | 1990-03-30 | 1994-06-14 | Applied Materials, Inc. | Planar magnetron sputtering source producing improved coating thickness uniformity, step coverage and step coverage uniformity |
US5108574A (en) * | 1991-01-29 | 1992-04-28 | The Boc Group, Inc. | Cylindrical magnetron shield structure |
CN113025978A (en) * | 2021-02-26 | 2021-06-25 | 张鹏成 | Magnetron sputtering coating device |
-
1987
- 1987-10-29 CA CA 550621 patent/CA1239115A/en not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2926161A1 (en) * | 2008-01-04 | 2009-07-10 | Horiba Jobin Yvon Sas Soc Par | SOURCE MAGNETRON FOR SPECTROMETER WITH LUMINESCENT DISCHARGE. |
WO2009130424A1 (en) * | 2008-01-04 | 2009-10-29 | Horiba Jobin Yvon Sas | Magnetron source for a glow discharge spectrometer |
Also Published As
Publication number | Publication date |
---|---|
CA1239115A (en) | 1988-07-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
NARE | Reissued | ||
MKEC | Expiry (correction) | ||
MKEX | Expiry |